AU2001239866A1 - Integrated circuit interconnect system - Google Patents

Integrated circuit interconnect system

Info

Publication number
AU2001239866A1
AU2001239866A1 AU2001239866A AU3986601A AU2001239866A1 AU 2001239866 A1 AU2001239866 A1 AU 2001239866A1 AU 2001239866 A AU2001239866 A AU 2001239866A AU 3986601 A AU3986601 A AU 3986601A AU 2001239866 A1 AU2001239866 A1 AU 2001239866A1
Authority
AU
Australia
Prior art keywords
integrated circuit
interconnect system
circuit interconnect
integrated
interconnect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001239866A
Inventor
Charles A. Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/510,657 external-priority patent/US6459343B1/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of AU2001239866A1 publication Critical patent/AU2001239866A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
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    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
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    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
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    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Filters And Equalizers (AREA)
  • Semiconductor Integrated Circuits (AREA)
AU2001239866A 2000-02-22 2001-02-21 Integrated circuit interconnect system Abandoned AU2001239866A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09510657 2000-02-22
US09/510,657 US6459343B1 (en) 1999-02-25 2000-02-22 Integrated circuit interconnect system forming a multi-pole filter
PCT/US2001/005970 WO2001063672A2 (en) 2000-02-22 2001-02-21 Integrated circuit interconnect system having matched impedance and capacitance

Publications (1)

Publication Number Publication Date
AU2001239866A1 true AU2001239866A1 (en) 2001-09-03

Family

ID=24031631

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001239866A Abandoned AU2001239866A1 (en) 2000-02-22 2001-02-21 Integrated circuit interconnect system

Country Status (3)

Country Link
AU (1) AU2001239866A1 (en)
TW (1) TW503519B (en)
WO (1) WO2001063672A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6953980B2 (en) * 2002-06-11 2005-10-11 Semiconductor Components Industries, Llc Semiconductor filter circuit and method
US10128229B1 (en) * 2017-11-13 2018-11-13 Micron Technology, Inc. Semiconductor devices with package-level configurability

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5536906A (en) * 1993-07-23 1996-07-16 Texas Instruments Incorporated Package for integrated circuits
US5901022A (en) * 1997-02-24 1999-05-04 Industrial Technology Research Inst. Charged device mode ESD protection circuit
WO1998047190A1 (en) * 1997-04-16 1998-10-22 The Board Of Trustees Of The Leland Stanford Junior University Distributed esd protection device for high speed integrated circuits

Also Published As

Publication number Publication date
TW503519B (en) 2002-09-21
WO2001063672A2 (en) 2001-08-30
WO2001063672A3 (en) 2002-04-18

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