AU2002236589A1 - Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles - Google Patents

Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles

Info

Publication number
AU2002236589A1
AU2002236589A1 AU2002236589A AU3658902A AU2002236589A1 AU 2002236589 A1 AU2002236589 A1 AU 2002236589A1 AU 2002236589 A AU2002236589 A AU 2002236589A AU 3658902 A AU3658902 A AU 3658902A AU 2002236589 A1 AU2002236589 A1 AU 2002236589A1
Authority
AU
Australia
Prior art keywords
microelectronic
substrates
microelectronic substrates
oriented relative
acute angles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002236589A
Inventor
Glenn A. Rinne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitive Electronics Inc
Original Assignee
Unitive Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitive Electronics Inc filed Critical Unitive Electronics Inc
Publication of AU2002236589A1 publication Critical patent/AU2002236589A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0652—Bump or bump-like direct electrical connections from substrate to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06551—Conductive connections on the side of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
AU2002236589A 2000-11-16 2001-11-07 Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles Abandoned AU2002236589A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/714,311 2000-11-16
US09/714,311 US6418033B1 (en) 2000-11-16 2000-11-16 Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles
PCT/US2001/047372 WO2002041398A2 (en) 2000-11-16 2001-11-07 Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles

Publications (1)

Publication Number Publication Date
AU2002236589A1 true AU2002236589A1 (en) 2002-05-27

Family

ID=24869523

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002236589A Abandoned AU2002236589A1 (en) 2000-11-16 2001-11-07 Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles

Country Status (5)

Country Link
US (1) US6418033B1 (en)
AU (1) AU2002236589A1 (en)
MY (1) MY126102A (en)
TW (1) TW519741B (en)
WO (1) WO2002041398A2 (en)

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* Cited by examiner, † Cited by third party
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US20010042910A1 (en) * 2000-01-06 2001-11-22 Eng Klan Teng Vertical ball grid array integrated circuit package
JP2002204053A (en) * 2001-01-04 2002-07-19 Mitsubishi Electric Corp Method and apparatus for mounting circuit as well as semiconductor device
US6734538B1 (en) * 2001-04-12 2004-05-11 Bae Systems Information & Electronic Systems Integration, Inc. Article comprising a multi-layer electronic package and method therefor
US7007835B2 (en) * 2001-05-21 2006-03-07 Jds Uniphase Corporation Solder bonding technique for assembling a tilted chip or substrate
US6635960B2 (en) * 2001-08-30 2003-10-21 Micron Technology, Inc. Angled edge connections for multichip structures
DE10203112B4 (en) * 2002-01-25 2005-03-10 Infineon Technologies Ag Method for improving the quality of solder joints
WO2004001837A2 (en) * 2002-06-25 2003-12-31 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7547623B2 (en) * 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
EP1471778A1 (en) * 2003-04-24 2004-10-27 Infineon Technologies AG Memory module having space-saving arrangement of memory chips and memory chip therefor
US7049216B2 (en) * 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US20060205170A1 (en) * 2005-03-09 2006-09-14 Rinne Glenn A Methods of forming self-healing metal-insulator-metal (MIM) structures and related devices
SG130055A1 (en) 2005-08-19 2007-03-20 Micron Technology Inc Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
SG130066A1 (en) * 2005-08-26 2007-03-20 Micron Technology Inc Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7566866B2 (en) * 2007-09-10 2009-07-28 Gennum Corporation Systems and methods for a tilted optical receiver assembly
US8476749B2 (en) * 2009-07-22 2013-07-02 Oracle America, Inc. High-bandwidth ramp-stack chip package
GB0912981D0 (en) * 2009-07-27 2009-09-02 St Microelectronics Res & Dev Imaging system and method
KR20120005341A (en) * 2010-07-08 2012-01-16 주식회사 하이닉스반도체 Semiconductor chip and package
US8971676B1 (en) * 2013-10-07 2015-03-03 Oracle International Corporation Hybrid-integrated photonic chip package
DE102015108909B4 (en) * 2015-06-05 2021-02-18 Infineon Technologies Ag Arrangement of several power semiconductor chips and method for producing the same
US9825002B2 (en) * 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board

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Publication number Priority date Publication date Assignee Title
US4266282A (en) 1979-03-12 1981-05-05 International Business Machines Corporation Vertical semiconductor integrated circuit chip packaging
JPS6399558A (en) 1986-10-15 1988-04-30 Mitsubishi Electric Corp Semiconductor device
JP2509969B2 (en) * 1988-02-26 1996-06-26 株式会社日立製作所 Electronic equipment
US5227664A (en) * 1988-02-26 1993-07-13 Hitachi, Ltd. Semiconductor device having particular mounting arrangement
US5019943A (en) * 1990-02-14 1991-05-28 Unisys Corporation High density chip stack having a zigzag-shaped face which accommodates connections between chips
US5239447A (en) * 1991-09-13 1993-08-24 International Business Machines Corporation Stepped electronic device package
US5313097A (en) * 1992-11-16 1994-05-17 International Business Machines, Corp. High density memory module
US5347428A (en) 1992-12-03 1994-09-13 Irvine Sensors Corporation Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
EP0695494B1 (en) 1993-04-23 2001-02-14 Irvine Sensors Corporation Electronic module comprising a stack of ic chips
AU5316996A (en) 1995-04-05 1996-10-23 Mcnc A solder bump structure for a microelectronic substrate
US5793116A (en) 1996-05-29 1998-08-11 Mcnc Microelectronic packaging using arched solder columns
JPH10335580A (en) * 1997-06-02 1998-12-18 Mitsubishi Electric Corp Semiconductor package and semiconductor module using it
US5990472A (en) 1997-09-29 1999-11-23 Mcnc Microelectronic radiation detectors for detecting and emitting radiation signals
JP3718039B2 (en) * 1997-12-17 2005-11-16 株式会社日立製作所 Semiconductor device and electronic device using the same
US6134120A (en) * 1998-09-04 2000-10-17 American Standard Inc. Low profile circuit board mounting arrangement
DE10034081A1 (en) * 2000-07-13 2001-10-18 Infineon Technologies Ag Semiconducting component has semiconducting chips mounted on bearer substrate at angle to main surface of substrate so only lateral edge of each chip is in direct contact with substrate

Also Published As

Publication number Publication date
WO2002041398A9 (en) 2003-10-02
MY126102A (en) 2006-09-29
TW519741B (en) 2003-02-01
WO2002041398A3 (en) 2003-04-10
WO2002041398A2 (en) 2002-05-23
US6418033B1 (en) 2002-07-09

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