AU2002235134A1 - Method for adjusting rapid thermal processing (rtp) recipe setpoints based on wafer electrical test (wet) parameters - Google Patents

Method for adjusting rapid thermal processing (rtp) recipe setpoints based on wafer electrical test (wet) parameters

Info

Publication number
AU2002235134A1
AU2002235134A1 AU2002235134A AU3513402A AU2002235134A1 AU 2002235134 A1 AU2002235134 A1 AU 2002235134A1 AU 2002235134 A AU2002235134 A AU 2002235134A AU 3513402 A AU3513402 A AU 3513402A AU 2002235134 A1 AU2002235134 A1 AU 2002235134A1
Authority
AU
Australia
Prior art keywords
rtp
wet
parameters
rapid thermal
thermal processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002235134A
Inventor
William Jarrett Campbell
Terrence J. Riley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2002235134A1 publication Critical patent/AU2002235134A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU2002235134A 2000-12-06 2001-11-06 Method for adjusting rapid thermal processing (rtp) recipe setpoints based on wafer electrical test (wet) parameters Abandoned AU2002235134A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/731,579 2000-12-06
US09/731,579 US6856849B2 (en) 2000-12-06 2000-12-06 Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters
PCT/US2001/044112 WO2002047150A2 (en) 2000-12-06 2001-11-06 Method for adjusting rapid thermal processing (rtp) recipe setpoints based on wafer electrical test (wet) parameters

Publications (1)

Publication Number Publication Date
AU2002235134A1 true AU2002235134A1 (en) 2002-06-18

Family

ID=24940108

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002235134A Abandoned AU2002235134A1 (en) 2000-12-06 2001-11-06 Method for adjusting rapid thermal processing (rtp) recipe setpoints based on wafer electrical test (wet) parameters

Country Status (3)

Country Link
US (1) US6856849B2 (en)
AU (1) AU2002235134A1 (en)
WO (1) WO2002047150A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7844747B2 (en) * 2002-06-05 2010-11-30 Stmicroelectronics, Inc. Performance tuning using encoded performance parameter information
US6773931B2 (en) * 2002-07-29 2004-08-10 Advanced Micro Devices, Inc. Dynamic targeting for a process control system
US6925347B1 (en) * 2002-08-19 2005-08-02 Advanced Micro Devices, Inc. Process control based on an estimated process result
DE102004009516B4 (en) * 2004-02-27 2010-04-22 Advanced Micro Devices, Inc., Sunnyvale Method and system for controlling a product parameter of a circuit element
US7751908B2 (en) * 2004-12-02 2010-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for thermal process control
US7657339B1 (en) * 2005-10-14 2010-02-02 GlobalFoundries, Inc. Product-related feedback for process control
US7313450B1 (en) * 2006-06-14 2007-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Automatic methods and systems for manufacturing recipe feedback control
US20080172189A1 (en) * 2007-01-16 2008-07-17 Daniel Kadosh Determining Die Health by Expanding Electrical Test Data to Represent Untested Die
US8190391B2 (en) * 2007-03-29 2012-05-29 Globalfoundries Inc. Determining die performance by incorporating neighboring die performance metrics
US20080262769A1 (en) * 2007-04-23 2008-10-23 Daniel Kadosh Using multivariate health metrics to determine market segment and testing requirements
US8041518B2 (en) * 2007-05-08 2011-10-18 Globalfoundries Inc. Determining die test protocols based on process health
KR101061368B1 (en) 2009-04-16 2011-09-01 서강대학교산학협력단 Delta type I / O state space model recognition system and model recognition method
US8679863B2 (en) * 2012-03-15 2014-03-25 International Business Machines Corporation Fine tuning highly resistive substrate resistivity and structures thereof
JP6647931B2 (en) * 2016-03-16 2020-02-14 株式会社Kelk Semiconductor wafer temperature control device and semiconductor wafer temperature control method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891499A (en) * 1988-09-09 1990-01-02 Texas Instruments Incorporated Method and apparatus for real-time wafer temperature uniformity control and slip-free heating in lamp heated single-wafer rapid thermal processing systems
US5029117A (en) * 1989-04-24 1991-07-02 Tektronix, Inc. Method and apparatus for active pyrometry
US5226732A (en) * 1992-04-17 1993-07-13 International Business Machines Corporation Emissivity independent temperature measurement systems
US5410162A (en) * 1993-10-15 1995-04-25 Texas Instruments Incorporated Apparatus for and method of rapid testing of semiconductor components at elevated temperature
US5660472A (en) 1994-12-19 1997-08-26 Applied Materials, Inc. Method and apparatus for measuring substrate temperatures
US5991699A (en) 1995-05-04 1999-11-23 Kla Instruments Corporation Detecting groups of defects in semiconductor feature space
US5761481A (en) * 1995-05-04 1998-06-02 Advanced Micro Devices, Inc. Semiconductor simulator tool for experimental N-channel transistor modeling
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
US6055460A (en) 1997-08-06 2000-04-25 Advanced Micro Devices, Inc. Semiconductor process compensation utilizing non-uniform ion implantation methodology
JP3739201B2 (en) * 1998-03-06 2006-01-25 富士通株式会社 Semiconductor chip correlation analysis method and apparatus, semiconductor chip yield adjustment method, and storage medium
US6028994A (en) 1998-05-06 2000-02-22 Advanced Micro Devices Method for predicting performance of microelectronic device based on electrical parameter test data using computer model
US6337218B1 (en) * 1999-05-28 2002-01-08 International Business Machines Corporation Method to test devices on high performance ULSI wafers
US6184048B1 (en) * 1999-11-03 2001-02-06 Texas Instruments Incorporated Testing method and apparatus assuring semiconductor device quality and reliability

Also Published As

Publication number Publication date
WO2002047150A2 (en) 2002-06-13
WO2002047150A3 (en) 2002-11-28
US20020095278A1 (en) 2002-07-18
US6856849B2 (en) 2005-02-15

Similar Documents

Publication Publication Date Title
AU2002235134A1 (en) Method for adjusting rapid thermal processing (rtp) recipe setpoints based on wafer electrical test (wet) parameters
AU2001267703A1 (en) Apparatus and method for investigating semiconductor wafers
AU2003264511A1 (en) Method for forming insulating film on substrate, method for manufacturing semiconductor device and substrate-processing apparatus
AU2003218285A1 (en) Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
AU2001296338A1 (en) Gas distribution apparatus for semiconductor processing
SG118084A1 (en) Method and apparatus for cutting semiconductor wafers
AU5537098A (en) Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
AU3308699A (en) Apparatus and method for cleaning semiconductor wafers
AU2003253874A1 (en) Method and apparatus for supporting semiconductor wafers
AU4183300A (en) Method and apparatus for forming an electrical contact with a semiconductor substrate
AU2002353481A1 (en) Method and apparatus for measuring stress in semiconductor wafers
AU4432899A (en) Semiconductor wafer evaluating apparatus and method
AU2003292678A1 (en) Plasma generator, ozone generator, substrate processing apparatus, and method for manufacturing semiconductor device
AU2002368383A1 (en) Electric heater for semiconductor processing apparatus
AU2001270277A1 (en) Apparatus and methods for semiconductor wafer processing equipment
AU2001282326A1 (en) An apparatus for the backside gas cooling of a wafer in a batch ion implantationsystem
EP1129362A4 (en) Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing
AU2003279033A1 (en) Method for reducing wafer arcing
WO2002003432A3 (en) Process for etching silicon wafers
AU2003212469A1 (en) Method for processing multiple semiconductor devices for test
AU2001292880A1 (en) Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers
AU2003292147A1 (en) Method for determining the temperature of a semiconductor wafer in a rapid thermal processing system
AU2001230409A1 (en) A method and apparatus for implanting semiconductor wafer substrates
AU2002366146A1 (en) Apparatus for molding a semiconductor wafer and process therefor
AU2002212587A1 (en) Wafer processing equipment and method for processing wafers