AU2002231656A1 - Assembly comprising a plurality of mask containers - Google Patents

Assembly comprising a plurality of mask containers

Info

Publication number
AU2002231656A1
AU2002231656A1 AU2002231656A AU3165602A AU2002231656A1 AU 2002231656 A1 AU2002231656 A1 AU 2002231656A1 AU 2002231656 A AU2002231656 A AU 2002231656A AU 3165602 A AU3165602 A AU 3165602A AU 2002231656 A1 AU2002231656 A1 AU 2002231656A1
Authority
AU
Australia
Prior art keywords
assembly
mask containers
containers
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002231656A
Other languages
English (en)
Inventor
Alain Charles
Karl Mautz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2002231656A1 publication Critical patent/AU2002231656A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Library & Information Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
AU2002231656A 2000-12-04 2001-12-03 Assembly comprising a plurality of mask containers Abandoned AU2002231656A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09729636 2000-12-04
US09/729,636 US6895294B2 (en) 2000-12-04 2000-12-04 Assembly comprising a plurality of mask containers, manufacturing system for manufacturing semiconductor devices, and method
PCT/EP2001/014263 WO2002046842A1 (fr) 2000-12-04 2001-12-03 Ensemble comprenant une pluralite de contenants masques

Publications (1)

Publication Number Publication Date
AU2002231656A1 true AU2002231656A1 (en) 2002-06-18

Family

ID=24931931

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002231656A Abandoned AU2002231656A1 (en) 2000-12-04 2001-12-03 Assembly comprising a plurality of mask containers

Country Status (7)

Country Link
US (1) US6895294B2 (fr)
EP (1) EP1342130A1 (fr)
JP (1) JP2004515913A (fr)
KR (1) KR20030082552A (fr)
AU (1) AU2002231656A1 (fr)
TW (1) TW533472B (fr)
WO (1) WO2002046842A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7270274B2 (en) 1999-10-04 2007-09-18 Hand Held Products, Inc. Imaging module comprising support post for optical reader
US7477959B2 (en) * 2002-06-26 2009-01-13 Taiwan Semiconductor Manufacturing Co., Ltd. Photoresist system
US7326945B2 (en) * 2003-09-11 2008-02-05 Intel Corporation Dose transfer standard detector for a lithography tool
JP2006173273A (ja) * 2004-12-14 2006-06-29 Miraial Kk レチクル搬送容器
JP5707793B2 (ja) * 2010-09-08 2015-04-30 株式会社ニコン 基板貼り合せ装置、基板貼り合せ方法および積層半導体装置製造方法
EP2839052A4 (fr) 2012-04-19 2015-06-10 Intevac Inc Agencement à double masque pour fabrication de cellule solaire
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
EP2852469B1 (fr) 2012-04-26 2019-04-24 Intevac, Inc. Architecture de système de traitement sous vide
USD737822S1 (en) * 2014-03-10 2015-09-01 Datalogic Ip Tech S.R.L. Optical module
US9543114B2 (en) 2014-08-05 2017-01-10 Intevac, Inc. Implant masking and alignment system with rollers
US9989585B2 (en) 2015-08-27 2018-06-05 Silicon Laboratories Inc. Horizontal infrastructure handling for integrated circuit devices
NL2021084B1 (en) 2017-06-15 2019-03-27 Asml Netherlands Bv Pellicle and Pellicle Assembly
US11302546B2 (en) * 2018-07-30 2022-04-12 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor process system and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166884A (en) * 1984-12-24 1992-11-24 Asyst Technologies, Inc. Intelligent system for processing and storing articles
DE69205570T2 (de) 1992-08-04 1996-06-13 Ibm Verteilungseinrichtung mit Gaszufuhr-Abgabevorrichtung zum Handhaben und Speichern von abdichtbaren tragbaren unter Druck stehenden Behältern.
US6579052B1 (en) * 1997-07-11 2003-06-17 Asyst Technologies, Inc. SMIF pod storage, delivery and retrieval system
JP3774836B2 (ja) * 1997-10-03 2006-05-17 沖電気工業株式会社 ロットの搬送システム及びロットの搬送方法
JP3370279B2 (ja) 1998-07-07 2003-01-27 信越ポリマー株式会社 精密基板収納容器
US6481558B1 (en) * 1998-12-18 2002-11-19 Asyst Technologies, Inc. Integrated load port-conveyor transfer system
US6216873B1 (en) 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
US6662950B1 (en) * 1999-10-25 2003-12-16 Brian R. Cleaver Wafer shipping and storage container

Also Published As

Publication number Publication date
JP2004515913A (ja) 2004-05-27
US6895294B2 (en) 2005-05-17
TW533472B (en) 2003-05-21
US20030074097A1 (en) 2003-04-17
WO2002046842A1 (fr) 2002-06-13
EP1342130A1 (fr) 2003-09-10
KR20030082552A (ko) 2003-10-22

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