AU2002222596A1 - Position measuring method, exposure method and system thereof, device productionmethod - Google Patents

Position measuring method, exposure method and system thereof, device productionmethod

Info

Publication number
AU2002222596A1
AU2002222596A1 AU2002222596A AU2259602A AU2002222596A1 AU 2002222596 A1 AU2002222596 A1 AU 2002222596A1 AU 2002222596 A AU2002222596 A AU 2002222596A AU 2259602 A AU2259602 A AU 2259602A AU 2002222596 A1 AU2002222596 A1 AU 2002222596A1
Authority
AU
Australia
Prior art keywords
productionmethod
position measuring
measuring method
exposure method
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002222596A
Inventor
Akira Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2002222596A1 publication Critical patent/AU2002222596A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AU2002222596A 2000-12-11 2001-12-10 Position measuring method, exposure method and system thereof, device productionmethod Abandoned AU2002222596A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-375798 2000-12-11
JP2000375798 2000-12-11
PCT/JP2001/010781 WO2002049083A1 (en) 2000-12-11 2001-12-10 Position measuring method, exposure method and system thereof, device production method

Publications (1)

Publication Number Publication Date
AU2002222596A1 true AU2002222596A1 (en) 2002-06-24

Family

ID=18844758

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002222596A Abandoned AU2002222596A1 (en) 2000-12-11 2001-12-10 Position measuring method, exposure method and system thereof, device productionmethod

Country Status (4)

Country Link
US (1) US20040027573A1 (en)
JP (1) JPWO2002049083A1 (en)
AU (1) AU2002222596A1 (en)
WO (1) WO2002049083A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4345098B2 (en) * 2001-02-06 2009-10-14 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
JP2005303196A (en) * 2004-04-15 2005-10-27 Canon Inc Positioning device, aligner, and manufacturing method of semiconductor device
JP4590213B2 (en) * 2004-06-03 2010-12-01 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP2006098726A (en) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd Correction method of alignment unit, drawing apparatus capable of correcting alignment, and carrying device
CN113534626A (en) * 2020-04-14 2021-10-22 中国科学院微电子研究所 Marking system and measuring method for overlay precision measurement
US11982937B2 (en) * 2020-05-14 2024-05-14 Gudeng Precision Industrial Co., Ltd. Reticle pod provided with optically identifiable marks and method for identifying the same
TWI775273B (en) * 2020-05-14 2022-08-21 家登精密工業股份有限公司 Reticle pod provided with optically identifiable marks and method for identifying the same
JP2022166688A (en) * 2021-04-21 2022-11-02 キヤノン株式会社 Processing system, processing method, measurement device, substrate processing device and manufacturing method of article

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4650983A (en) * 1983-11-07 1987-03-17 Nippon Kogaku K. K. Focusing apparatus for projection optical system
JP2550974B2 (en) * 1987-03-13 1996-11-06 株式会社ニコン Exposure equipment
US4952815A (en) * 1988-04-14 1990-08-28 Nikon Corporation Focusing device for projection exposure apparatus
JPH04165363A (en) * 1990-10-30 1992-06-11 Nikon Corp Position detecting device for opaque mark formed on transparent base plate
US5615006A (en) * 1992-10-02 1997-03-25 Nikon Corporation Imaging characteristic and asymetric abrerration measurement of projection optical system
JP3295244B2 (en) * 1994-09-12 2002-06-24 キヤノン株式会社 Positioning device

Also Published As

Publication number Publication date
JPWO2002049083A1 (en) 2004-04-15
US20040027573A1 (en) 2004-02-12
WO2002049083A1 (en) 2002-06-20

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