AU2002220821A1 - Enhanced interface thermoelectric coolers - Google Patents

Enhanced interface thermoelectric coolers

Info

Publication number
AU2002220821A1
AU2002220821A1 AU2002220821A AU2082102A AU2002220821A1 AU 2002220821 A1 AU2002220821 A1 AU 2002220821A1 AU 2002220821 A AU2002220821 A AU 2002220821A AU 2082102 A AU2082102 A AU 2082102A AU 2002220821 A1 AU2002220821 A1 AU 2002220821A1
Authority
AU
Australia
Prior art keywords
thermoelectric coolers
enhanced interface
interface thermoelectric
enhanced
coolers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002220821A
Other languages
English (en)
Inventor
Errol Wayne Robinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of AU2002220821A1 publication Critical patent/AU2002220821A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
AU2002220821A 2000-12-07 2001-11-23 Enhanced interface thermoelectric coolers Abandoned AU2002220821A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/731,616 2000-12-07
US09/731,616 US6403876B1 (en) 2000-12-07 2000-12-07 Enhanced interface thermoelectric coolers with all-metal tips
PCT/GB2001/005188 WO2002047176A2 (en) 2000-12-07 2001-11-23 Enhanced interface thermoelectric coolers

Publications (1)

Publication Number Publication Date
AU2002220821A1 true AU2002220821A1 (en) 2002-06-18

Family

ID=24940257

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002220821A Abandoned AU2002220821A1 (en) 2000-12-07 2001-11-23 Enhanced interface thermoelectric coolers

Country Status (10)

Country Link
US (2) US6403876B1 (ko)
EP (1) EP1340266A2 (ko)
JP (1) JP4289658B2 (ko)
KR (1) KR100558800B1 (ko)
CN (1) CN100345318C (ko)
AU (1) AU2002220821A1 (ko)
CA (1) CA2427426C (ko)
IL (1) IL156320A0 (ko)
TW (1) TW565960B (ko)
WO (1) WO2002047176A2 (ko)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6505468B2 (en) 2000-03-21 2003-01-14 Research Triangle Institute Cascade cryogenic thermoelectric cooler for cryogenic and room temperature applications
WO2002081981A2 (en) * 2001-04-09 2002-10-17 Research Triangle Institute Thermoelectric device for dna genomic and proteonic chips and thermo-optical seitching circuits
EP1433208A4 (en) * 2001-10-05 2008-02-20 Nextreme Thermal Solutions Inc LOW-DIMENSIONAL STRUCTURES, ELECTRON EMITTERS AND PHONES BLOCKERS
US6712258B2 (en) * 2001-12-13 2004-03-30 International Business Machines Corporation Integrated quantum cold point coolers
US20040018729A1 (en) * 2002-02-11 2004-01-29 Ghoshal Uttam Shyamalindu Enhanced interface thermoelectric coolers with all-metal tips
KR20050000514A (ko) * 2002-04-15 2005-01-05 리써치 트라이앵글 인스티튜트 양면 펠티어 접합을 이용하는 열전 장치 및 그 열전장치의 제조 방법
US20050016575A1 (en) * 2003-06-13 2005-01-27 Nalin Kumar Field emission based thermoelectric device
JP2007515364A (ja) * 2003-10-16 2007-06-14 ザ ユニバーシティ オブ アクロン カーボンナノファイバ基板上のカーボンナノチューブ
US20100257871A1 (en) * 2003-12-11 2010-10-14 Rama Venkatasubramanian Thin film thermoelectric devices for power conversion and cooling
US7638705B2 (en) * 2003-12-11 2009-12-29 Nextreme Thermal Solutions, Inc. Thermoelectric generators for solar conversion and related systems and methods
US20050150536A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
US20050150539A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150535A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a thin-film thermoelectric device including a phonon-blocking thermal conductor
US20050160752A1 (en) * 2004-01-23 2005-07-28 Nanocoolers, Inc. Apparatus and methodology for cooling of high power density devices by electrically conducting fluids
US7508110B2 (en) * 2004-05-04 2009-03-24 Massachusetts Institute Of Technology Surface plasmon coupled nonequilibrium thermoelectric devices
US7305839B2 (en) * 2004-06-30 2007-12-11 General Electric Company Thermal transfer device and system and method incorporating same
US20060048809A1 (en) * 2004-09-09 2006-03-09 Onvural O R Thermoelectric devices with controlled current flow and related methods
US20060068611A1 (en) * 2004-09-30 2006-03-30 Weaver Stanton E Jr Heat transfer device and system and method incorporating same
US20060076046A1 (en) * 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US8063298B2 (en) * 2004-10-22 2011-11-22 Nextreme Thermal Solutions, Inc. Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields
US7523617B2 (en) 2004-10-22 2009-04-28 Nextreme Thermal Solutions, Inc. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
US20060090787A1 (en) * 2004-10-28 2006-05-04 Onvural O R Thermoelectric alternators and thermoelectric climate control devices with controlled current flow for motor vehicles
US7260939B2 (en) * 2004-12-17 2007-08-28 General Electric Company Thermal transfer device and system and method incorporating same
US7475551B2 (en) 2004-12-23 2009-01-13 Nanocoolers, Inc. System employing temporal integration of thermoelectric action
US7296417B2 (en) * 2004-12-23 2007-11-20 Nanocoolers, Inc. Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator
US7293416B2 (en) * 2004-12-23 2007-11-13 Nanocoolers, Inc. Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle
US7498507B2 (en) 2005-03-16 2009-03-03 General Electric Company Device for solid state thermal transfer and power generation
US20070028956A1 (en) * 2005-04-12 2007-02-08 Rama Venkatasubramanian Methods of forming thermoelectric devices including superlattice structures of alternating layers with heterogeneous periods and related devices
WO2007002337A2 (en) 2005-06-22 2007-01-04 Nextreme Thermal Solutions Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures
WO2007002342A2 (en) * 2005-06-22 2007-01-04 Nextreme Thermal Solutions Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures
US20070101737A1 (en) * 2005-11-09 2007-05-10 Masao Akei Refrigeration system including thermoelectric heat recovery and actuation
US20070137687A1 (en) * 2005-12-15 2007-06-21 The Boeing Company Thermoelectric tunnelling device
US7679203B2 (en) * 2006-03-03 2010-03-16 Nextreme Thermal Solutions, Inc. Methods of forming thermoelectric devices using islands of thermoelectric material and related structures
US8018053B2 (en) * 2008-01-31 2011-09-13 Northrop Grumman Systems Corporation Heat transfer device
CN101965490B (zh) 2008-03-05 2013-09-11 史泰克公司 用于流体的开关热电冷却的方法和设备
US20110000224A1 (en) * 2008-03-19 2011-01-06 Uttam Ghoshal Metal-core thermoelectric cooling and power generation device
US9373771B2 (en) * 2008-12-04 2016-06-21 Sheetak Inc. Enhanced metal-core thermoelectric cooling and power generation device
IN2012DN01366A (ko) 2009-07-17 2015-06-05 Sheetak Inc
US9601677B2 (en) * 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
KR101108191B1 (ko) * 2010-05-24 2012-02-06 에스비리모티브 주식회사 배터리 팩
FR2963165A1 (fr) * 2010-07-22 2012-01-27 St Microelectronics Crolles 2 Procede de generation d'energie electrique dans un dispositif semi-conducteur, et dispositif correspondant
JP5771852B2 (ja) * 2011-02-27 2015-09-02 眞人 馬淵 熱電材料に伝熱量を低減し作業物質流は本来の熱電材料以上となる空間部分あるいは繋がった空間部分を含んだ熱電変換素子
ITRM20110196A1 (it) * 2011-04-19 2012-10-20 Annamaria Gerardino Dispositivo per la generazione di energia elettrica a partire da fonti di calore .
US9852870B2 (en) * 2011-05-23 2017-12-26 Corporation For National Research Initiatives Method for the fabrication of electron field emission devices including carbon nanotube field electron emisson devices
KR20130009442A (ko) * 2011-07-15 2013-01-23 삼성전기주식회사 열전 모듈
CA2854543A1 (en) * 2011-11-02 2013-05-10 Cardinal Solar Technologies Company Thermoelectric device technology
TWI499101B (zh) 2012-07-13 2015-09-01 Ind Tech Res Inst 熱電轉換結構及使用其之散熱結構
US20150207055A1 (en) * 2012-08-21 2015-07-23 Mahito Mabuchi Thermoelectric conversion element including, in thermoelectric material, spaces or bridging spaces such that heat transfer amounts are reduced and working substance flow is equal to or greater than those of original thermoelectric material
JP6350817B2 (ja) * 2014-08-23 2018-07-04 眞人 馬淵 熱電材料、熱電変換素子及び熱電材料から成るπ型モジュール群乃至π型モジュール群以外と熱変電換素子の組み合わせから成るモジュール群
US10088697B2 (en) * 2015-03-12 2018-10-02 International Business Machines Corporation Dual-use electro-optic and thermo-optic modulator
WO2016149289A1 (en) * 2015-03-16 2016-09-22 California Institute Of Technology Differential ring modulator
US10551715B2 (en) 2015-05-22 2020-02-04 California Institute Of Technology Optical ring modulator thermal tuning technique
KR101995614B1 (ko) * 2015-09-08 2019-07-02 포항공과대학교 산학협력단 비대칭 수직 나노선 어레이를 이용한 열전소자 및 이의 제조방법

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3880674A (en) * 1970-01-20 1975-04-29 Rockwell International Corp Thermoelectric elements and devices and process therefor
DE2547262C3 (de) * 1975-10-22 1981-07-16 Reinhard Dr. 7101 Flein Dahlberg Thermoelektrische Anordnung mit großen Temperaturgradienten und Verwendung
JPS6018753B2 (ja) * 1979-03-09 1985-05-11 大日本印刷株式会社 やすりの製造方法
JPS57207362A (en) * 1981-06-16 1982-12-20 Mitsubishi Electric Corp Semiconductor device
DE3404137A1 (de) * 1984-02-07 1985-08-08 Reinhard Dr. 7101 Flein Dahlberg Thermoelektrische anordnung mit fremdschicht-kontakten
DE3404138A1 (de) * 1984-02-07 1985-08-08 Reinhard Dr. 7101 Flein Dahlberg Thermoelektrische anordnung mit engewiderstaenden
DE3818192A1 (de) * 1988-05-28 1989-12-07 Dahlberg Reinhard Thermoelektrische anordnung mit tunnelkontakten
US5580827A (en) * 1989-10-10 1996-12-03 The Board Of Trustees Of The Leland Stanford Junior University Casting sharpened microminiature tips
JP2670366B2 (ja) * 1989-11-09 1997-10-29 日本原子力発電株式会社 熱電発電素子
EP0437654A1 (de) * 1990-01-16 1991-07-24 Reinhard Dr. Dahlberg Thermoelement-Schenkel mit richtungsabhängiger Quantisierung der Ladungsträger
JPH05168846A (ja) 1990-10-30 1993-07-02 Nippondenso Co Ltd 除湿装置
US5130276A (en) 1991-05-16 1992-07-14 Motorola Inc. Method of fabricating surface micromachined structures
JPH0539966A (ja) 1991-08-07 1993-02-19 Matsushita Electric Ind Co Ltd ヒートポンプデバイス
US5399238A (en) * 1991-11-07 1995-03-21 Microelectronics And Computer Technology Corporation Method of making field emission tips using physical vapor deposition of random nuclei as etch mask
JP2924369B2 (ja) 1991-11-20 1999-07-26 松下電器産業株式会社 ヒートポンプデバイス
JPH05226704A (ja) * 1992-02-10 1993-09-03 Matsushita Electric Ind Co Ltd 熱電装置およびその製造方法
RU2034207C1 (ru) 1992-11-05 1995-04-30 Товарищество с ограниченной ответственностью компании "Либрация" Способ охлаждения объекта каскадной термоэлектрической батареей
US5900071A (en) * 1993-01-12 1999-05-04 Massachusetts Institute Of Technology Superlattice structures particularly suitable for use as thermoelectric materials
AU6859294A (en) 1993-05-25 1994-12-20 Industrial Research Limited A peltier device
JPH08125237A (ja) * 1994-10-28 1996-05-17 Aisin Seiki Co Ltd 熱電素子
JPH08185794A (ja) * 1994-12-27 1996-07-16 Toshiba Corp マイクロエミッタ電極の製造方法およびマイクロエミッタ装置
JP3365109B2 (ja) 1994-12-28 2003-01-08 ソニー株式会社 データ再生装置及びデータ再生方法
KR100208474B1 (ko) * 1995-10-24 1999-07-15 박원훈 전계 방출용 마이크로-팁 및 그 제조방법
US5712448A (en) * 1996-02-07 1998-01-27 California Institute Of Technology Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices
JPH10146799A (ja) * 1996-11-14 1998-06-02 Lintec Corp 抜き型の製造方法
US5966941A (en) 1997-12-10 1999-10-19 International Business Machines Corporation Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms
US5867990A (en) 1997-12-10 1999-02-09 International Business Machines Corporation Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms
US6000225A (en) 1998-04-27 1999-12-14 International Business Machines Corporation Two dimensional thermoelectric cooler configuration
US6388185B1 (en) 1998-08-07 2002-05-14 California Institute Of Technology Microfabricated thermoelectric power-generation devices
US6161388A (en) 1998-12-28 2000-12-19 International Business Machines Corporation Enhanced duty cycle design for micro thermoelectromechanical coolers

Also Published As

Publication number Publication date
CA2427426A1 (en) 2002-06-13
KR20030059300A (ko) 2003-07-07
WO2002047176A3 (en) 2002-12-05
US6403876B1 (en) 2002-06-11
IL156320A0 (en) 2004-01-04
CA2427426C (en) 2008-02-19
KR100558800B1 (ko) 2006-03-10
EP1340266A2 (en) 2003-09-03
US20020166839A1 (en) 2002-11-14
TW565960B (en) 2003-12-11
US6740600B2 (en) 2004-05-25
JP2004515924A (ja) 2004-05-27
JP4289658B2 (ja) 2009-07-01
CN100345318C (zh) 2007-10-24
WO2002047176A2 (en) 2002-06-13
CN1478307A (zh) 2004-02-25

Similar Documents

Publication Publication Date Title
AU2002220821A1 (en) Enhanced interface thermoelectric coolers
AU2002223888A1 (en) Enhanced interface thermoelectric coolers
AU2002223889A1 (en) Thermoelectric devices
AU2002224346A1 (en) Thermoelectric generators
GB0021393D0 (en) Thermoelectric module
AU2001250149A1 (en) Thermoelectric element
AU2002335712A1 (en) Thermoelectric cooling system
AU2002323023A1 (en) Multipurpose pillow assembly
AU2001236066A1 (en) Refrigerator
AU2001236639A1 (en) Cooler
EP1174996A4 (en) THERMOELECTRIC SYSTEM
AU3327500A (en) Thermoelectric generator
AU2002350919A1 (en) Thermoelectric sensor
AU2001290404A1 (en) Thermoelectric air-cooling unit
AU4848901A (en) Cooling device
AU2000267336A1 (en) Cooling device
GB0011136D0 (en) Cooler
AU2001289610A1 (en) Night-vision device
AU2002321479A1 (en) Thermographic metthod
EP1120619A3 (de) Kühlvorrichtung
AUPQ498800A0 (en) Medi-vac cooler
AU2001243999A1 (en) Binding-ski interface
CA88896S (en) Cooler
CA91115S (en) Cooler
CA91116S (en) Cooler