AU2001296713A1 - Chemical-mechanical polishing slurry and method - Google Patents

Chemical-mechanical polishing slurry and method

Info

Publication number
AU2001296713A1
AU2001296713A1 AU2001296713A AU9671301A AU2001296713A1 AU 2001296713 A1 AU2001296713 A1 AU 2001296713A1 AU 2001296713 A AU2001296713 A AU 2001296713A AU 9671301 A AU9671301 A AU 9671301A AU 2001296713 A1 AU2001296713 A1 AU 2001296713A1
Authority
AU
Australia
Prior art keywords
chemical
mechanical polishing
polishing slurry
slurry
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001296713A
Inventor
Suryadevara Babu
Yie-Shein Her
Suresh Ramarajan
Ramanathan Srinivasan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vibrantz Corp
Original Assignee
Ferro Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferro Corp filed Critical Ferro Corp
Publication of AU2001296713A1 publication Critical patent/AU2001296713A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
AU2001296713A 2000-10-19 2001-10-09 Chemical-mechanical polishing slurry and method Abandoned AU2001296713A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09692730 2000-10-19
US09/692,730 US6702954B1 (en) 2000-10-19 2000-10-19 Chemical-mechanical polishing slurry and method
PCT/US2001/031432 WO2002033736A1 (en) 2000-10-19 2001-10-09 Chemical-mechanical polishing slurry and method

Publications (1)

Publication Number Publication Date
AU2001296713A1 true AU2001296713A1 (en) 2002-04-29

Family

ID=24781771

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001296713A Abandoned AU2001296713A1 (en) 2000-10-19 2001-10-09 Chemical-mechanical polishing slurry and method

Country Status (7)

Country Link
US (2) US6702954B1 (en)
EP (1) EP1327258A4 (en)
JP (1) JP2004512681A (en)
KR (1) KR100718573B1 (en)
CN (1) CN100401459C (en)
AU (1) AU2001296713A1 (en)
WO (1) WO2002033736A1 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7077880B2 (en) 2004-01-16 2006-07-18 Dupont Air Products Nanomaterials Llc Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
US7513920B2 (en) 2002-02-11 2009-04-07 Dupont Air Products Nanomaterials Llc Free radical-forming activator attached to solid and used to enhance CMP formulations
US20030162398A1 (en) 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
JP2003338469A (en) * 2002-05-21 2003-11-28 Fujitsu Ltd Abrasive, polishing method, and cleaning method
US7005382B2 (en) * 2002-10-31 2006-02-28 Jsr Corporation Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
US7736405B2 (en) 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
US20050139292A1 (en) * 2003-12-31 2005-06-30 Suresh Ramarajan Method and apparatus for minimizing thickness-to-planarity and dishing in CMP
US7867302B2 (en) * 2005-02-22 2011-01-11 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7875091B2 (en) * 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7449124B2 (en) * 2005-02-25 2008-11-11 3M Innovative Properties Company Method of polishing a wafer
CN101180379B (en) * 2005-03-25 2013-07-24 气体产品与化学公司 Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers
CN1865386B (en) * 2005-05-17 2012-05-16 安集微电子（上海）有限公司 Buffing slurry
CN1865385B (en) * 2005-05-17 2011-01-05 安集微电子（上海）有限公司 Buffing slurry
US7998866B2 (en) * 2006-09-05 2011-08-16 Cabot Microelectronics Corporation Silicon carbide polishing method utilizing water-soluble oxidizers
US20080119056A1 (en) * 2006-11-16 2008-05-22 International Business Machines Corporation Method for improved copper layer etching of wafers with c4 connection structures
US20080116171A1 (en) * 2006-11-22 2008-05-22 Clarkson University Method For The Preferential Polishing Of Silicon Nitride Versus Silicon Oxide
US7723234B2 (en) * 2006-11-22 2010-05-25 Clarkson University Method for selective CMP of polysilicon
US7629258B2 (en) 2006-11-22 2009-12-08 Clarkson University Method for one-to-one polishing of silicon nitride and silicon oxide
US8591764B2 (en) * 2006-12-20 2013-11-26 3M Innovative Properties Company Chemical mechanical planarization composition, system, and method of use
TW200842970A (en) * 2007-04-26 2008-11-01 Mallinckrodt Baker Inc Polysilicon planarization solution for planarizing low temperature poly-silicon thin filim panels
US20100190339A1 (en) * 2007-07-26 2010-07-29 Zhan Chen Compositions and methods for chemical-mechanical polishing of phase change materials
US7915071B2 (en) * 2007-08-30 2011-03-29 Dupont Air Products Nanomaterials, Llc Method for chemical mechanical planarization of chalcogenide materials
KR20110019442A (en) 2008-06-26 2011-02-25 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Polishing pad with porous elements and method of making and using the same
US8506831B2 (en) * 2008-12-23 2013-08-13 Air Products And Chemicals, Inc. Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate
KR20120125612A (en) 2009-12-30 2012-11-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Polishing pads including phase-separated polymer blend and method of making and using the same
JP2013165088A (en) * 2010-06-03 2013-08-22 Asahi Glass Co Ltd Polishing agent and polishing method
EP2643864A2 (en) 2010-11-22 2013-10-02 3M Innovative Properties Company Assembly and electronic devices including the same
US10508220B2 (en) 2015-07-10 2019-12-17 Ferro Corporation Slurry composition and additives and method for polishing organic polymer-based ophthalmic substrates
WO2017030710A1 (en) 2015-08-19 2017-02-23 Ferro Corporation Slurry composition and method of use
CN109476954B (en) 2016-08-26 2021-07-23 福禄公司 Slurry composition and method for selective silica polishing
CN111015432B (en) * 2019-11-26 2022-04-01 天津津航技术物理研究所 Chemical mechanical processing method for improving optical surface quality of Ge-As-Se chalcogenide glass

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4789648A (en) 1985-10-28 1988-12-06 International Business Machines Corporation Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias
EP0786504A3 (en) 1996-01-29 1998-05-20 Fujimi Incorporated Polishing composition
US5738800A (en) 1996-09-27 1998-04-14 Rodel, Inc. Composition and method for polishing a composite of silica and silicon nitride
US5876490A (en) 1996-12-09 1999-03-02 International Business Machines Corporatin Polish process and slurry for planarization
US5759917A (en) 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
EP0853335A3 (en) 1997-01-10 1999-01-07 Texas Instruments Incorporated Slurry and process for the mechano-chemical polishing of semiconductor devices
US6194317B1 (en) * 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
AU734883B2 (en) * 1997-04-30 2001-06-21 Minnesota Mining And Manufacturing Company Method of planarizing the upper surface of a semiconductor wafer
US6083419A (en) * 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching
JP2002511650A (en) 1998-04-10 2002-04-16 フェロー コーポレイション Slurry for polishing chemical-mechanical metal surfaces
CN1158694C (en) * 1998-12-28 2004-07-21 日立化成工业株式会社 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same
US6238592B1 (en) * 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication

Also Published As

Publication number Publication date
EP1327258A4 (en) 2005-09-14
US6702954B1 (en) 2004-03-09
EP1327258A1 (en) 2003-07-16
US7101800B2 (en) 2006-09-05
WO2002033736A1 (en) 2002-04-25
CN1633698A (en) 2005-06-29
KR100718573B1 (en) 2007-05-15
CN100401459C (en) 2008-07-09
US20040157454A1 (en) 2004-08-12
KR20030034255A (en) 2003-05-01
JP2004512681A (en) 2004-04-22

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