AU2001296655A1 - Process control methods for use with e-beam fabrication technology - Google Patents
Process control methods for use with e-beam fabrication technologyInfo
- Publication number
- AU2001296655A1 AU2001296655A1 AU2001296655A AU9665501A AU2001296655A1 AU 2001296655 A1 AU2001296655 A1 AU 2001296655A1 AU 2001296655 A AU2001296655 A AU 2001296655A AU 9665501 A AU9665501 A AU 9665501A AU 2001296655 A1 AU2001296655 A1 AU 2001296655A1
- Authority
- AU
- Australia
- Prior art keywords
- process control
- control methods
- fabrication technology
- beam fabrication
- technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
- H01J37/3005—Observing the objects or the point of impact on the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/171—Systems in which incident light is modified in accordance with the properties of the material investigated with calorimetric detection, e.g. with thermal lens detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8472—Investigation of composite materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
- G01N2291/0231—Composite or layered materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02881—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2445—Photon detectors for X-rays, light, e.g. photomultipliers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24592—Inspection and quality control of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/248—Components associated with the control of the tube
- H01J2237/2482—Optical means
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/707,444 US6696692B1 (en) | 2000-11-06 | 2000-11-06 | Process control methods for use with e-beam fabrication technology |
US09707444 | 2000-11-06 | ||
PCT/US2001/031282 WO2002037085A1 (en) | 2000-11-06 | 2001-10-04 | Process control methods for use with e-beam fabrication technology |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001296655A1 true AU2001296655A1 (en) | 2002-05-15 |
Family
ID=24841718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001296655A Abandoned AU2001296655A1 (en) | 2000-11-06 | 2001-10-04 | Process control methods for use with e-beam fabrication technology |
Country Status (3)
Country | Link |
---|---|
US (1) | US6696692B1 (en) |
AU (1) | AU2001296655A1 (en) |
WO (1) | WO2002037085A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7330583B2 (en) * | 2002-08-19 | 2008-02-12 | Photon Dynamics, Inc. | Integrated visual imaging and electronic sensing inspection systems |
JP2005177763A (en) * | 2003-12-16 | 2005-07-07 | Disco Abrasive Syst Ltd | Verifying apparatus for affected layer machined by laser beam |
KR100741110B1 (en) * | 2006-02-15 | 2007-07-19 | 삼성에스디아이 주식회사 | Optic fibre and method of forming electrodes of plasma display panel |
US7516663B2 (en) * | 2006-11-03 | 2009-04-14 | General Electric Company | Systems and method for locating failure events in samples under load |
US7605924B2 (en) * | 2006-12-06 | 2009-10-20 | Lockheed Martin Corporation | Laser-ultrasound inspection using infrared thermography |
US7966883B2 (en) * | 2006-12-06 | 2011-06-28 | Lockheed Martin Corporation | Non-destructive inspection using laser-ultrasound and infrared thermography |
CA2672378A1 (en) | 2007-12-06 | 2009-06-11 | Lockheed Martin Corporation | Non-destructive inspection using laser-ultrasound and infrared thermography |
US8440974B2 (en) * | 2009-09-16 | 2013-05-14 | Siemens Energy, Inc. | System and method for analysis of ultrasonic power coupling during acoustic thermography |
US20110122459A1 (en) * | 2009-11-24 | 2011-05-26 | International Business Machines Corporation | Scanning and Capturing digital Images Using Document Characteristics Detection |
US8610924B2 (en) * | 2009-11-24 | 2013-12-17 | International Business Machines Corporation | Scanning and capturing digital images using layer detection |
US8522614B2 (en) * | 2010-05-26 | 2013-09-03 | General Electric Company | In-line inspection methods and closed loop processes for the manufacture of prepregs and/or laminates comprising the same |
CN114770829A (en) * | 2022-01-05 | 2022-07-22 | 南京航空航天大学 | Composite material electron beam repair and repair process detection integrated device and method |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4468136A (en) * | 1982-02-12 | 1984-08-28 | The Johns Hopkins University | Optical beam deflection thermal imaging |
JPS59177846A (en) | 1983-03-28 | 1984-10-08 | Fujitsu Ltd | Electron beam device |
US4752140A (en) * | 1983-12-02 | 1988-06-21 | Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee | Pulsed dilatometric method and device for the detection of delaminations |
US4589783A (en) * | 1984-04-04 | 1986-05-20 | Wayne State University | Thermal wave imaging apparatus |
US4579463A (en) * | 1984-05-21 | 1986-04-01 | Therma-Wave Partners | Detecting thermal waves to evaluate thermal parameters |
US4636088A (en) * | 1984-05-21 | 1987-01-13 | Therma-Wave, Inc. | Method and apparatus for evaluating surface conditions of a sample |
US4710030A (en) | 1985-05-17 | 1987-12-01 | Bw Brown University Research Foundation | Optical generator and detector of stress pulses |
IE58049B1 (en) | 1985-05-21 | 1993-06-16 | Tekscan Ltd | Surface analysis microscopy apparatus |
NO164133C (en) | 1985-07-15 | 1993-10-26 | Svein Otto Kanstad | PROCEDURE AND APPARATUS FOR CHARACTERIZATION AND CONTROL OF SUBSTANCES, MATERIALS AND OBJECTS |
US4799392A (en) * | 1987-08-06 | 1989-01-24 | Motorola Inc. | Method for determining silicon (mass 28) beam purity prior to implantation of gallium arsenide |
US5020920A (en) * | 1989-11-03 | 1991-06-04 | The United States Of America As Represented By The United States Department Of Energy | Method and apparatus for millimeter-wave detection of thermal waves for materials evaluation |
JP3117836B2 (en) * | 1993-03-02 | 2000-12-18 | セイコーインスツルメンツ株式会社 | Focused ion beam equipment |
US5376793A (en) * | 1993-09-15 | 1994-12-27 | Stress Photonics, Inc. | Forced-diffusion thermal imaging apparatus and method |
US5483068A (en) * | 1994-01-07 | 1996-01-09 | Moulton; Russell D. | Use of IR (thermal) imaging for determining cell diagnostics |
US5432119A (en) | 1994-01-31 | 1995-07-11 | Hughes Aircraft Company | High yield electron-beam gate fabrication method for sub-micron gate FETS |
JP3221797B2 (en) * | 1994-06-14 | 2001-10-22 | 株式会社日立製作所 | Sample preparation method and apparatus |
EP0731490A3 (en) * | 1995-03-02 | 1998-03-11 | Ebara Corporation | Ultra-fine microfabrication method using an energy beam |
JPH09115861A (en) * | 1995-10-20 | 1997-05-02 | Hitachi Ltd | Machining system for sample |
US5760904A (en) | 1996-07-26 | 1998-06-02 | General Electric Company | Method and system for inspecting a surface of an object with laser ultrasound |
US5966626A (en) * | 1996-11-07 | 1999-10-12 | Mosel Vitelic, Inc. | Method for stabilizing a silicon structure after ion implantation |
FR2760528B1 (en) * | 1997-03-05 | 1999-05-21 | Framatome Sa | METHOD AND DEVICE FOR PHOTOTHERMAL EXAMINATION OF A MATERIAL |
US5900935A (en) | 1997-12-22 | 1999-05-04 | Klein; Marvin B. | Homodyne interferometer and method of sensing material |
US6049220A (en) * | 1998-06-10 | 2000-04-11 | Boxer Cross Incorporated | Apparatus and method for evaluating a wafer of semiconductor material |
-
2000
- 2000-11-06 US US09/707,444 patent/US6696692B1/en not_active Expired - Fee Related
-
2001
- 2001-10-04 AU AU2001296655A patent/AU2001296655A1/en not_active Abandoned
- 2001-10-04 WO PCT/US2001/031282 patent/WO2002037085A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US6696692B1 (en) | 2004-02-24 |
WO2002037085A1 (en) | 2002-05-10 |
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