AU2001293199A1 - Surface contouring by controlled application of processing fluid using marangonieffect - Google Patents

Surface contouring by controlled application of processing fluid using marangonieffect

Info

Publication number
AU2001293199A1
AU2001293199A1 AU2001293199A AU9319901A AU2001293199A1 AU 2001293199 A1 AU2001293199 A1 AU 2001293199A1 AU 2001293199 A AU2001293199 A AU 2001293199A AU 9319901 A AU9319901 A AU 9319901A AU 2001293199 A1 AU2001293199 A1 AU 2001293199A1
Authority
AU
Australia
Prior art keywords
marangonieffect
processing fluid
controlled application
surface contouring
contouring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001293199A
Inventor
Jerald A. Britten
Michael C. Rushford
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of California
Original Assignee
University of California
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of California filed Critical University of California
Publication of AU2001293199A1 publication Critical patent/AU2001293199A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/12176—Etching
AU2001293199A 2000-10-13 2001-10-01 Surface contouring by controlled application of processing fluid using marangonieffect Abandoned AU2001293199A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/687,775 US6555017B1 (en) 2000-10-13 2000-10-13 Surface contouring by controlled application of processing fluid using Marangoni effect
US09687775 2000-10-13
PCT/US2001/030668 WO2002032825A1 (en) 2000-10-13 2001-10-01 Surface contouring by controlled application of processing fluid using marangoni effect

Publications (1)

Publication Number Publication Date
AU2001293199A1 true AU2001293199A1 (en) 2002-04-29

Family

ID=24761786

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001293199A Abandoned AU2001293199A1 (en) 2000-10-13 2001-10-01 Surface contouring by controlled application of processing fluid using marangonieffect

Country Status (5)

Country Link
US (2) US6555017B1 (en)
EP (1) EP1332119A1 (en)
JP (1) JP2004511420A (en)
AU (1) AU2001293199A1 (en)
WO (1) WO2002032825A1 (en)

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US7293571B2 (en) 2002-09-30 2007-11-13 Lam Research Corporation Substrate proximity processing housing and insert for generating a fluid meniscus
US7153400B2 (en) * 2002-09-30 2006-12-26 Lam Research Corporation Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US20040151828A1 (en) * 2003-02-04 2004-08-05 Anis Zribi Method for fabrication and alignment of micro and nanoscale optics using surface tension gradients
US7675000B2 (en) * 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
US7867565B2 (en) * 2003-06-30 2011-01-11 Imec Method for coating substrates
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US8062471B2 (en) * 2004-03-31 2011-11-22 Lam Research Corporation Proximity head heating method and apparatus
US7003899B1 (en) 2004-09-30 2006-02-28 Lam Research Corporation System and method for modulating flow through multiple ports in a proximity head
DE102005024554A1 (en) * 2005-05-28 2006-11-30 Carl Zeiss Jena Gmbh Production of a junction of optical components comprises measuring the connecting surfaces of individual elements and/or component groups using digital interferometry and acquiring zonal molding accuracies and further processing
US7312154B2 (en) * 2005-12-20 2007-12-25 Corning Incorporated Method of polishing a semiconductor-on-insulator structure
JP4889331B2 (en) * 2006-03-22 2012-03-07 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
US7928366B2 (en) * 2006-10-06 2011-04-19 Lam Research Corporation Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
US8813764B2 (en) 2009-05-29 2014-08-26 Lam Research Corporation Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
CA2663325A1 (en) * 2006-10-16 2008-04-24 Materials And Technologies Corporation Wet processing using a fluid meniscus, apparatus and method
US8146902B2 (en) * 2006-12-21 2012-04-03 Lam Research Corporation Hybrid composite wafer carrier for wet clean equipment
JP4930095B2 (en) * 2007-02-22 2012-05-09 富士通株式会社 Wet etching method and semiconductor device manufacturing method
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
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US8141566B2 (en) * 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
US8008209B2 (en) * 2007-10-24 2011-08-30 International Business Machines Corporation Thermal gradient control of high aspect ratio etching and deposition processes
JP5153750B2 (en) * 2009-10-09 2013-02-27 三菱電機株式会社 Substrate surface treatment device, solar cell manufacturing device
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CN104815785B (en) * 2015-04-29 2017-04-19 深圳市智立方自动化设备有限公司 Automatic pin head position calibration device and automatic pin head position calibration method
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WO2020180536A1 (en) * 2019-03-01 2020-09-10 Zygo Corporation Method for figure control of optical surfaces
CN110281085A (en) * 2019-07-25 2019-09-27 广东工业大学 A kind of magnetorheological grinding and polishing device of cluster and its application method
CN112625285B (en) * 2020-12-10 2022-02-11 中国科学院化学研究所 Organic functional film/ultrathin film and preparation method and application thereof
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CN113213421B (en) * 2021-05-12 2022-04-15 清华大学 Method and device for preparing large-area array nanoneedle structure
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CN115385578B (en) * 2022-07-29 2023-11-28 惠州市清洋实业有限公司 Chemical perforation manufacturing process for camera lens

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Also Published As

Publication number Publication date
JP2004511420A (en) 2004-04-15
WO2002032825A1 (en) 2002-04-25
EP1332119A1 (en) 2003-08-06
US20030141275A1 (en) 2003-07-31
US6740194B2 (en) 2004-05-25
US6555017B1 (en) 2003-04-29

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