AU2001286571A1 - Using laser etching to improve surface contact resistance of conductive fiber filler polymer composites - Google Patents

Using laser etching to improve surface contact resistance of conductive fiber filler polymer composites

Info

Publication number
AU2001286571A1
AU2001286571A1 AU2001286571A AU8657101A AU2001286571A1 AU 2001286571 A1 AU2001286571 A1 AU 2001286571A1 AU 2001286571 A AU2001286571 A AU 2001286571A AU 8657101 A AU8657101 A AU 8657101A AU 2001286571 A1 AU2001286571 A1 AU 2001286571A1
Authority
AU
Australia
Prior art keywords
conductive fiber
contact resistance
surface contact
laser etching
polymer composites
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001286571A
Inventor
Parker R. Lichtenstein
Hong Peng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parker Hannifin Corp
Original Assignee
Parker Hannifin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp
Publication of AU2001286571A1 publication Critical patent/AU2001286571A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H05K9/0016—Gaskets or seals having a spring contact
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/54—Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
    • B29C70/545—Perforating, cutting or machining during or after moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Composite Materials (AREA)
  • Dispersion Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

A method for improving the line or point-to-point surface contact resistance of an electrically conductive fiber filled polymer composite includes the laser evaporating of a thin polymer layer from the surface of the composite and exposing of the electrically conductive fiber/particle network underneath. The surface of the composite laser is etched to a depth between about 1 and 250 microns.
AU2001286571A 2000-08-30 2001-08-21 Using laser etching to improve surface contact resistance of conductive fiber filler polymer composites Abandoned AU2001286571A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09651353 2000-08-30
US09/651,353 US6624383B1 (en) 2000-08-30 2000-08-30 Using laser etching to improve surface contact resistance of conductive fiber filler polymer composites
PCT/US2001/026046 WO2002019346A1 (en) 2000-08-30 2001-08-21 Using laser etching to improve surface contact resistance of conductive fiber filler polymer composites

Publications (1)

Publication Number Publication Date
AU2001286571A1 true AU2001286571A1 (en) 2002-03-13

Family

ID=24612555

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001286571A Abandoned AU2001286571A1 (en) 2000-08-30 2001-08-21 Using laser etching to improve surface contact resistance of conductive fiber filler polymer composites

Country Status (6)

Country Link
US (1) US6624383B1 (en)
EP (1) EP1316093B1 (en)
AT (1) ATE534125T1 (en)
AU (1) AU2001286571A1 (en)
CA (1) CA2416911C (en)
WO (1) WO2002019346A1 (en)

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US6741221B2 (en) * 2001-02-15 2004-05-25 Integral Technologies, Inc. Low cost antennas using conductive plastics or conductive composites
US20050139811A1 (en) * 2001-02-15 2005-06-30 Integral Technologies, Inc. Surface preparation method for articles manufactured from conductive loaded resin-based materials
WO2007013046A2 (en) * 2005-07-28 2007-02-01 Dana Corporation Fuel cell surface activation
US7140917B1 (en) * 2005-08-05 2006-11-28 Molex Incorporated Shielded electrical connector having latch means, and method of fabricating same
SI22288A (en) * 2006-06-06 2007-12-31 Institut "JoĹľef Stefan" Method and device for selective etching of composite materials with laser ablation
US8785023B2 (en) 2008-07-07 2014-07-22 Enervault Corparation Cascade redox flow battery systems
US7820321B2 (en) 2008-07-07 2010-10-26 Enervault Corporation Redox flow battery system for distributed energy storage
CN102171770B (en) * 2008-08-08 2014-07-09 Pp-梅德有限公司 Polymer molded bodies and printed circuit board arrangement and method for the production thereof
DE102009011538A1 (en) 2009-03-03 2010-09-09 Pp-Mid Gmbh Producing conductive structures on surface of polymer molded bodies, comprises providing polymer molded body from a polymer phase containing carbon nanotubes and thermally treating a surface of the polymer molded body
DE102008048459A1 (en) 2008-09-23 2010-03-25 Pp-Mid Gmbh Producing conductive structures on surface of polymer molded bodies, comprises providing polymer molded body from a polymer phase containing carbon nanotubes and thermally treating a surface of the polymer molded body
DE102008061051A1 (en) 2008-12-08 2010-06-10 Pp-Mid Gmbh Producing conductive structures on surface of polymer molded bodies, comprises providing polymer molded body from a polymer phase containing carbon nanotubes and thermally treating a surface of the polymer molded body
EP2151830A1 (en) 2008-08-08 2010-02-10 pp-mid GmbH Polymer form body with conductive structures on the surface and method for its production
US8980484B2 (en) 2011-03-29 2015-03-17 Enervault Corporation Monitoring electrolyte concentrations in redox flow battery systems
US8916281B2 (en) 2011-03-29 2014-12-23 Enervault Corporation Rebalancing electrolytes in redox flow battery systems
DE102012202225B4 (en) * 2012-02-14 2015-10-22 Te Connectivity Germany Gmbh Plug housing with seal
US10046528B2 (en) * 2012-02-20 2018-08-14 The Boeing Company Composite layers with exposed reinforcement
CN102672880B (en) * 2012-05-04 2015-06-03 华为终端有限公司 Carbon fiber member manufacturing method and carbon fiber member manufactured by method
ITTO20121083A1 (en) * 2012-12-14 2014-06-15 Plastic Components And Modules Auto Motive S P A COMPOSITE MATERIAL FOR THE REALIZATION OF A COMPONENT OR A STRUCTURAL PART, PARTICULARLY FOR THE INSTALLATION OF A VEHICLE ON BOARD, TO INTEGRATE DEVICES AND ELECTRICAL CONNECTIONS.
US9099481B2 (en) 2013-03-15 2015-08-04 Semiconductor Components Industries, Llc Methods of laser marking semiconductor substrates
FR3008921B1 (en) 2013-07-23 2015-12-25 Safran COMPOSITE MATERIAL PIECE WITH THERMAL AND ELECTRIC CONDUCTIVITY PORTION AND METHOD OF MANUFACTURING SUCH A PIECE
US9919502B2 (en) 2014-04-23 2018-03-20 Schaublin Sa Method and apparatus for preparing a surface for bonding a material thereto
GB2533354B (en) * 2014-12-17 2017-09-13 Etl Systems Ltd Connector assembly and related methods and assemblies
US10834786B2 (en) 2016-01-12 2020-11-10 3M Innovative Properties Company Heating tape and system
DE112019000405T5 (en) 2018-03-05 2020-10-22 Robert Bosch Gmbh MELT EXTRUDED SOLID BATTERY COMPONENTS
TW202129099A (en) * 2019-09-27 2021-08-01 美商科可納公司 Improved functional textiles and manufacturing methods
US20220274369A1 (en) * 2021-03-01 2022-09-01 Government Of The United States, As Represented By The Secretary Of The Air Force Prepregs and cured composites having improved surfaces and processes of making and methods of using same

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Also Published As

Publication number Publication date
CA2416911C (en) 2010-04-20
CA2416911A1 (en) 2002-03-07
EP1316093B1 (en) 2011-11-16
ATE534125T1 (en) 2011-12-15
WO2002019346A1 (en) 2002-03-07
US6624383B1 (en) 2003-09-23
EP1316093A1 (en) 2003-06-04

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