AU2001281379A1 - Low inductance transistor module with distributed bus - Google Patents

Low inductance transistor module with distributed bus

Info

Publication number
AU2001281379A1
AU2001281379A1 AU2001281379A AU8137901A AU2001281379A1 AU 2001281379 A1 AU2001281379 A1 AU 2001281379A1 AU 2001281379 A AU2001281379 A AU 2001281379A AU 8137901 A AU8137901 A AU 8137901A AU 2001281379 A1 AU2001281379 A1 AU 2001281379A1
Authority
AU
Australia
Prior art keywords
low inductance
transistor module
distributed bus
inductance transistor
bus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001281379A
Inventor
Jeffrey A Reichard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Superconductor Corp
Original Assignee
American Superconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Superconductor Corp filed Critical American Superconductor Corp
Publication of AU2001281379A1 publication Critical patent/AU2001281379A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0776Resistance and impedance
    • H05K2201/0792Means against parasitic impedance; Means against eddy currents
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672Superposed layout, i.e. in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979Redundant conductors or connections, i.e. more than one current path between two points
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10166Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AU2001281379A 2000-08-11 2001-07-31 Low inductance transistor module with distributed bus Abandoned AU2001281379A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/637,619 2000-08-11
US09/637,619 US6459605B1 (en) 2000-08-11 2000-08-11 Low inductance transistor module with distributed bus
PCT/US2001/041520 WO2002015651A2 (en) 2000-08-11 2001-07-31 Low inductance transistor module with distributed bus

Publications (1)

Publication Number Publication Date
AU2001281379A1 true AU2001281379A1 (en) 2002-02-25

Family

ID=24556702

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001281379A Abandoned AU2001281379A1 (en) 2000-08-11 2001-07-31 Low inductance transistor module with distributed bus

Country Status (4)

Country Link
US (1) US6459605B1 (en)
EP (1) EP1308071A2 (en)
AU (1) AU2001281379A1 (en)
WO (1) WO2002015651A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6954368B1 (en) 1996-07-22 2005-10-11 HYDRO-QUéBEC Low stray interconnection inductance power converting molecule for converting a DC voltage into an AC voltage, and a method therefor
US7248483B2 (en) * 2004-08-19 2007-07-24 Xantrex Technology, Inc. High power density insulated metal substrate based power converter assembly with very low BUS impedance
US20060214654A1 (en) * 2005-03-28 2006-09-28 Trisco Technology Corp. [conducting structure of a meter]
US20070041160A1 (en) * 2005-08-19 2007-02-22 Kehret William E Thermal management for a ruggedized electronics enclosure
GB2487185B (en) * 2011-01-05 2015-06-03 Penny & Giles Controls Ltd Power Switching Circuitry
WO2012117694A1 (en) * 2011-02-28 2012-09-07 株式会社日立製作所 Electric power converter
CN104955273B (en) * 2014-03-31 2018-10-02 奇点新源国际技术开发(北京)有限公司 Printed circuit board and network cabling system
CN112104202A (en) * 2020-02-27 2020-12-18 台达电子工业股份有限公司 Power supply module
DE102020209238A1 (en) * 2020-07-22 2022-01-27 Robert Bosch Gesellschaft mit beschränkter Haftung EMC filter with a shield

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0754874B2 (en) 1986-10-20 1995-06-07 フアナツク株式会社 Multilayer printed wiring board
JPS63157677A (en) 1986-12-19 1988-06-30 R F Enajii Kk Bridge type inverter
JPH0828557B2 (en) 1987-10-29 1996-03-21 株式会社日立製作所 PCB power supply wiring structure
US5027253A (en) * 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5172310A (en) * 1991-07-10 1992-12-15 U.S. Windpower, Inc. Low impedance bus for power electronics
DE9403108U1 (en) 1994-02-24 1994-04-14 Siemens AG, 80333 München Low-inductance high-current busbar for converter modules
JPH08274428A (en) 1995-03-31 1996-10-18 Sony Tektronix Corp Power control circuit
JP3366192B2 (en) 1995-09-08 2003-01-14 株式会社日立製作所 Wiring board and power conversion device using the same
US5901038A (en) * 1997-03-17 1999-05-04 Cheng; Wing Ling Power supply system for high density printed circuit boards
JP2000200948A (en) 1999-01-07 2000-07-18 Toshiba Corp Wiring structure of parallel circuit

Also Published As

Publication number Publication date
US6459605B1 (en) 2002-10-01
WO2002015651A3 (en) 2002-08-29
EP1308071A2 (en) 2003-05-07
WO2002015651A2 (en) 2002-02-21

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