AU2001280949A1 - Wafer area pressure control - Google Patents
Wafer area pressure controlInfo
- Publication number
- AU2001280949A1 AU2001280949A1 AU2001280949A AU8094901A AU2001280949A1 AU 2001280949 A1 AU2001280949 A1 AU 2001280949A1 AU 2001280949 A AU2001280949 A AU 2001280949A AU 8094901 A AU8094901 A AU 8094901A AU 2001280949 A1 AU2001280949 A1 AU 2001280949A1
- Authority
- AU
- Australia
- Prior art keywords
- pressure control
- wafer area
- area pressure
- wafer
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/637,736 US6433484B1 (en) | 2000-08-11 | 2000-08-11 | Wafer area pressure control |
US09/637,736 | 2000-08-11 | ||
PCT/US2001/024103 WO2002015236A2 (en) | 2000-08-11 | 2001-07-31 | Wafer area pressure control |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001280949A1 true AU2001280949A1 (en) | 2002-02-25 |
Family
ID=24557172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001280949A Abandoned AU2001280949A1 (en) | 2000-08-11 | 2001-07-31 | Wafer area pressure control |
Country Status (9)
Country | Link |
---|---|
US (1) | US6433484B1 (en) |
EP (1) | EP1362362B1 (en) |
JP (2) | JP4868693B2 (en) |
KR (1) | KR100807133B1 (en) |
CN (1) | CN1269178C (en) |
AU (1) | AU2001280949A1 (en) |
DE (1) | DE60140766D1 (en) |
TW (1) | TWI235403B (en) |
WO (1) | WO2002015236A2 (en) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0250853A (en) * | 1988-08-12 | 1990-02-20 | Nec Corp | Image forming apparatus |
US6492774B1 (en) * | 2000-10-04 | 2002-12-10 | Lam Research Corporation | Wafer area pressure control for plasma confinement |
US6800173B2 (en) * | 2000-12-15 | 2004-10-05 | Novellus Systems, Inc. | Variable gas conductance control for a process chamber |
US6846747B2 (en) | 2002-04-09 | 2005-01-25 | Unaxis Usa Inc. | Method for etching vias |
JP3940095B2 (en) * | 2003-05-08 | 2007-07-04 | 忠弘 大見 | Substrate processing equipment |
US20050103267A1 (en) * | 2003-11-14 | 2005-05-19 | Hur Gwang H. | Flat panel display manufacturing apparatus |
US20050263070A1 (en) * | 2004-05-25 | 2005-12-01 | Tokyo Electron Limited | Pressure control and plasma confinement in a plasma processing chamber |
KR100539266B1 (en) | 2004-06-02 | 2005-12-27 | 삼성전자주식회사 | Plasma processing apparatus having segment confinements |
US20060043067A1 (en) * | 2004-08-26 | 2006-03-02 | Lam Research Corporation | Yttria insulator ring for use inside a plasma chamber |
US7364623B2 (en) * | 2005-01-27 | 2008-04-29 | Lam Research Corporation | Confinement ring drive |
US7837825B2 (en) * | 2005-06-13 | 2010-11-23 | Lam Research Corporation | Confined plasma with adjustable electrode area ratio |
CN100452945C (en) * | 2007-06-20 | 2009-01-14 | 中微半导体设备(上海)有限公司 | Decoupling reactive ion etching chamber containing multiple processing platforms |
US8043430B2 (en) * | 2006-12-20 | 2011-10-25 | Lam Research Corporation | Methods and apparatuses for controlling gas flow conductance in a capacitively-coupled plasma processing chamber |
US7824519B2 (en) * | 2007-05-18 | 2010-11-02 | Lam Research Corporation | Variable volume plasma processing chamber and associated methods |
US8679288B2 (en) | 2008-06-09 | 2014-03-25 | Lam Research Corporation | Showerhead electrode assemblies for plasma processing apparatuses |
US8449679B2 (en) | 2008-08-15 | 2013-05-28 | Lam Research Corporation | Temperature controlled hot edge ring assembly |
US8627783B2 (en) * | 2008-12-19 | 2014-01-14 | Lam Research Corporation | Combined wafer area pressure control and plasma confinement assembly |
US8540844B2 (en) * | 2008-12-19 | 2013-09-24 | Lam Research Corporation | Plasma confinement structures in plasma processing systems |
US8869741B2 (en) * | 2008-12-19 | 2014-10-28 | Lam Research Corporation | Methods and apparatus for dual confinement and ultra-high pressure in an adjustable gap plasma chamber |
KR101723253B1 (en) * | 2009-08-31 | 2017-04-04 | 램 리써치 코포레이션 | A local plasma confinement and pressure control arrangement and methods thereof |
WO2011038344A2 (en) * | 2009-09-28 | 2011-03-31 | Lam Research Corporation | Unitized confinement ring arrangements and methods thereof |
CN102136410B (en) * | 2010-01-27 | 2013-04-10 | 中芯国际集成电路制造(上海)有限公司 | Method for cleaning technological cavities of semiconductor |
US20130052369A1 (en) * | 2010-05-06 | 2013-02-28 | Oerlikon Solar Ag, Truebbach | Plasma reactor |
US9478428B2 (en) * | 2010-10-05 | 2016-10-25 | Skyworks Solutions, Inc. | Apparatus and methods for shielding a plasma etcher electrode |
US20120083129A1 (en) | 2010-10-05 | 2012-04-05 | Skyworks Solutions, Inc. | Apparatus and methods for focusing plasma |
US20150020848A1 (en) * | 2013-07-19 | 2015-01-22 | Lam Research Corporation | Systems and Methods for In-Situ Wafer Edge and Backside Plasma Cleaning |
KR101680850B1 (en) * | 2016-06-28 | 2016-11-29 | 주식회사 기가레인 | Plasma processing apparatus having control of exhaust flow path size |
CN113745081B (en) * | 2020-05-27 | 2024-03-12 | 中微半导体设备(上海)股份有限公司 | Isolation ring assembly, plasma processing device and processing method |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6068784A (en) | 1989-10-03 | 2000-05-30 | Applied Materials, Inc. | Process used in an RF coupled plasma reactor |
US5246532A (en) * | 1990-10-26 | 1993-09-21 | Mitsubishi Denki Kabushiki Kaisha | Plasma processing apparatus |
JP2638443B2 (en) * | 1993-08-31 | 1997-08-06 | 日本電気株式会社 | Dry etching method and dry etching apparatus |
US5534751A (en) | 1995-07-10 | 1996-07-09 | Lam Research Corporation | Plasma etching apparatus utilizing plasma confinement |
US5968275A (en) * | 1997-06-25 | 1999-10-19 | Lam Research Corporation | Methods and apparatus for passivating a substrate in a plasma reactor |
US6008130A (en) * | 1997-08-14 | 1999-12-28 | Vlsi Technology, Inc. | Polymer adhesive plasma confinement ring |
US6019060A (en) * | 1998-06-24 | 2000-02-01 | Lam Research Corporation | Cam-based arrangement for positioning confinement rings in a plasma processing chamber |
US5998932A (en) * | 1998-06-26 | 1999-12-07 | Lam Research Corporation | Focus ring arrangement for substantially eliminating unconfined plasma in a plasma processing chamber |
JP2000030896A (en) * | 1998-07-10 | 2000-01-28 | Anelva Corp | Plasma confining device |
JP2000058512A (en) * | 1998-08-03 | 2000-02-25 | Matsushita Electric Ind Co Ltd | Device and method for plasma treatment |
US6178919B1 (en) * | 1998-12-28 | 2001-01-30 | Lam Research Corporation | Perforated plasma confinement ring in plasma reactors |
JP3632564B2 (en) * | 2000-05-17 | 2005-03-23 | セイコーエプソン株式会社 | Semiconductor wafer manufacturing method and plasma CVD apparatus |
-
2000
- 2000-08-11 US US09/637,736 patent/US6433484B1/en not_active Expired - Lifetime
-
2001
- 2001-07-31 DE DE60140766T patent/DE60140766D1/en not_active Expired - Lifetime
- 2001-07-31 JP JP2002520275A patent/JP4868693B2/en not_active Expired - Fee Related
- 2001-07-31 EP EP01959386A patent/EP1362362B1/en not_active Expired - Lifetime
- 2001-07-31 WO PCT/US2001/024103 patent/WO2002015236A2/en active Application Filing
- 2001-07-31 KR KR1020037001970A patent/KR100807133B1/en not_active IP Right Cessation
- 2001-07-31 CN CNB018166873A patent/CN1269178C/en not_active Expired - Fee Related
- 2001-07-31 AU AU2001280949A patent/AU2001280949A1/en not_active Abandoned
- 2001-08-06 TW TW090119167A patent/TWI235403B/en not_active IP Right Cessation
-
2011
- 2011-10-12 JP JP2011225071A patent/JP5566982B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1362362A2 (en) | 2003-11-19 |
TWI235403B (en) | 2005-07-01 |
EP1362362B1 (en) | 2009-12-09 |
CN1489778A (en) | 2004-04-14 |
WO2002015236A2 (en) | 2002-02-21 |
KR100807133B1 (en) | 2008-02-27 |
JP2012015552A (en) | 2012-01-19 |
CN1269178C (en) | 2006-08-09 |
JP5566982B2 (en) | 2014-08-06 |
DE60140766D1 (en) | 2010-01-21 |
JP4868693B2 (en) | 2012-02-01 |
WO2002015236A3 (en) | 2003-09-04 |
US6433484B1 (en) | 2002-08-13 |
KR20030066595A (en) | 2003-08-09 |
JP2004511085A (en) | 2004-04-08 |
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