AU2001280485A1 - A method of illuminating a photomask using chevron illumination - Google Patents
A method of illuminating a photomask using chevron illuminationInfo
- Publication number
- AU2001280485A1 AU2001280485A1 AU2001280485A AU8048501A AU2001280485A1 AU 2001280485 A1 AU2001280485 A1 AU 2001280485A1 AU 2001280485 A AU2001280485 A AU 2001280485A AU 8048501 A AU8048501 A AU 8048501A AU 2001280485 A1 AU2001280485 A1 AU 2001280485A1
- Authority
- AU
- Australia
- Prior art keywords
- photomask
- illuminating
- chevron
- illumination
- chevron illumination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/701—Off-axis setting using an aperture
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70158—Diffractive optical elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21688100P | 2000-07-07 | 2000-07-07 | |
US60216881 | 2000-07-07 | ||
PCT/US2001/021400 WO2002005029A1 (en) | 2000-07-07 | 2001-07-06 | A method of illuminating a photomask using chevron illumination |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001280485A1 true AU2001280485A1 (en) | 2002-01-21 |
Family
ID=22808841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001280485A Abandoned AU2001280485A1 (en) | 2000-07-07 | 2001-07-06 | A method of illuminating a photomask using chevron illumination |
Country Status (7)
Country | Link |
---|---|
US (1) | US7092073B2 (zh) |
EP (1) | EP1315996A4 (zh) |
JP (1) | JP3955815B2 (zh) |
KR (1) | KR100579601B1 (zh) |
CN (1) | CN1571943A (zh) |
AU (1) | AU2001280485A1 (zh) |
WO (1) | WO2002005029A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1571943A (zh) * | 2000-07-07 | 2005-01-26 | Asml荷兰有限公司 | 采用人字形照射来照射光掩模的方法 |
US7233887B2 (en) | 2002-01-18 | 2007-06-19 | Smith Bruce W | Method of photomask correction and its optimization using localized frequency analysis |
EP1467254A1 (en) * | 2003-04-07 | 2004-10-13 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US6842223B2 (en) | 2003-04-11 | 2005-01-11 | Nikon Precision Inc. | Enhanced illuminator for use in photolithographic systems |
US7423732B2 (en) * | 2004-11-04 | 2008-09-09 | Asml Holding N.V. | Lithographic apparatus and device manufacturing method utilizing placement of a patterning device at a pupil plane |
KR100675882B1 (ko) * | 2004-12-22 | 2007-02-02 | 주식회사 하이닉스반도체 | 다중투과 위상 마스크 및 이를 이용한 노광 방법 |
KR100653993B1 (ko) * | 2004-12-30 | 2006-12-05 | 주식회사 하이닉스반도체 | 다중투과 위상 마스크 및 그 제조 방법 |
KR101134174B1 (ko) | 2005-03-15 | 2012-04-09 | 칼 짜이스 에스엠티 게엠베하 | 투사 노광 방법 및 이를 위한 투사 노광 시스템 |
US20090253079A1 (en) * | 2008-04-07 | 2009-10-08 | Zhang Fenghong | Forming reverse illumination patterns |
US8233210B2 (en) * | 2008-12-30 | 2012-07-31 | Intel Corporation | Illumination aperture for optical lithography |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0682598B2 (ja) * | 1984-10-11 | 1994-10-19 | 日本電信電話株式会社 | 投影露光装置 |
US5305054A (en) * | 1991-02-22 | 1994-04-19 | Canon Kabushiki Kaisha | Imaging method for manufacture of microdevices |
JPH0536586A (ja) | 1991-08-02 | 1993-02-12 | Canon Inc | 像投影方法及び該方法を用いた半導体デバイスの製造方法 |
JP3165711B2 (ja) * | 1991-08-02 | 2001-05-14 | キヤノン株式会社 | 像投影方法及び該方法を用いた半導体デバイスの製造方法 |
JP2924344B2 (ja) * | 1991-08-09 | 1999-07-26 | キヤノン株式会社 | 投影露光装置 |
DE69233134T2 (de) * | 1991-08-22 | 2004-04-15 | Nikon Corp. | Reproduktionsverfahren mit hoher Auflösung unter Verwendung eines dem Verfahren angepassten Maskenmusters |
KR950004968B1 (ko) * | 1991-10-15 | 1995-05-16 | 가부시키가이샤 도시바 | 투영노광 장치 |
US5530518A (en) * | 1991-12-25 | 1996-06-25 | Nikon Corporation | Projection exposure apparatus |
US5447810A (en) * | 1994-02-09 | 1995-09-05 | Microunity Systems Engineering, Inc. | Masks for improved lithographic patterning for off-axis illumination lithography |
JPH07281413A (ja) * | 1994-04-05 | 1995-10-27 | Mitsubishi Electric Corp | 減衰型位相シフトマスクおよびその製造方法 |
JPH0887097A (ja) * | 1994-09-16 | 1996-04-02 | Konica Corp | 画像形成方法 |
JPH1041225A (ja) | 1996-07-24 | 1998-02-13 | Canon Inc | 照明装置及びそれを用いた投影露光装置 |
US5804336A (en) | 1996-08-13 | 1998-09-08 | Micron Technology, Inc. | Method of forming opaque border on semiconductor photomask |
US5817439A (en) * | 1997-05-15 | 1998-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of blind border pattern layout for attenuated phase shifting masks |
US6106979A (en) * | 1997-12-30 | 2000-08-22 | Micron Technology, Inc. | Use of attenuating phase-shifting mask for improved printability of clear-field patterns |
US6061606A (en) * | 1998-08-25 | 2000-05-09 | International Business Machines Corporation | Geometric phase analysis for mask alignment |
US6080527A (en) * | 1999-11-18 | 2000-06-27 | United Microelectronics Corp. | Optical proximity correction of L and T shaped patterns on negative photoresist |
CN1571943A (zh) * | 2000-07-07 | 2005-01-26 | Asml荷兰有限公司 | 采用人字形照射来照射光掩模的方法 |
-
2001
- 2001-07-06 CN CNA018152848A patent/CN1571943A/zh active Pending
- 2001-07-06 KR KR1020037000173A patent/KR100579601B1/ko not_active IP Right Cessation
- 2001-07-06 JP JP2002509830A patent/JP3955815B2/ja not_active Expired - Fee Related
- 2001-07-06 EP EP01958877A patent/EP1315996A4/en not_active Withdrawn
- 2001-07-06 US US10/312,995 patent/US7092073B2/en not_active Expired - Fee Related
- 2001-07-06 AU AU2001280485A patent/AU2001280485A1/en not_active Abandoned
- 2001-07-06 WO PCT/US2001/021400 patent/WO2002005029A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1315996A4 (en) | 2005-11-23 |
JP2004503922A (ja) | 2004-02-05 |
WO2002005029A1 (en) | 2002-01-17 |
US20040048167A1 (en) | 2004-03-11 |
CN1571943A (zh) | 2005-01-26 |
KR100579601B1 (ko) | 2006-05-12 |
JP3955815B2 (ja) | 2007-08-08 |
EP1315996A1 (en) | 2003-06-04 |
US7092073B2 (en) | 2006-08-15 |
KR20030075145A (ko) | 2003-09-22 |
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