AU2001277002A1 - Methods for manufacturing planar optical devices - Google Patents
Methods for manufacturing planar optical devicesInfo
- Publication number
- AU2001277002A1 AU2001277002A1 AU2001277002A AU7700201A AU2001277002A1 AU 2001277002 A1 AU2001277002 A1 AU 2001277002A1 AU 2001277002 A AU2001277002 A AU 2001277002A AU 7700201 A AU7700201 A AU 7700201A AU 2001277002 A1 AU2001277002 A1 AU 2001277002A1
- Authority
- AU
- Australia
- Prior art keywords
- methods
- optical devices
- planar optical
- manufacturing planar
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12097—Ridge, rib or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12147—Coupler
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/1215—Splitter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63330700A | 2000-08-07 | 2000-08-07 | |
US09/633,307 | 2000-08-07 | ||
US09/903,050 | 2001-07-10 | ||
US09/903,050 US6506289B2 (en) | 2000-08-07 | 2001-07-10 | Planar optical devices and methods for their manufacture |
PCT/US2001/022750 WO2002012932A2 (en) | 2000-08-07 | 2001-07-18 | Methods for manufacturing planar optical devices |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001277002A1 true AU2001277002A1 (en) | 2002-02-18 |
Family
ID=27091844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001277002A Abandoned AU2001277002A1 (en) | 2000-08-07 | 2001-07-18 | Methods for manufacturing planar optical devices |
Country Status (4)
Country | Link |
---|---|
US (2) | US6506289B2 (en) |
AU (1) | AU2001277002A1 (en) |
TW (1) | TW520450B (en) |
WO (1) | WO2002012932A2 (en) |
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US6210544B1 (en) | 1999-03-08 | 2001-04-03 | Alps Electric Co., Ltd. | Magnetic film forming method |
US6416598B1 (en) | 1999-04-20 | 2002-07-09 | Reynolds Metals Company | Free machining aluminum alloy with high melting point machining constituent and method of use |
JP2001020065A (en) | 1999-07-07 | 2001-01-23 | Hitachi Metals Ltd | Target for sputtering, its production and high melting point metal powder material |
JP4240679B2 (en) | 1999-09-21 | 2009-03-18 | ソニー株式会社 | Method for producing sputtering target |
US6410471B2 (en) | 2000-03-07 | 2002-06-25 | Shin-Etsu Chemical Co., Ltd. | Method for preparation of sintered body of rare earth oxide |
US20020106297A1 (en) | 2000-12-01 | 2002-08-08 | Hitachi Metals, Ltd. | Co-base target and method of producing the same |
US6797137B2 (en) | 2001-04-11 | 2004-09-28 | Heraeus, Inc. | Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidfied alloy powders and elemental Pt metal |
US20030175142A1 (en) | 2002-03-16 | 2003-09-18 | Vassiliki Milonopoulou | Rare-earth pre-alloyed PVD targets for dielectric planar applications |
-
2001
- 2001-07-10 US US09/903,050 patent/US6506289B2/en not_active Expired - Lifetime
- 2001-07-18 WO PCT/US2001/022750 patent/WO2002012932A2/en active Application Filing
- 2001-07-18 AU AU2001277002A patent/AU2001277002A1/en not_active Abandoned
- 2001-08-06 TW TW090119173A patent/TW520450B/en active
-
2002
- 2002-11-04 US US10/288,278 patent/US6827826B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6506289B2 (en) | 2003-01-14 |
US20020033330A1 (en) | 2002-03-21 |
US20030127319A1 (en) | 2003-07-10 |
WO2002012932A2 (en) | 2002-02-14 |
WO2002012932A3 (en) | 2002-10-03 |
US6827826B2 (en) | 2004-12-07 |
TW520450B (en) | 2003-02-11 |
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