AU2001268554A1 - Electrostatic methods and apparatus for mounting and demounting particles from asurface having an array of tacky and non-tacky areas - Google Patents
Electrostatic methods and apparatus for mounting and demounting particles from asurface having an array of tacky and non-tacky areasInfo
- Publication number
- AU2001268554A1 AU2001268554A1 AU2001268554A AU6855401A AU2001268554A1 AU 2001268554 A1 AU2001268554 A1 AU 2001268554A1 AU 2001268554 A AU2001268554 A AU 2001268554A AU 6855401 A AU6855401 A AU 6855401A AU 2001268554 A1 AU2001268554 A1 AU 2001268554A1
- Authority
- AU
- Australia
- Prior art keywords
- tacky
- asurface
- demounting
- array
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
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- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
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- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21312800P | 2000-06-22 | 2000-06-22 | |
US60213128 | 2000-06-22 | ||
PCT/US2001/019524 WO2002001930A2 (en) | 2000-06-22 | 2001-06-19 | Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001268554A1 true AU2001268554A1 (en) | 2002-01-08 |
Family
ID=22793826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001268554A Abandoned AU2001268554A1 (en) | 2000-06-22 | 2001-06-19 | Electrostatic methods and apparatus for mounting and demounting particles from asurface having an array of tacky and non-tacky areas |
Country Status (3)
Country | Link |
---|---|
US (4) | US6540127B2 (en) |
AU (1) | AU2001268554A1 (en) |
WO (1) | WO2002001930A2 (en) |
Families Citing this family (22)
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US7662468B2 (en) * | 2000-10-06 | 2010-02-16 | Brock Usa, Llc | Composite materials made from pretreated, adhesive coated beads |
JP3737697B2 (en) * | 2000-11-30 | 2006-01-18 | 株式会社湯山製作所 | Carryer display member writing device |
JP5248772B2 (en) * | 2003-07-09 | 2013-07-31 | フライズ メタルズ インコーポレイテッド | Deposition and patterning methods |
US7244477B2 (en) * | 2003-08-20 | 2007-07-17 | Brock Usa, Llc | Multi-layered sports playing field with a water draining, padding layer |
US20050089678A1 (en) * | 2003-08-20 | 2005-04-28 | Mead Steven R. | Multi-layered floorig composite including an acoustic underlayment |
EP1737600B1 (en) * | 2004-03-31 | 2008-08-27 | Applied Materials, Inc. | Method and apparatus for transferring conductive pieces during semiconductor device fabrication |
JP4035733B2 (en) * | 2005-01-19 | 2008-01-23 | セイコーエプソン株式会社 | Manufacturing method of semiconductor device and processing method of electrical connection part |
JP4576270B2 (en) * | 2005-03-29 | 2010-11-04 | 昭和電工株式会社 | Method for manufacturing solder circuit board |
WO2007007865A1 (en) | 2005-07-11 | 2007-01-18 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
WO2007029866A1 (en) * | 2005-09-09 | 2007-03-15 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board |
US7813105B2 (en) * | 2006-06-06 | 2010-10-12 | Adc Tech International Ltd. | Multi-layer capacitor |
EP2047725A4 (en) * | 2006-08-03 | 2010-05-26 | Showa Denko Kk | Production method of solder circuit board |
US20080098659A1 (en) * | 2006-10-26 | 2008-05-01 | Chien-Min Sung | Methods for securing individual abrasive particles to a substrate in a predetermined pattern |
JP4920401B2 (en) * | 2006-12-27 | 2012-04-18 | 昭和電工株式会社 | Method for manufacturing conductive circuit board |
US7703662B2 (en) | 2007-03-07 | 2010-04-27 | Shinko Electric Industries Co., Ltd. | Conductive ball mounting apparatus and conductive ball mounting method |
JP4219968B2 (en) | 2007-03-07 | 2009-02-04 | 新光電気工業株式会社 | Conductive ball mounting device |
US7829451B2 (en) | 2007-07-18 | 2010-11-09 | Shinko Electric Industries Co., Ltd. | Conductive ball mounting method and apparatus having a movable solder ball container |
US20090278213A1 (en) * | 2008-05-08 | 2009-11-12 | International Business Machines Corporation | Electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array |
US7780063B2 (en) * | 2008-05-15 | 2010-08-24 | International Business Machines Corporation | Techniques for arranging solder balls and forming bumps |
US20130146613A1 (en) | 2010-06-07 | 2013-06-13 | Eduard Balthes | Safety system with a transponder and a reading device of an rfid system |
US8875978B2 (en) * | 2012-02-11 | 2014-11-04 | International Business Machines Corporation | Forming constant diameter spherical metal balls |
US11631650B2 (en) | 2021-06-15 | 2023-04-18 | International Business Machines Corporation | Solder transfer integrated circuit packaging |
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2001
- 2001-06-07 US US09/876,237 patent/US6540127B2/en not_active Expired - Fee Related
- 2001-06-19 AU AU2001268554A patent/AU2001268554A1/en not_active Abandoned
- 2001-06-19 WO PCT/US2001/019524 patent/WO2002001930A2/en active Application Filing
-
2002
- 2002-12-17 US US10/322,283 patent/US6871777B2/en not_active Expired - Fee Related
-
2004
- 2004-01-07 US US10/753,738 patent/US7191930B2/en not_active Expired - Fee Related
-
2007
- 2007-02-12 US US11/705,949 patent/US20070145103A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20030106925A1 (en) | 2003-06-12 |
US6540127B2 (en) | 2003-04-01 |
US20020018859A1 (en) | 2002-02-14 |
WO2002001930A3 (en) | 2002-05-23 |
US6871777B2 (en) | 2005-03-29 |
US20070145103A1 (en) | 2007-06-28 |
WO2002001930A2 (en) | 2002-01-03 |
US20040146659A1 (en) | 2004-07-29 |
US7191930B2 (en) | 2007-03-20 |
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