AU2001264795A1 - Porous heat sink for forced convective flow and method of making therefore - Google Patents
Porous heat sink for forced convective flow and method of making thereforeInfo
- Publication number
- AU2001264795A1 AU2001264795A1 AU2001264795A AU6479501A AU2001264795A1 AU 2001264795 A1 AU2001264795 A1 AU 2001264795A1 AU 2001264795 A AU2001264795 A AU 2001264795A AU 6479501 A AU6479501 A AU 6479501A AU 2001264795 A1 AU2001264795 A1 AU 2001264795A1
- Authority
- AU
- Australia
- Prior art keywords
- making
- heat sink
- porous heat
- convective flow
- forced convective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
- B22F7/004—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature comprising at least one non-porous part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20676200P | 2000-05-22 | 2000-05-22 | |
US60206762 | 2000-05-22 | ||
PCT/US2001/016539 WO2001089745A1 (en) | 2000-05-22 | 2001-05-22 | Porous heat sink for forced convective flow and method of making therefore |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001264795A1 true AU2001264795A1 (en) | 2001-12-03 |
Family
ID=22767837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001264795A Abandoned AU2001264795A1 (en) | 2000-05-22 | 2001-05-22 | Porous heat sink for forced convective flow and method of making therefore |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2001264795A1 (en) |
WO (1) | WO2001089745A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10343020B4 (en) * | 2003-09-16 | 2018-01-18 | Mayser Holding Gmbh & Co. Kg | Heatsink, especially for electronic components |
DE102011078674A1 (en) * | 2011-07-05 | 2013-01-10 | Siemens Aktiengesellschaft | cooling component |
JP6562885B2 (en) * | 2016-10-24 | 2019-08-21 | 株式会社ロータス・サーマル・ソリューション | Heat sink, cooling device including the heat sink, method for manufacturing the heat sink, and method for cooling an object to be cooled |
DE102018214539B3 (en) | 2018-08-28 | 2019-12-19 | Continental Automotive Gmbh | Cooling device for components in a vehicle |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4019021A (en) * | 1964-07-28 | 1977-04-19 | Schladitz-Whiskers, A.G. | Electric resistance fluid heating apparatus |
US3762011A (en) * | 1971-12-16 | 1973-10-02 | Trw Inc | Method of fabricating a capillary heat pipe wick |
US4381818A (en) * | 1977-12-19 | 1983-05-03 | International Business Machines Corporation | Porous film heat transfer |
US4885129A (en) * | 1988-10-24 | 1989-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks |
US4929414A (en) * | 1988-10-24 | 1990-05-29 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks and arteries |
-
2001
- 2001-05-22 WO PCT/US2001/016539 patent/WO2001089745A1/en active Application Filing
- 2001-05-22 AU AU2001264795A patent/AU2001264795A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001089745A1 (en) | 2001-11-29 |
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