AU2001263321A1 - Flexible piezoelectric chuck - Google Patents
Flexible piezoelectric chuckInfo
- Publication number
- AU2001263321A1 AU2001263321A1 AU2001263321A AU6332101A AU2001263321A1 AU 2001263321 A1 AU2001263321 A1 AU 2001263321A1 AU 2001263321 A AU2001263321 A AU 2001263321A AU 6332101 A AU6332101 A AU 6332101A AU 2001263321 A1 AU2001263321 A1 AU 2001263321A1
- Authority
- AU
- Australia
- Prior art keywords
- flexible piezoelectric
- piezoelectric chuck
- chuck
- flexible
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/575,998 US6556281B1 (en) | 2000-05-23 | 2000-05-23 | Flexible piezoelectric chuck and method of using the same |
US09/575,998 | 2000-05-23 | ||
PCT/US2001/016308 WO2001090820A1 (en) | 2000-05-23 | 2001-05-22 | Flexible piezoelectric chuck |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001263321A1 true AU2001263321A1 (en) | 2001-12-03 |
Family
ID=24302562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001263321A Abandoned AU2001263321A1 (en) | 2000-05-23 | 2001-05-22 | Flexible piezoelectric chuck |
Country Status (6)
Country | Link |
---|---|
US (1) | US6556281B1 (en) |
EP (1) | EP1203266A1 (en) |
JP (2) | JP2003534653A (en) |
KR (1) | KR100699402B1 (en) |
AU (1) | AU2001263321A1 (en) |
WO (1) | WO2001090820A1 (en) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6556281B1 (en) | 2000-05-23 | 2003-04-29 | Asml Us, Inc. | Flexible piezoelectric chuck and method of using the same |
US6847433B2 (en) * | 2001-06-01 | 2005-01-25 | Agere Systems, Inc. | Holder, system, and process for improving overlay in lithography |
TWI227752B (en) * | 2002-07-01 | 2005-02-11 | Macronix Int Co Ltd | Method for decreasing number of particles during etching process and the etching process |
SG108996A1 (en) | 2003-07-23 | 2005-02-28 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
US7224504B2 (en) | 2003-07-30 | 2007-05-29 | Asml Holding N. V. | Deformable mirror using piezoelectric actuators formed as an integrated circuit and method of use |
EP1507173B1 (en) * | 2003-08-12 | 2011-05-25 | ASML Netherlands B.V. | Lithographic apparatus and apparatus adjustment method |
EP1507172A1 (en) | 2003-08-12 | 2005-02-16 | ASML Netherlands B.V. | Lithographic apparatus and apparatus adjustment method |
EP2267535A1 (en) * | 2003-11-05 | 2010-12-29 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
JP4583141B2 (en) * | 2004-11-05 | 2010-11-17 | 株式会社アルバック | Split electrostatic chuck structure |
CN101084471B (en) * | 2004-12-23 | 2012-08-29 | Asml荷兰有限公司 | Support structure and lithographic apparatus |
US7508494B2 (en) * | 2006-12-22 | 2009-03-24 | Asml Netherlands B.V. | Lithographic apparatus and a subtrate table for exciting a shockwave in a substrate |
US7678458B2 (en) * | 2007-01-24 | 2010-03-16 | Asml Holding N.V. | Bonding silicon silicon carbide to glass ceramics |
US7875528B2 (en) * | 2007-02-07 | 2011-01-25 | International Business Machines Corporation | Method, system, program product for bonding two circuitry-including substrates and related stage |
DE102008052100B4 (en) | 2008-10-08 | 2015-10-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Flexibly deformable holding element for substrates |
DE102008054072B4 (en) * | 2008-10-31 | 2017-06-08 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Self-correcting substrate holding system for focus control in exposure systems, exposure system and method of exposing a substrate |
JP2010182866A (en) * | 2009-02-05 | 2010-08-19 | Nikon Corp | Electrostatic attraction holding device, aligner, exposure method, and method of manufacturing device |
DE102009018434B4 (en) * | 2009-04-22 | 2023-11-30 | Ev Group Gmbh | Receiving device for holding semiconductor substrates |
US20120026480A1 (en) * | 2010-07-26 | 2012-02-02 | Asml Netherlands B.V. | Image-Compensating Addressable Electrostatic Chuck System |
DE102010048620B4 (en) * | 2010-10-15 | 2013-03-28 | Epcos Ag | Electrode, microacoustic component and method of manufacturing an electrode |
KR20140065376A (en) * | 2011-02-25 | 2014-05-29 | 가부시키가이샤 니콘 | Observation device, inspection device, method for manufacturing semiconductor device, and substrate support member |
EP3886149A1 (en) * | 2011-08-12 | 2021-09-29 | EV Group E. Thallner GmbH | Method and device for bonding substrates |
WO2013023708A1 (en) * | 2011-08-12 | 2013-02-21 | Ev Group E. Thallner Gmbh | Apparatus and method for bonding substrates |
US9195150B2 (en) | 2012-02-06 | 2015-11-24 | Asml Netherlands B.V. | Lithographic apparatus comprising a support for holding an object, and a support for use therein |
JP5912654B2 (en) * | 2012-02-24 | 2016-04-27 | 株式会社東芝 | Substrate holding device, pattern transfer device, and pattern transfer method |
CN108604568B (en) * | 2016-01-19 | 2023-10-10 | 因特瓦克公司 | Patterning chuck for substrate processing |
EP3611770A1 (en) * | 2018-08-16 | 2020-02-19 | ASML Netherlands B.V. | Piezoelectric actuator, actuator system, substrate support and lithographic apparatus including the actuator |
JP7108585B2 (en) * | 2019-08-16 | 2022-07-28 | 日本特殊陶業株式会社 | holding device |
US11728203B2 (en) | 2020-10-13 | 2023-08-15 | Canon Kabushiki Kaisha | Chuck assembly, planarization process, apparatus and method of manufacturing an article |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3110341C2 (en) | 1980-03-19 | 1983-11-17 | Hitachi, Ltd., Tokyo | Method and apparatus for aligning a thin substrate in the image plane of a copier |
JPS57204547A (en) * | 1981-06-12 | 1982-12-15 | Hitachi Ltd | Exposing method |
JPS5867026A (en) | 1981-10-19 | 1983-04-21 | Hitachi Ltd | Thin plate metamorphosis device |
US4504144A (en) | 1982-07-06 | 1985-03-12 | The Perkin-Elmer Corporation | Simple electromechanical tilt and focus device |
US4530635A (en) | 1983-06-15 | 1985-07-23 | The Perkin-Elmer Corporation | Wafer transferring chuck assembly |
JPS60177834A (en) * | 1984-01-10 | 1985-09-11 | ヒューレット・パッカード・カンパニー | Deformable chuck driven by piezoelectric means |
KR900001241B1 (en) * | 1985-04-17 | 1990-03-05 | 가부시기가이샤 히다찌세이사꾸쇼 | Light exposure apparatus |
US4846626A (en) | 1987-02-09 | 1989-07-11 | The Perkin-Elmer Corporation | Wafer handling system |
US4973217A (en) | 1987-02-09 | 1990-11-27 | Svg Lithography Systems, Inc. | Wafer handling system |
US5094536A (en) | 1990-11-05 | 1992-03-10 | Litel Instruments | Deformable wafer chuck |
JPH04255245A (en) * | 1991-02-06 | 1992-09-10 | Toto Ltd | Piezoelectric stage |
JPH04255244A (en) | 1991-02-06 | 1992-09-10 | Toto Ltd | Piezoelectric stage |
JPH04336928A (en) | 1991-05-14 | 1992-11-25 | Toto Ltd | Piezoelectric stage |
US5202748A (en) | 1991-06-07 | 1993-04-13 | Litel Instruments | In situ process control system for steppers |
JP3012069B2 (en) | 1991-12-04 | 2000-02-21 | キヤノン株式会社 | X-ray exposure mask structure and X-ray exposure apparatus using the same |
US5563684A (en) | 1994-11-30 | 1996-10-08 | Sgs-Thomson Microelectronics, Inc. | Adaptive wafer modulator for placing a selected pattern on a semiconductor wafer |
JP3729425B2 (en) * | 1996-03-05 | 2005-12-21 | キヤノン株式会社 | Stage device, substrate delivery method, and semiconductor manufacturing apparatus |
JP3814359B2 (en) * | 1996-03-12 | 2006-08-30 | キヤノン株式会社 | X-ray projection exposure apparatus and device manufacturing method |
JP2821678B2 (en) * | 1997-04-07 | 1998-11-05 | 株式会社ニコン | Substrate suction device |
US6556281B1 (en) | 2000-05-23 | 2003-04-29 | Asml Us, Inc. | Flexible piezoelectric chuck and method of using the same |
-
2000
- 2000-05-23 US US09/575,998 patent/US6556281B1/en not_active Expired - Lifetime
-
2001
- 2001-05-22 KR KR1020027000900A patent/KR100699402B1/en active IP Right Grant
- 2001-05-22 AU AU2001263321A patent/AU2001263321A1/en not_active Abandoned
- 2001-05-22 JP JP2001586528A patent/JP2003534653A/en active Pending
- 2001-05-22 EP EP01937606A patent/EP1203266A1/en not_active Ceased
- 2001-05-22 WO PCT/US2001/016308 patent/WO2001090820A1/en active Application Filing
-
2009
- 2009-02-18 JP JP2009035493A patent/JP4734433B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009158966A (en) | 2009-07-16 |
EP1203266A1 (en) | 2002-05-08 |
WO2001090820A1 (en) | 2001-11-29 |
JP2003534653A (en) | 2003-11-18 |
JP4734433B2 (en) | 2011-07-27 |
KR100699402B1 (en) | 2007-03-26 |
WO2001090820A9 (en) | 2002-10-10 |
KR20020060685A (en) | 2002-07-18 |
US6556281B1 (en) | 2003-04-29 |
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