AU2001263023A1 - Shock resistant variable load tolerant wafer shipper - Google Patents

Shock resistant variable load tolerant wafer shipper

Info

Publication number
AU2001263023A1
AU2001263023A1 AU2001263023A AU6302301A AU2001263023A1 AU 2001263023 A1 AU2001263023 A1 AU 2001263023A1 AU 2001263023 A AU2001263023 A AU 2001263023A AU 6302301 A AU6302301 A AU 6302301A AU 2001263023 A1 AU2001263023 A1 AU 2001263023A1
Authority
AU
Australia
Prior art keywords
variable load
shock resistant
wafer shipper
resistant variable
load tolerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001263023A
Inventor
Gregory W. Bores
Ralph Henderer
Michael C. Zabka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fluoroware Inc
Original Assignee
Fluoroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluoroware Inc filed Critical Fluoroware Inc
Publication of AU2001263023A1 publication Critical patent/AU2001263023A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
AU2001263023A 2000-05-09 2001-05-10 Shock resistant variable load tolerant wafer shipper Abandoned AU2001263023A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US20258500P 2000-05-09 2000-05-09
US60202585 2000-05-09
US21765600P 2000-07-10 2000-07-10
US60217656 2000-07-10
US09851499 2001-05-08
US09/851,499 US6550619B2 (en) 2000-05-09 2001-05-08 Shock resistant variable load tolerant wafer shipper
PCT/US2001/015020 WO2001092135A1 (en) 2000-05-09 2001-05-09 Shock resistant variable load tolerant wafer shipper

Publications (1)

Publication Number Publication Date
AU2001263023A1 true AU2001263023A1 (en) 2001-12-11

Family

ID=27394447

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001263023A Abandoned AU2001263023A1 (en) 2000-05-09 2001-05-10 Shock resistant variable load tolerant wafer shipper

Country Status (4)

Country Link
US (1) US6550619B2 (en)
EP (1) EP1289860A4 (en)
AU (1) AU2001263023A1 (en)
WO (1) WO2001092135A1 (en)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848579B2 (en) * 1999-10-25 2005-02-01 Brian Cleaver Shock absorbing apparatus and method
US7040487B2 (en) * 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
US7059475B2 (en) * 2001-10-04 2006-06-13 Entegris, Inc. System for cushioning wafer in wafer carrier
US7147107B2 (en) * 2003-03-11 2006-12-12 E.Pak International, Inc. Packaging platform having an adjustable thickness
US6988621B2 (en) * 2003-06-17 2006-01-24 Illinois Tool Works Inc. Reduced movement wafer box
US7131248B2 (en) * 2003-07-14 2006-11-07 Peak Plastic & Metal Products (Int'l) Limited Wafer shipper with orientation control
US6915906B2 (en) * 2003-07-14 2005-07-12 Peak Plastic & Metal Products (International) Limited Wafer storage container with wafer positioning posts
US20050098473A1 (en) * 2003-11-10 2005-05-12 3M Innovative Properties Company Container for containing semiconductor wafers
JP2006001647A (en) * 2004-05-18 2006-01-05 Sumitomo Electric Ind Ltd Container, packaging member, container manufacturing method, packaging member manufacturing method and compound semiconductor substrate
US20060000747A1 (en) * 2004-06-30 2006-01-05 3M Innovative Properties Company Shipping container for integrated circuit wafers
WO2006016883A1 (en) * 2004-07-13 2006-02-16 Illinois Tool Works Inc. Scribed interleaf separator wafer packaging
US6933033B1 (en) * 2004-07-13 2005-08-23 Illinois Tool Works Inc. Scribed interleaf separator wafer packaging
US7607543B2 (en) * 2005-02-27 2009-10-27 Entegris, Inc. Reticle pod with isolation system
JP2006303246A (en) * 2005-04-21 2006-11-02 Miraial Kk Sheet storing container
US7431162B2 (en) * 2005-07-15 2008-10-07 Illinois Tool Works Inc. Shock absorbing horizontal transport wafer box
WO2007092557A2 (en) * 2006-02-08 2007-08-16 Entegris, Inc. Stacking rings for wafers
US20070187286A1 (en) * 2006-02-16 2007-08-16 Pylant James D Wafer storage container and apparatus
JP4716928B2 (en) * 2006-06-07 2011-07-06 信越ポリマー株式会社 Wafer storage container
US20080121559A1 (en) * 2006-11-07 2008-05-29 Hannes Friedrich Packaging for electronic components, especially for tape-n-reels
US20080173569A1 (en) * 2007-01-23 2008-07-24 Illinois Tool Works Inc. Pedestal pocket tray containment system for integrated circuit chips
EP2209726A4 (en) * 2007-10-12 2012-08-15 Peak Plastic & Metal Prod Wafer container with staggered wall structure
US8212443B2 (en) * 2007-11-14 2012-07-03 Delta Electronics, Inc. Motor and housing thereof
US8393471B2 (en) * 2008-04-18 2013-03-12 Texas Instruments Incorporated Packing insert for disc-shaped objects
US8813964B2 (en) * 2009-08-26 2014-08-26 Texchem Advanced Products Incorporated Sdn. Bhd. Wafer container with recessed latch
US8556079B2 (en) * 2009-08-26 2013-10-15 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with adjustable inside diameter
US8109390B2 (en) * 2009-08-26 2012-02-07 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with overlapping wall structure
US9224627B2 (en) * 2011-02-16 2015-12-29 Texchem Advanced Products Incorporated Sdn Bhd Single and dual stage wafer cushion and wafer separator
US20140174497A1 (en) * 2012-12-21 2014-06-26 Xiuwen Tu Packing of solar cell wafers
CN106463437B (en) * 2014-02-25 2019-09-06 恩特格里斯公司 Chip conveying device with stack support ring
EP3231009B1 (en) * 2014-12-08 2021-07-07 Entegris, Inc. Horizontal substrate container with integral corner spring for substrate containment
TWI690468B (en) 2015-07-13 2020-04-11 美商恩特葛瑞斯股份有限公司 Substrate container with enhanced containment
US10832927B2 (en) * 2015-12-18 2020-11-10 Texas Instruments Incorporated Interlocking nest wafer protector
TWI729070B (en) * 2016-02-09 2021-06-01 美商恩特葛瑞斯股份有限公司 Substrate shipper
JP6686914B2 (en) * 2017-01-12 2020-04-22 株式会社ダイフク Goods storage facility
EP3806138B1 (en) * 2019-10-09 2022-11-30 Infineon Technologies AG Transport system
KR102595523B1 (en) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 Waper shipping box
WO2023168663A1 (en) * 2022-03-10 2023-09-14 Innoscience (suzhou) Semiconductor Co., Ltd. Wafer holder and operating method thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3552548A (en) 1968-08-05 1971-01-05 Fluroware Inc Wafer storage and shipping container
US3850296A (en) 1971-07-21 1974-11-26 Shinetsu Handotai Kk Device and method for accommodating semiconductor wafers
US4135625A (en) 1976-07-12 1979-01-23 Merrill Kenneth V Multi-compartment container for fragile disks
US4817799A (en) 1986-10-06 1989-04-04 Empak, Inc. Disk package
IT209910Z2 (en) 1987-02-06 1988-11-04 Sgs Microelettronica Spa WAFER HOLDER OR SLICE HURRY, USED FOR THE VACUUM STORAGE AND / OR SHIPMENT OF THE SAME.
JP2978192B2 (en) 1990-02-19 1999-11-15 株式会社ピュアレックス Semiconductor wafer sample preparation method
FR2663003B1 (en) 1990-06-12 1992-09-11 Sgs Thomson Microelectronics CONTAINER FOR SEMICONDUCTOR WAFER.
JP2563802Y2 (en) 1992-08-28 1998-02-25 信越ポリマー株式会社 Precision processed thin plate storage container
US5366079A (en) 1993-08-19 1994-11-22 Taiwan Semiconductor Manufacturing Company Integrated circuit wafer and retainer element combination
US5454468A (en) 1994-03-11 1995-10-03 United Microelectronics Corp. Wafer container
US5474177A (en) 1994-10-14 1995-12-12 Capitol Vial, Inc. Container for a wafer chip
US5553711A (en) 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
US5724748A (en) 1996-07-24 1998-03-10 Brooks; Ray G. Apparatus for packaging contaminant-sensitive articles and resulting package
SE508596C2 (en) * 1996-11-13 1998-10-19 Aga Ab Method of brazing by plasma
US6193090B1 (en) * 1999-04-06 2001-02-27 3M Innovative Properties Company Reusable container
US6286684B1 (en) * 1999-07-23 2001-09-11 Ray G. Brooks Protective system for integrated circuit (IC) wafers retained within containers designed for storage and shipment

Also Published As

Publication number Publication date
WO2001092135A8 (en) 2002-06-20
WO2001092135A1 (en) 2001-12-06
EP1289860A1 (en) 2003-03-12
EP1289860A4 (en) 2007-03-07
US20020014435A1 (en) 2002-02-07
US6550619B2 (en) 2003-04-22

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