AU2001261576A1 - Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site - Google Patents

Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site

Info

Publication number
AU2001261576A1
AU2001261576A1 AU2001261576A AU6157601A AU2001261576A1 AU 2001261576 A1 AU2001261576 A1 AU 2001261576A1 AU 2001261576 A AU2001261576 A AU 2001261576A AU 6157601 A AU6157601 A AU 6157601A AU 2001261576 A1 AU2001261576 A1 AU 2001261576A1
Authority
AU
Australia
Prior art keywords
processing
laser
waist
laser beam
precisely positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001261576A
Inventor
Steven P. Cahill
Jonathan S. Ehrmann
Bradley L. Hunter
Michael Plotkin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Scanning Inc
Original Assignee
GEN SCANNING Inc
General Scanning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24289927&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2001261576(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by GEN SCANNING Inc, General Scanning Inc filed Critical GEN SCANNING Inc
Publication of AU2001261576A1 publication Critical patent/AU2001261576A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70041—Production of exposure light, i.e. light sources by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Processing (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
AU2001261576A 2000-05-16 2001-05-15 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site Abandoned AU2001261576A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/572,925 US6483071B1 (en) 2000-05-16 2000-05-16 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
US09/572,925 2000-05-16
PCT/US2001/015552 WO2001087534A2 (en) 2000-05-16 2001-05-15 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site

Publications (1)

Publication Number Publication Date
AU2001261576A1 true AU2001261576A1 (en) 2001-11-26

Family

ID=24289927

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001261576A Abandoned AU2001261576A1 (en) 2000-05-16 2001-05-15 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site

Country Status (6)

Country Link
US (6) US6483071B1 (en)
JP (1) JP2003533876A (en)
KR (1) KR100883386B1 (en)
AU (1) AU2001261576A1 (en)
TW (1) TW494041B (en)
WO (1) WO2001087534A2 (en)

Families Citing this family (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7723642B2 (en) 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
US7838794B2 (en) 1999-12-28 2010-11-23 Gsi Group Corporation Laser-based method and system for removing one or more target link structures
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
US7671295B2 (en) 2000-01-10 2010-03-02 Electro Scientific Industries, Inc. Processing a memory link with a set of at least two laser pulses
US20030024913A1 (en) * 2002-04-15 2003-02-06 Downes Joseph P. Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
US6483071B1 (en) * 2000-05-16 2002-11-19 General Scanning Inc. Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
US20040111174A1 (en) * 2000-05-16 2004-06-10 Gsi Lumonics Corporation Method and subsystem for determining a sequence in which microstructures are to be processed at a laser-processing site
US7311893B2 (en) 2000-07-25 2007-12-25 Neurochem (International) Limited Amyloid targeting imaging agents and uses thereof
US6720567B2 (en) 2001-01-30 2004-04-13 Gsi Lumonics Corporation Apparatus and method for focal point control for laser machining
EP1238745A3 (en) * 2001-03-07 2004-06-30 Nec Corporation Galvanometer controller and laser machining apparatus
US7027233B2 (en) * 2001-10-12 2006-04-11 Intralase Corp. Closed-loop focal positioning system and method
US6751033B2 (en) * 2001-10-12 2004-06-15 Intralase Corp. Closed-loop focal positioning system and method
US7634129B2 (en) * 2001-12-28 2009-12-15 Rudolph Technologies, Inc. Dual-axis scanning system and method
US7563695B2 (en) * 2002-03-27 2009-07-21 Gsi Group Corporation Method and system for high-speed precise laser trimming and scan lens for use therein
US6951995B2 (en) 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
US20040144760A1 (en) * 2002-05-17 2004-07-29 Cahill Steven P. Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein
US20030227614A1 (en) * 2002-06-05 2003-12-11 Taminiau August A. Laser machining apparatus with automatic focusing
US6960740B2 (en) * 2002-09-13 2005-11-01 Tamicare Ltd. Laser modification of complex objects
GB2400063B (en) 2003-04-03 2006-02-15 Exitech Ltd Positioning method and apparatus and a product thereof
JP2005028423A (en) * 2003-07-09 2005-02-03 Disco Abrasive Syst Ltd Laser beam machining method and device
US7521651B2 (en) 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
CN100544877C (en) * 2003-10-17 2009-09-30 通明国际科技公司 Flexible scan field
EP1550527A1 (en) * 2003-12-30 2005-07-06 Advanced Laser Separation International (ALSI) B.V. Method of and arrangement for separating semiconductor elements formed in a wafer of semiconductor material, and semiconductor element separated therewith
US7184123B2 (en) * 2004-03-24 2007-02-27 Asml Netherlands B.V. Lithographic optical system
US8383982B2 (en) * 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
US20060000814A1 (en) 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US6984803B1 (en) 2004-09-09 2006-01-10 Epilog Corporation Low profile laser assembly
US7066788B2 (en) * 2004-11-10 2006-06-27 Ultra Tec Manufacturing, Inc. Electronic die positioning device and method
US7705268B2 (en) * 2004-11-11 2010-04-27 Gsi Group Corporation Method and system for laser soft marking
US20060189091A1 (en) * 2004-11-11 2006-08-24 Bo Gu Method and system for laser hard marking
GB0427104D0 (en) * 2004-12-10 2005-01-12 Exitech Ltd Positioning device
DE102005001608B4 (en) * 2005-01-12 2007-08-23 Faurecia Innenraum Systeme Gmbh Apparatus and method for processing a motor vehicle interior trim part
US7363180B2 (en) * 2005-02-15 2008-04-22 Electro Scientific Industries, Inc. Method for correcting systematic errors in a laser processing system
US7466466B2 (en) * 2005-05-11 2008-12-16 Gsi Group Corporation Optical scanning method and system and method for correcting optical aberrations introduced into the system by a beam deflector
US7318778B2 (en) * 2005-06-11 2008-01-15 Owens Mark R Golf putter with removable laser
US7315038B2 (en) * 2005-08-26 2008-01-01 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target
US7297972B2 (en) * 2005-08-26 2007-11-20 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
JP5013699B2 (en) * 2005-10-21 2012-08-29 株式会社キーエンス Three-dimensional machining data setting device, three-dimensional machining data setting method, three-dimensional machining data setting program, computer-readable recording medium, recorded device, and laser machining device
CN1954954A (en) * 2005-10-27 2007-05-02 鸿富锦精密工业（深圳）有限公司 Mould processing device
US20070106285A1 (en) 2005-11-09 2007-05-10 Ferenc Raksi Laser scanner
US20070117227A1 (en) * 2005-11-23 2007-05-24 Gsi Group Corporation Method And System for Iteratively, Selectively Tuning A Parameter Of A Doped Workpiece Using A Pulsed Laser
US7724351B2 (en) 2006-01-30 2010-05-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and exchangeable optical element
US20070219541A1 (en) * 2006-03-14 2007-09-20 Intralase Corp. System and method for ophthalmic laser surgery on a cornea
US7538960B2 (en) * 2006-03-14 2009-05-26 Quality Vision International, Inc. Air bearing guided zoom lens for metrological measurements
US20070215575A1 (en) * 2006-03-15 2007-09-20 Bo Gu Method and system for high-speed, precise, laser-based modification of one or more electrical elements
DE102006019917B4 (en) * 2006-04-28 2013-10-10 Airbus Operations Gmbh Method and device for ensuring the dimensional accuracy of multi-segment structural structures during assembly
US20070106416A1 (en) 2006-06-05 2007-05-10 Griffiths Joseph J Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same
WO2007150009A1 (en) * 2006-06-23 2007-12-27 Gsi Group Corporation System and method for semiconductor wafer processing
JP5132900B2 (en) * 2006-06-28 2013-01-30 株式会社キーエンス Laser processing condition setting device, laser processing device, laser processing condition setting method, laser processing condition setting program
JP4958489B2 (en) * 2006-06-30 2012-06-20 株式会社キーエンス Laser processing device, laser processing condition setting device, laser processing condition setting method, laser processing condition setting program
US8084706B2 (en) * 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
JP4795886B2 (en) 2006-07-27 2011-10-19 株式会社キーエンス Laser processing device, laser processing condition setting device, laser processing condition setting method, laser processing condition setting program
DE102007028570A1 (en) * 2006-08-30 2008-03-27 Thyssenkrupp Steel Ag Device for processing workpieces with the help of a laser beam, comprises means, which directs laser beam and is equipped with a focusing lens system and stationary means for deflecting laser beam and focusing lens system
US7732731B2 (en) * 2006-09-15 2010-06-08 Gsi Group Corporation Method and system for laser processing targets of different types on a workpiece
JP4956107B2 (en) * 2006-09-15 2012-06-20 株式会社キーエンス Laser processing data generation apparatus, laser processing data generation method, computer program, and laser marking system
FR2908190A1 (en) * 2006-11-02 2008-05-09 Capa Electronic Sarl Laser source i.e. laser beam, focusing device for use in e.g. welding robot, has divergent lens moving for modifying magnification of image in work plane without changing distance between laser source and position of work plane
DE102006051555A1 (en) * 2006-11-02 2008-05-08 Manz Automation Ag Process for structuring a thin-film solar module
CN101578155B (en) * 2007-01-05 2013-05-01 杰斯集团公司 System and method for multi-pulse laser processing
US7760331B2 (en) * 2007-02-20 2010-07-20 Electro Scientific Industries, Inc. Decoupled, multiple stage positioning system
US8278595B2 (en) * 2007-03-16 2012-10-02 Electro Scientific Industries, Inc. Use of predictive pulse triggering to improve accuracy in link processing
US8026158B2 (en) * 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US8379204B1 (en) * 2007-08-17 2013-02-19 Gsi Group Corporation System and method for automatic laser beam alignment
KR101310243B1 (en) * 2007-09-19 2013-09-24 지에스아이 그룹 코포레이션 Link processing with high speed beam deflection
US7947599B2 (en) * 2008-01-23 2011-05-24 International Business Machines Corporation Laser annealing for 3-D chip integration
GB0802944D0 (en) * 2008-02-19 2008-03-26 Rumsby Philip T Apparatus for laser processing the opposite sides of thin panels
EP2260344A4 (en) * 2008-03-13 2014-03-05 Yu Sun Method and apparatus for microscopy
US8124911B2 (en) 2008-03-31 2012-02-28 Electro Scientific Industries, Inc. On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
GB0809003D0 (en) * 2008-05-17 2008-06-25 Rumsby Philip T Method and apparatus for laser process improvement
GB2460648A (en) * 2008-06-03 2009-12-09 M Solv Ltd Method and apparatus for laser focal spot size control
JP5139922B2 (en) * 2008-08-25 2013-02-06 株式会社ディスコ Laser processing equipment
JP5199789B2 (en) * 2008-08-25 2013-05-15 株式会社ディスコ Laser processing apparatus and laser processing method
US8162742B2 (en) 2008-11-13 2012-04-24 Igt Adjusting payback data based on skill
DE102009023297A1 (en) * 2009-05-29 2010-12-02 Kuka Roboter Gmbh Method and device for operating an additional tool axis of a tool guided by a manipulator
DE202009012924U1 (en) * 2009-09-25 2010-01-14 Precitec Kg Insert for holding an optic in a laser processing head and a laser processing head
WO2011082065A2 (en) * 2009-12-30 2011-07-07 Gsi Group Corporation Link processing with high speed beam deflection
US20110174086A1 (en) * 2010-01-19 2011-07-21 Divyasimha Harish Capacitive sensor based structure and method with tilt compensation capability
TWI393602B (en) * 2010-08-04 2013-04-21 Hortek Crystal Co Ltd Laser process manufacturer
KR20120019649A (en) * 2010-08-26 2012-03-07 삼성엘이디 주식회사 Apprartus and method for laser scribing
TWI459066B (en) * 2010-11-18 2014-11-01 Ind Tech Res Inst Apparatus and system for improving depth of focus
FR2973118B1 (en) * 2011-03-24 2013-08-23 Centre Nat Rech Scient DIGITAL AND ADAPTIVE DEVICE FOR FOCUSING A LASER BEAM
DE102011018648B3 (en) 2011-04-21 2012-07-12 Messer Cutting Systems Gmbh Device for the thermal processing of a workpiece
KR102138223B1 (en) 2011-07-05 2020-07-28 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Systems and methods for providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use
DE102011079083A1 (en) * 2011-07-13 2013-01-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for processing a workpiece and a machining device
TWI414385B (en) * 2011-08-05 2013-11-11 Ind Tech Res Inst Real time monitoring system for depth of laser processing and method thereof
FR2998505B1 (en) * 2012-11-26 2015-02-06 Akeo Plus METHOD AND SYSTEM FOR MARKING A SURFACE BY LASER PROCESSING
WO2015021076A1 (en) * 2013-08-05 2015-02-12 Gentex Corporation Laser system and method thereof
KR20160044464A (en) 2013-08-16 2016-04-25 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Laser systems and methods for internally marking thin layers, and articles produced thereby
DE102014207624A1 (en) * 2014-04-23 2015-10-29 Siemens Aktiengesellschaft Fiber laser system with zoom optical system for material processing
CN116213918A (en) 2015-09-09 2023-06-06 伊雷克托科学工业股份有限公司 Laser processing apparatus, method of laser processing a workpiece, and related arrangement
US10573506B2 (en) 2016-03-11 2020-02-25 Michael Vidra Method and device for etching patterns inside objects
US9726824B1 (en) 2016-09-15 2017-08-08 Google Inc. Optical circuit switch collimator
JP6907011B2 (en) * 2017-04-24 2021-07-21 株式会社ディスコ Laser processing equipment and laser processing method
JP6616368B2 (en) * 2017-09-14 2019-12-04 ファナック株式会社 Laser processing device that corrects processing conditions according to the contamination level of the optical system before laser processing
CN116689948A (en) * 2017-10-25 2023-09-05 株式会社尼康 Processing device and processing method
US20200078884A1 (en) * 2018-09-07 2020-03-12 Intel Corporation Laser planarization with in-situ surface topography control and method of planarization
US11205562B2 (en) 2018-10-25 2021-12-21 Tokyo Electron Limited Hybrid electron beam and RF plasma system for controlled content of radicals and ions
US11839914B1 (en) 2019-01-31 2023-12-12 Freeform Future Corp. Process monitoring and feedback for metal additive manufacturing using powder-bed fusion
CN111895921B (en) * 2020-08-05 2022-03-11 珠海博明视觉科技有限公司 Compensation method for improving measurement precision of system to height difference
CN112296524B (en) * 2020-09-23 2022-04-29 燕山大学 Workpiece microstructure processing method and diamond microstructure workpiece
CN113226632A (en) * 2021-03-31 2021-08-06 长江存储科技有限责任公司 Laser system for cutting semiconductor structure and operation method thereof

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1472298A1 (en) * 1966-09-29 1969-03-13 Leitz Ernst Gmbh Arrangement for guiding the lens of an optical device
JPS57204547A (en) * 1981-06-12 1982-12-15 Hitachi Ltd Exposing method
US4358659A (en) * 1981-07-13 1982-11-09 Mostek Corporation Method and apparatus for focusing a laser beam on an integrated circuit
US4615621A (en) * 1982-04-02 1986-10-07 Eaton Corporation Auto-focus alignment and measurement system and method
US4504144A (en) * 1982-07-06 1985-03-12 The Perkin-Elmer Corporation Simple electromechanical tilt and focus device
US4584479A (en) * 1982-10-19 1986-04-22 Varian Associates, Inc. Envelope apparatus for localized vacuum processing
US4528451A (en) * 1982-10-19 1985-07-09 Varian Associates, Inc. Gap control system for localized vacuum processing
FI68131C (en) * 1983-06-30 1985-07-10 Valtion Teknillinen REFERENCE FOR A WINDOW MACHINE WITH A GLASS LED WITH A LASER INDICATOR
JPS6066341A (en) 1983-09-20 1985-04-16 Olympus Optical Co Ltd Recording and reproducing device of information
DE3339318C2 (en) * 1983-10-29 1995-05-24 Trumpf Gmbh & Co Laser processing machine
JPS60171684U (en) * 1984-04-20 1985-11-14 三洋電機株式会社 Laser processing equipment
US4598039A (en) * 1984-07-02 1986-07-01 At&T Bell Laboratories Formation of features in optical material
US4769523A (en) * 1985-03-08 1988-09-06 Nippon Kogaku K.K. Laser processing apparatus
JPS61287229A (en) * 1985-06-14 1986-12-17 Nippon Kogaku Kk <Nikon> Exposure device
US4752668A (en) * 1986-04-28 1988-06-21 Rosenfield Michael G System for laser removal of excess material from a semiconductor wafer
US5175425A (en) * 1987-06-15 1992-12-29 Leuze Electronic Gmbh & Co. Process for marking semiconductor surfaces
US4952858A (en) * 1988-05-18 1990-08-28 Galburt Daniel N Microlithographic apparatus
US5267012A (en) * 1989-04-27 1993-11-30 Coherent, Inc. Apparatus for measuring the mode quality of a laser beam
JP2960746B2 (en) * 1990-03-15 1999-10-12 株式会社日立製作所 Beam irradiation method, electron beam drawing method, beam irradiation apparatus, and electron beam drawing apparatus
US5077622A (en) * 1990-05-31 1991-12-31 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Apparatus for precision focussing and positioning of a beam waist on a target
JP2712772B2 (en) * 1990-07-05 1998-02-16 株式会社ニコン Pattern position measuring method and apparatus
US5502311A (en) * 1992-01-17 1996-03-26 Nikon Corporation Method of and apparatus for detecting plane position
JPH05200575A (en) * 1992-01-30 1993-08-10 Matsushita Electron Corp Laser beam machine
US5448410A (en) * 1992-07-31 1995-09-05 International Business Machines Corporation Variable magnification laser imaging system
US5340962A (en) * 1992-08-14 1994-08-23 Lumonics Corporation Automatic control of laser beam tool positioning
US5483055A (en) 1994-01-18 1996-01-09 Thompson; Timothy V. Method and apparatus for performing an automatic focus operation for a microscope
US5594235A (en) 1993-06-17 1997-01-14 Ultrapointe Corporation Automated surface acquisition for a confocal microscope
JPH07251286A (en) * 1994-03-15 1995-10-03 Nikon Corp Laser beam machine
DE9407288U1 (en) * 1994-05-02 1994-08-04 Trumpf Gmbh & Co Laser cutting machine with focus position adjustment
FR2726496B1 (en) * 1994-11-09 1997-01-17 Aerospatiale METHOD FOR SPATIAL LOCATION OF THE FOCAL POINT OF A LASER BEAM OF A MACHINERY AND TOOLING FOR CARRYING OUT THIS METHOD
JP3538948B2 (en) 1995-03-13 2004-06-14 ヤマハ株式会社 Semiconductor wafer exposure method
US6215896B1 (en) * 1995-09-29 2001-04-10 Advanced Micro Devices System for enabling the real-time detection of focus-related defects
JPH1089403A (en) * 1996-09-10 1998-04-07 Nikon Corp Vibration control device
US6128546A (en) * 1996-09-30 2000-10-03 Cincinnati Incorporated Method and apparatus for a cutting system for avoiding pre-cut features
US5998759A (en) * 1996-12-24 1999-12-07 General Scanning, Inc. Laser processing
US6025256A (en) * 1997-01-06 2000-02-15 Electro Scientific Industries, Inc. Laser based method and system for integrated circuit repair or reconfiguration
SE508228C2 (en) * 1997-05-07 1998-09-14 Inst Verkstadstek Forsk Ivf Device for detecting and calculating the focus position, shape and power distribution of a laser beam
KR100274596B1 (en) * 1997-06-05 2000-12-15 윤종용 Method and apparatus for detecting particles on the stage holder
JPH1123952A (en) * 1997-06-30 1999-01-29 Nec Corp Automatic focusing device and laser beam machining device using the same
US6120725A (en) * 1997-07-25 2000-09-19 Matsushita Electric Works, Ltd. Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation
JPH1190659A (en) * 1997-09-22 1999-04-06 Nikon Corp Laser repairing device
JP3193678B2 (en) * 1997-10-20 2001-07-30 株式会社アドバンテスト Semiconductor wafer repair apparatus and method
US6366357B1 (en) 1998-03-05 2002-04-02 General Scanning, Inc. Method and system for high speed measuring of microscopic targets
US6313910B1 (en) * 1998-09-11 2001-11-06 Dataray, Inc. Apparatus for measurement of optical beams
US6172325B1 (en) * 1999-02-10 2001-01-09 Electro Scientific Industries, Inc. Laser processing power output stabilization apparatus and method employing processing position feedback
US6177648B1 (en) * 1999-03-30 2001-01-23 Laser Machining, Inc. Steered laser beam system with laser power control
US6284999B1 (en) * 1999-07-23 2001-09-04 Lillbacka Jetair Oy Laser cutting system
US6340806B1 (en) * 1999-12-28 2002-01-22 General Scanning Inc. Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train
US6281471B1 (en) * 1999-12-28 2001-08-28 Gsi Lumonics, Inc. Energy-efficient, laser-based method and system for processing target material
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP4573941B2 (en) * 2000-03-30 2010-11-04 富士フイルム株式会社 Collimator lens and optical scanning device using the same
US6662063B2 (en) * 2000-05-16 2003-12-09 Gsi Lumonics Corporation Method and subsystem for determining a sequence in which microstructures are to be processed at a laser-processing site
US6483071B1 (en) * 2000-05-16 2002-11-19 General Scanning Inc. Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
US6495791B2 (en) * 2000-05-16 2002-12-17 General Scanning, Inc. Method and subsystem for generating a trajectory to be followed by a motor-driven stage when processing microstructures at a laser-processing site
US6534743B2 (en) * 2001-02-01 2003-03-18 Electro Scientific Industries, Inc. Resistor trimming with small uniform spot from solid-state UV laser
US7358157B2 (en) * 2002-03-27 2008-04-15 Gsi Group Corporation Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
US6951995B2 (en) * 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
US20040144760A1 (en) * 2002-05-17 2004-07-29 Cahill Steven P. Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein

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US6573473B2 (en) 2003-06-03
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US20030205563A1 (en) 2003-11-06
US20050199598A1 (en) 2005-09-15
KR20030017516A (en) 2003-03-03
US20020125231A1 (en) 2002-09-12
US6483071B1 (en) 2002-11-19
US7176407B2 (en) 2007-02-13
TW494041B (en) 2002-07-11

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