TWI414385B - Real time monitoring system for depth of laser processing and method thereof - Google Patents

Abstract

A real time monitoring system for depth of laser processing and method thereof is disclosed. The system and method provide same path or non-same path machining beam and test beam. The path of the test beam is greater than the machining beam. A lock-in amplifier and a detector are able to make sure the machining beam and the test beam overlapping in time and space, to conduct a real time measure, because of gauging signal change, to monitoring real depth of laser processing in real time.

Description

Depth real-time monitoring system applied to laser processing and method thereof

A depth real-time monitoring system and method for laser processing, which is a real-time measurement of signal changes, and can instantly monitor the actual depth of laser processing.

Nowadays, laser processing has been in progress for a long time. However, the current laser processing method uses the rule of thumb to judge the processing threshold required for the material of the workpiece to adjust the wavelength, energy, pulse and processing time of the laser. Processing.

After the laser processing, the processed parts are further tested by some testing instruments to know whether the processed parts meet the specifications. However, the above detection takes several hours or several days to know the test results. If the processed parts do not meet the specifications, Again, the wavelength, energy, pulse, and processing time of the laser are adjusted by empirical rules.

For the industrial and commercial society where time is money, the above-mentioned rule of thumb has a considerable degree of inaccuracy and guess value, and the above-mentioned detection method is time-consuming, so today's laser processing is not aging.

In view of the above disadvantages, the purpose of the present disclosure is to provide a depth real-time monitoring system and method thereof for laser processing, which can monitor the actual depth of laser processing in real time by measuring the change of the signal to meet the requirements. The demand for timeliness.

In order to achieve the above object, the technical means of the present disclosure is to provide a depth real-time monitoring system for laser processing, which has a shutter, a three-axis moving device, a photodetector, a visual imaging device, and a three-axis. a moving device, a photodetector and a visual imaging device; the shutter is disposed on a traveling path of the processing beam, the processing beam and a detecting beam are collected at a focusing point; and the three-axis moving device is disposed at the focusing point and the detecting beam Between the traveling paths; the photodetector is disposed on the traveling path of the detecting beam; the visual imaging device is disposed adjacent to the three-axis moving device; the lock-in amplifier is electrically connected to the photodetector; and a control unit is The lock-in amplifier, the visual imaging device, the shutter and the three-axis moving device are electrically connected respectively.

The present disclosure provides a depth real-time monitoring method applied to laser processing, the steps of which are: finding a focus point: a first laser beam and a second laser beam are adjusted in power to form a second power lower The laser beam turns on a shutter for a laser beam to pass through, and the two laser beams are collected on the surface of a transparent object to be formed to form a focus point.

Adjusting the position of the object to be processed: if a focus point cannot be formed on the surface of the object to be processed, adjust the position of the object to be processed to find the focus point, and if the focus point has been found, adjust the power of the first laser beam. Forming a processing beam, and adjusting the power of the second laser beam to form a first detection beam, the first detection beam and the processing beam forming a focus point on the surface of the object to be processed, if the focus point is read, Then close the shutter.

Adjusting the etch depth: The distance at which the object to be processed is moved toward the focus point to the depth of the desired etch with the focus point as the origin.

Machining and measurement: The shutter is opened to control the processing beam, and an etching process is performed, and the detection beam simultaneously measures the processing beam.

The etch depth has been reached: the power of the processing beam is changed according to the data measured by the detection beam, and if the etching depth has been reached, the shutter is closed.

The present disclosure further provides a depth real-time monitoring system for laser processing, which has a processing beam, a detection beam, a shutter, a three-axis moving device, a photodetector, a visual imaging device and a lock-in amplifier. The detecting beam system and the processing beam are collected at a focusing point; the shutter is disposed on the traveling path of the processing beam; the three-axis moving device is disposed at the focusing point; the photodetector is disposed on the traveling path of the detecting beam; and the visual imaging device is The device is electrically connected to the three-axis mobile device; the lock-in amplifier is electrically connected to the photodetector; and a control unit is electrically connected to the lock-in amplifier, the visual imaging device, the shutter and the three-axis mobile device.

The present disclosure further provides a depth real-time monitoring method applied to laser processing, the steps of which are: finding a focus point: a first laser beam and a second laser beam are adjusted in power to form a second power lower The laser beam turns on a shutter for a laser beam to pass through, and the two laser beams are collected on a surface of a non-transparent object to be processed, and a focusing point is formed to form two reflected beams.

Adjusting the position of the workpiece: If a focus point is not formed on the surface of the object to be processed, the position of the object to be processed is adjusted to find the focus point. If the focus point is found, the power of the first laser beam is adjusted. To form a processing beam, the power of the second laser beam is adjusted to form a detection beam, and the detection beam and the processing beam are collected on the surface of the object to be processed to form a focus point to know the object to be processed. The surface has the focus point, and if the focus point has been read, the shutter is closed.

Adjusting the etch depth: The distance at which the object to be processed is moved toward the focus point to the depth of the desired etch with the focus point as the origin.

Machining and measurement: The shutter is opened to control the processing beam, and an etching process is performed, which simultaneously measures the processing beam.

The etch depth has been reached: the detection beam is measured, and the power of the processing beam is changed according to the measurement result of the detection beam. If the etching depth has been reached, the shutter is closed.

In summary, the present invention relates to a depth real-time monitoring system and method thereof for laser processing, which can be applied to a transparent or non-transparent object to be processed, and the detection beam and the processed beam system can be co-path or non-co-path, but processed. The traveling path of the light beam is shorter than the detecting beam. Therefore, in a state of difference of a traveling path, the lock-in amplifier and the photodetector system can determine that the detecting beam and the processing beam overlap in space and time for an instant measurement. And by measuring the change of the signal, the actual depth of the laser processing is instantly monitored.

The embodiments of the present disclosure are described below by way of specific embodiments, and those skilled in the art can readily understand the other advantages and functions of the disclosure.

Referring to FIG. 1 , the disclosure is a first embodiment of a depth real-time monitoring system applied to laser processing, which has a laser generator 10 , a beam splitter 11 , a first mirror group 12 , and a first embodiment . The first mirror group 13, a first lens 14, a second mirror group 15, a second mirror group 16, a second lens 17, a shutter 18, a chopper 19, and a three-axis moving device 20 An optical filter group 21, a photodetector 22, a visual imaging device 24, a lock-in amplifier 23 and a control unit 25.

The laser generator 10 emits a laser beam 100, and the laser beam 100 is split by the beam splitter 11 into a first laser beam 101 and a second laser beam. 102.

The first mirror group 12 has a half wave plate 120 and a polarizing plate 121. The first mirror group 12 is disposed in a path of traveling of the first laser beam 101. After the first laser beam 101 passes through the first mirror group 12, the polarization is performed. The slice 121 adjusts the power of the first laser beam 101 to form a processed beam 103.

The first mirror group 13 and the first lens 14 are disposed on the traveling path of the processing beam 103. The first mirror group 13 has at least one mirror 130 and an optional prism 131.

The second mirror group 15 has at least one mirror 150, the second mirror group 16 has a half wave plate 160 and a polarizing plate 161, and the second mirror group 15 and the second mirror group 16 are disposed on the second laser beam 102. After the second laser beam 102 passes through the second mirror group 16, the polarizing plate 161 adjusts the power of the second laser beam 102 to form a first detecting beam 104.

The second lens 17 is disposed on the traveling path of the first detecting beam 104.

The first detection beam 104 and the processing beam 103 are collected at a focus point 105 to form a second detection beam 106.

The shutter 18 and the interceptor 19 are disposed on the traveling path of the processing beam 103 and are located between the first mirror group 12 and the first mirror group 13.

The three-axis moving device 20 is disposed between the focusing point 105 and the traveling path of the second detecting beam 106, and the three-axis moving device 20 has the ability to move in an X-axis, a Y-axis or a Z-axis, three-axis. The mobile device 20 is provided for a workpiece 26 to be moved, and the three-axis moving device 20 is capable of moving the workpiece 26 in the X-axis, Y-axis or Z-axis, respectively.

The first lens 14 is located between the first mirror group 13 and the three-axis moving device 20, and the second lens 17 is located between the second mirror group 16 and the three-axis moving device. Between 20.

The optical filter group 21 and the photodetector 22 are disposed on the path of the integrated beam 106. The optical filter group 21 has an aperture 210 and a polarizer 211. The optical filter group 21 is located in the three-axis mobile device 20 and the optical detector. Between the detectors 22.

The visual imaging device 24 is adjacent to the three-axis mobile device 20, and the visual imaging device 24 and the three-axis mobile device 20 are electrically connected to the control unit 25, respectively. The visual imaging device 24 is connected with an external light source, and the control unit 25 issues an instruction to enable The external light source is irradiated onto the surface of the object to be processed, which will be described later, and generates a visible reflected light, that is, the reflected light, and the visual image device 24 captures the visible reflected light to measure the laser processing position and the set processing position.

The lock-in amplifier 23 is electrically connected to the chopper 19, the photodetector 22, and the control unit 25, respectively.

The half mirrors 120, 160 and the polarizers 121, 161 of the first mirror group 12 and the second mirror group 16 are used to adjust the power and energy of the first laser beam 101 and the second laser beam 102, respectively. The mirror group 13 controls the traveling path of the processing beam 103, the second mirror group 15 is used to control the traveling path of the first detecting beam 104, and the first lens 14 is used to control the color difference, focal length or focus of the processing beam 103. The two lenses 17 are used to control the chromatic aberration, focal length or focus of the first detection beam 104.

The shutter 18 is used as a means for starting and closing the laser processing. The interceptor 19 adjusts the power of the processing beam 103 and cooperates with the lock-in amplifier 23 to enhance the optical response signal of the material etching.

The control unit 25 controls the operation of the three-axis moving device 20, the visual imaging device 24 and the lock-in amplifier 23, respectively, and integrates the visual imaging device 24 with the lock. The information obtained by the phase amplifier 23, and the control unit 25 controls the opening or closing of the shutter 18, the control unit 25 further controls the first mirror group 12 and the second mirror group 16 to change the power of the laser beam.

The lock-in amplifier 23 and the photodetector 22 detect temporal and spatial overlap of the first detection beam 104 and the processing beam 103.

Please refer to the first, second, third and eighth embodiments. The disclosure is a first embodiment of a depth monitoring method for laser processing. The steps include: finding a focus point A1: a transparent object to be processed 26 is placed in the three-axis moving device 20, the laser generator 10 emits a laser beam 100, and is divided into a first laser beam 101 and a second laser beam 102 by a beam splitter 11, the first laser beam 101 is The polarizer 121 of the first mirror group 12 is adjusted to a lower power laser beam, the control unit 25 opens the shutter 18 for the laser beam to pass, and the second laser beam 102 is polarized by the second mirror group 16. 161 is adjusted to a lower power laser beam, and the two laser beams are formed on the surface of the object to be processed 26 to form a focusing point (as shown in FIG. 1 of the symbol 105), which is read by the visual imaging device 24. The two laser beams are passed through a workpiece to be processed, and the two laser beams are integrated into a laser beam (such as component symbol 106 in FIG. 1 ), and the laser beam is measured by the photodetector 22 . .

Adjusting the position A2 of the workpiece to be processed: If a focus point cannot be formed on the surface of the workpiece 26, the position of the workpiece 26 in the X axis, the Y axis or the Z axis is adjusted by using the three-axis moving device 20 so that The aforementioned focus point is formed on the surface of the object to be processed 26; if the focus point has been found, the first laser beam 101 passes through the polarizing plate 121. The power is adjusted to produce a processing beam 103 for processing, and the second laser beam 102 is tuned by the polarizer 161 to produce a first detection beam 104 for detection, a first detection beam 104 and a processing beam 103. A focus point 105 is formed on the surface of the workpiece 26; the visual image device 24 reads the focus point 105, and transmits the read information to the control unit 25, and the first detection beam 104 and the processing beam 103 pass through the workpiece 26 The first detecting beam 104 and the processing beam 103 are integrated into the second detecting beam 106, and the second detecting beam 106 is measured by the photodetector 22. If the foregoing steps have been completed, the control unit 25 closes the shutter 18.

The traveling path of the second laser beam 102 is controlled by the second mirror group 15, and the traveling path of the processing beam 103 is controlled by the first mirror group 13, and the power of the first detecting beam 104 is second. Controlled by the mirror group 16, the power of the processing beam 103 is controlled by the first lens group 12. The color difference, focal length or focus of the processing beam 103 is controlled by the first lens 14, and the color difference, focal length or focus of the first detecting beam 104. It is controlled by the second lens 17.

Adjusting the etching depth A3: As shown in FIG. 2, with the focus point 105 as the origin, the three-axis moving device 20 moves the object to be processed 26 toward the focus point 105 to the depth of the desired etching depth, for example, if it is to be processed The depth of the object 26 to be etched is 60 um, and the object to be processed 26 is moved 60 um toward the focus point 105 to move the focus point 105 into the object to be processed 26, that is, between the surface of the object to be processed 26 and the focus point 103. 60um distance.

Processing and measurement A4: The control unit 25 opens the shutter 18 to control the processing beam 103, and performs etching processing, and the lock-in amplifier 23 is synchronized. The processing beam 103 is measured, and the photodetector 22 also measures the second detecting beam 106 simultaneously.

The etch depth A5 has been reached: as shown in FIG. 3, which is an optical signal versus time diagram. At the position B of the figure, when the shutter 18 is opened, the optical signal is enhanced, as shown by a steep rise. That is, the processing beam 103 begins to etch the object to be processed 26. At the point C of the figure, when the shutter 18 is closed, the optical signal is weakened, as shown by a steep drop, that is, the processing beam 103 stops etching the workpiece 26.

The second detection beam 106 is filtered by the aperture 210 and the polarizer 211 of the optical filter group 21 to reduce noise, select the beam, and adjust the power of the laser beam, so that the power of the shutter 18 is turned on and off. The photodetector 22 is capable of measuring the second detection beam 106 and notifying the phase-locked amplifier 23 of the measured data, and causing the lock-in amplifier 23 to control the chopper 19 to change the power of the processing beam 103. The 24 Series detects the etch depth synchronously and informs the control unit 25 to avoid over-etching, and if the etch depth has been reached, the shutter 18 is closed. In the step of adjusting the position A2 of the workpiece and the processing and measuring A4, the second detecting beam 106 is also filtered by the aperture 210 and the polarizing plate 211 of the optical filter group 21 to reduce noise, select the beam and adjust the laser beam. Power.

Referring to FIG. 4, the disclosure is a second embodiment of a depth real-time monitoring system applied to laser processing, which has a laser generator 30, a beam splitter 31, a first mirror group 32, and a shutter. 33, a chopper 34, a first mirror 35, a second mirror group 36, a first lens 37, a third mirror group 38, a second mirror group 39, a fourth mirror 40 a three-axis moving device 41, a multi-function mirror 42, a photodetector 43, A second lens 44, an optical filter group 45, a visual imaging device 46, a lock-in amplifier 47 and a control unit 48.

The laser generator 30 emits a laser beam 300 which is split by a beam splitter 31 into a first laser beam 301 and a second laser beam 302.

The first mirror group 32 has a half wave plate 320 and a polarizing plate 321, and the first mirror group 32 is disposed on the traveling path of the first laser beam 301. After the first laser beam 301 passes through the first mirror group 32, the polarizing plate 321 is to adjust the power of the first laser beam 301 to form a processing beam 303, The third mirror group 38 has at least one mirror 380, the second mirror group 39 has a half wave plate 390 and a polarizing plate 391, and the third mirror group 38 and the second mirror group 39 are disposed on the second laser beam 301. After the second laser beam 302 passes through the second mirror group 39, the polarizing plate 391 adjusts the power of the second laser beam 302 to form a first detecting beam 304.

The first detection beam 304 and the processing beam 303 are collected at a junction 305 to form an integrated beam 306, and the first mirror 35 is disposed at the junction 305.

The shutter 33 and the chopper 34 are disposed on the traveling path of the processing beam 303, and are located between the first mirror group 32 and the junction 305, and the shutter 33 is electrically connected to the control unit 48.

The second mirror group 36, the first lens 37, the three-axis moving device 41 and the multi-function mirror 42 are disposed on the traveling path of the integrated light beam 306, and the second mirror group 36 has at least one mirror 360 and a selective The mirror 361, or the second mirror group 36 can have only at least one mirror 360, and the three-axis moving device 41 is electrically connected to the control unit 48, wherein the first lens 37 is located in the second mirror group 36 and three Multi-function reflection between the axis moving devices 41 The mirror 42 is disposed on the traveling path of the integrated beam 306, and the integrated beam 306 is split into a second detecting beam 308 via the multi-function mirror 42.

The fourth mirror 40 is disposed on the traveling path of the first detecting beam 304, wherein the fourth mirror 40 is located between the second mirror 39 and the first mirror 35.

The visual imaging device 46 generates a third detection beam 307, and the three-axis moving device 41 is connected to the path of the third detection beam 307, so that the visual imaging device 46 is adjacent to the three-axis moving device 41, and the visual imaging device 46 is The control unit 48 is electrically connected.

The second lens 44, the optical filter group 45 and the photodetector 43 are disposed on the traveling path of the second detecting beam 308. The optical filter group 45 has an aperture 450 and a polarizing plate 451.

The lock-in amplifier 47 is electrically connected to the chopper 34, the photodetector 43, and the control unit 48, respectively.

Please refer to FIG. 8 again. Because the methods of the present disclosure have the same flow and are only different in operation, the figure 8 is used in each embodiment, and the first embodiment is shown.

The present disclosure is a second embodiment of a depth real-time monitoring method applied to laser processing, the steps of which are: finding a focus point A1: placing a transparent workpiece 49 on a three-axis moving device 41, the laser generator 30 A laser beam 300 is emitted and split into a first laser beam 301 and a second laser beam 302 via a beam splitter 31. The first laser beam 301 is adjusted in power via a polarizer 321 of the first mirror 32 to The laser beam becomes a lower power laser beam, and the control unit 48 turns on the shutter 33 to pass the laser beam; the second laser beam 302 The polarizer 391 of the second lens group 39 adjusts its power to make the laser beam a lower power laser beam; the two laser beams are collected in the first mirror 35 to form an integrated beam ( As shown in component symbol 304 of FIG. 4, the integrated beam is reflected by the first mirror 35 to the second mirror group 36, and the second mirror group 36 reflects the integrated beam to the first lens 37, and the first lens 37 controls integration. The chromatic aberration, focal length or focus of the beam causes the integrated beam to be focused on the surface of the object to be processed 49, and the integrated beam is reflected by the multiplex mirror 42 into two laser beams (see symbol symbols 307 and 308 of FIG. 4). A laser beam (e.g., symbol 307 of FIG. 4) is measured by the visual imaging device 46 to know that the integrated beam is focused on the surface of the object to be processed 49 and forms a focus point and another laser. The beam (e.g., symbol 308 of Figure 4) is measured by photodetector 43.

Adjusting the position A2 of the workpiece to be processed: If the surface of the workpiece 49 does not have a focus point, the position of the workpiece 49 is adjusted using the three-axis moving device 38 to focus the integrated beam on the surface of the workpiece 49 to find out Focusing point, if the focus point has been found, the polarizing plate 321 of the first mirror group 32 adjusts the power of the first laser beam 301 to generate a processing beam 303 having a higher power and for processing, and the second mirror group 39 The polarizing plate 391 adjusts the power of the second laser beam 304 to generate a first detecting beam 304 for detection. The first detecting beam 304 and the processing beam 303 are collected at a junction 305 to form an integrated beam 306. The integrated beam 306 is reflected by the first mirror 35 and the second mirror group 36, and is focused on the surface of the object to be processed 49 to form a focus point. The integrated beam 304 passes through the object to be processed 49 and is divided by the multi-function mirror 42. For the second detection beam 308, the visual image device 46 reads the first The detection beam 307 is three to detect that the surface of the object to be processed 49 has a focus point. If the focus point has been read, the control unit 48 closes the shutter 33, and the second detection beam 308 is measured by the photodetector 43.

The path of the integrated beam 305 is controlled by the first mirror 35 and the second mirror group 36. The path of the second laser beam 302 is controlled by the third mirror group 38. The first detecting beam 304 The traveling path is controlled by the fourth mirror 40, the second lens 44 controls the focal length of the second detecting beam 308, and the optical filtering group 45 filters the second detecting beam 308, reduces noise, selects the beam, and adjusts the lightning. The power of the beam is measured by the photodetector 43. The filtering, reducing the noise, selecting the beam and adjusting the power of the laser beam can also be seen in the subsequent processing and measurement of A4 and the etched depth A5. In the step, the first lens 37 controls the chromatic aberration, focal length or focus of the integrated beam 306.

Adjusting the etching depth A3: Taking the above-mentioned focus point as an origin, the three-axis moving device 38 moves the object to be processed 49 toward the focus point to a distance of a desired etching depth.

Processing and measurement A4: The control unit 48 opens the shutter 33 to control the processing beam 303 and performs etching processing. The lock-in amplifier 47 synchronously detects the processing beam 303, and the photodetector 43 simultaneously measures the second detecting beam. 308.

The etch depth A5 has been reached: the photodetector 43 measures the second detection beam 308, and informs the lock-in amplifier 47 of the measured result, and the lock-in amplifier 47 controls the chopper 34 to change the power of the processing beam 303. The visual imaging device 46 measures the etch depth synchronously and informs the control unit 48 that the control unit 48 closes the shutter 33 if the etch depth has been reached.

Referring to FIG. 5, the disclosure is a third embodiment of a depth real-time monitoring system applied to laser processing, which has a laser generator 50, a beam splitter 51, a first mirror group 52, and a first embodiment. a shutter 53, a chopper 54, a first mirror group 55, a multi-function mirror 56, a first lens 57, a three-axis moving device 58, a second mirror group 59, and a second mirror group 60. A second lens 61, a visual imaging device 62, a third lens 63, an optical filter group 64, a photodetector 65, a lock-in amplifier 66 and a control unit 67.

The laser generator 50 emits a laser beam 500 which is split by a beam splitter 51 into a first laser beam 501 and a second laser beam 502.

The second mirror group 59 has at least one mirror 590, the second mirror group 60 has a half wave plate 600 and a polarizing plate 601, and the second mirror group 59 and the second mirror group 60 are disposed on the second laser beam 502. The travel path of the second laser beam 502 is adjusted by the polarizer 601 to form a first detection beam 504.

The first mirror group 52 has a half wave plate 520 and a polarizing plate 521. The first mirror group 52 is disposed on the traveling path of the first laser beam 501, and the first laser beam 501 is adjusted by the polarizing plate 521 to form a power. A processing beam 503.

The shutter 53, the chopper 54, the first mirror group 55, the multi-function mirror 56 and the first lens 57 are disposed on the traveling path of the processing beam 503, and the first mirror group 55 has at least one mirror 551 and one The optional prism 550, or the first mirror group 55, can have only at least one mirror 551. The shutter 53 is electrically connected to the control unit 67.

The first mirror group 52, the shutter 53 and the chopper 54 are located between the beam splitter 51 and the first mirror group 55.

The processing beam 503 passes through the multi-function mirror 56 and is combined with the first detection beam 504 at a focus point 505 and becomes a second detection beam 506. The second detection beam 506 is reflected at an angle.

The three-axis moving device 58 is disposed at a focus point 505, and the three-axis moving device 58 is electrically connected to the control unit 67, wherein the first lens 57 is located between the multi-function mirror 56 and the three-axis moving device 58.

The second lens 61 is disposed in a traveling path of the first detecting beam 502, wherein the second mirror group 60 and the second lens 61 are located between the second mirror group 59 and the three-axis moving device 58.

The visual imaging device 62 generates a third detection beam 507 that passes through the multi-function mirror 56 and the first lens 57 to focus on the focus point 505 or back to the visual image device 62. The visual image device 62 The control unit 67 is electrically connected.

The third lens 63, the optical filter group 64 and the photodetector 65 are disposed on the traveling path of the second detecting beam 506. The optical filter group 64 has an aperture 640 and a polarizing plate 641, wherein the third lens 63 and the optical filter Group 64 is located in three-axis mobile device 58 and photodetector 65.

The lock-in amplifier 66 is electrically connected to the chopper 54, the photodetector 65 and the control unit 67, respectively.

Referring to FIG. 8 again, the present disclosure is a third embodiment of a method for real-time monitoring of depth applied to laser processing, the steps of which are: finding a focus point A1: placing a non-transparent object to be processed 68 on The three-axis moving device 58, the laser generator 50 emits a laser beam 500, and the laser beam is split by the beam splitter 51 into a first laser beam 501 and a second laser beam 502. The first laser beam 501 is passed through. Polarizing plate 521 of the first mirror group 52 Adjusting its power to adjust the first laser beam 501 to a lower power laser beam, the control unit 67 opens the shutter 54 for the laser beam (e.g., symbol 503 of FIG. 5) to pass through The mirror group 55 is guided through the multi-function mirror 56 and reaches the surface of a workpiece 68; the second laser beam 502 is guided by the second mirror group 59 and polarized by the second mirror group 60. The slice 601 adjusts its power to adjust the second laser beam 502 to a lower power laser beam, and then collects the aforementioned laser beam (see the symbol 503, 504 of FIG. 5) on the surface of the object to be processed 68. To form a focus point (as shown in Figure 5, symbol 505); the two laser beams form a two-reflected beam (such as component symbols 507 and 506 in Figure 5), and a reflected beam (such as the five symbol 507) Then, it is reflected along the traveling path of one of the laser beams. After the reflected beam passes through the multi-function mirror 56, it is reflected at an angle for measurement by the visual image device 62, and the other reflected beam (see FIG. Element symbol 506) is reflected at an angle for measurement by photodetector 65.

Adjusting the position A2 of the workpiece to be processed: If the surface of the workpiece 68 does not have a focus point, the position of the workpiece 68 in the X axis, the Y axis or the Z axis is adjusted using the three-axis moving device 58 to find out Focusing point, if the focus point has been found, the polarizing plate 521 of the first mirror group 52 adjusts the power of the first laser beam 501 to generate a processing beam 503 for processing, and the polarizing plate 601 of the second mirror group 60 is adjusted. The power of the two laser beams 502 is used to generate a first detection beam 504, and the processing beam 503 and the first detection beam 504 are collected at a focus point 505 to form a second detection beam 506; the visual image device 62 reads The third detection beam 507, it is known that the focus point 505 is already on the surface of the object to be processed 68, and the third detection beam 506 The reflected light is reflected by the visual imaging device 62. If the focus point 505 has been read, the control unit 67 closes the shutter 53; the third detecting beam 506 is reflected to the photodetector 65 at a reflection angle to be optically detected. Measured by the detector 65.

The traveling path of the processing beam 503 is controlled by the first mirror group, and the first lens 52 controls the color difference, focal length or focus of the processing beam 503 and the third detecting beam 507, and the traveling path of the first laser beam 502 is Controlled by the second mirror group 59, the second lens 61 controls the chromatic aberration, focal length or focus of the first detection beam 504.

Adjusting the etch depth A3: With the focus point 505 as the origin, the three-axis moving device 58 moves the object 68 toward the focus point 505 to a desired depth of etching.

Processing and measurement A4: The control unit 67 opens the shutter 53 to control the processing beam 503 and performs etching processing, the lock-in amplifier 66 synchronously measures the processing beam 503, and the photodetector 65 simultaneously measures the second detecting beam. 506, measuring the depth of laser processing.

The etch depth A5 has been reached: the photodetector 65 is measured via the second detection beam 506, and the result of the measurement is informed to the lock-in amplifier 66, which controls the chopper 54 to change the power of the processing beam 503. The visual imaging device 62 measures the etch depth synchronously and informs the control unit 67 that the shutter 53 is closed if the etch depth has been reached.

The third lens 63 controls the chromatic aberration, focal length or focus of the second detection beam 506, and the second detection beam 506 is filtered by the optical filter group 64 to reduce noise, select the beam and adjust its power for the photodetector. 65 measurements, filtering, reducing noise, selecting beams and adjusting their power It can be seen in the steps of processing and measuring A4 and adjusting the position A2 of the workpiece.

Referring to FIG. 6 , the disclosure is a fourth embodiment of a depth real-time monitoring system applied to laser processing, which has a laser generator 70 , a beam splitter 71 , a first mirror group 72 , and a first embodiment . The shutter 73, a chopper 74, a first mirror 75, a second mirror group 76, a fourth mirror 77, a second mirror group 78, a third mirror group 79, and a first multi-mirror The power mirror 80, a second multi-function mirror 81, a lens 82, an optical filter group 83, a visual image device 84, a photodetector 85, a three-axis moving device 86, a lock-in amplifier 87 and A control unit 88.

The laser generator 70 emits a laser beam 700 which is split by a beam splitter 71 into a first laser beam 701 and a second laser beam 702.

The first mirror group 72 has a half wave plate 720 and a polarizing plate 721. The first mirror group 72 is disposed on the traveling path of the first laser beam 701, and the polarizing plate 721 adjusts the power of the first laser beam 701 to form a The beam 703 is processed.

The third mirror group 79 has at least one mirror 790, the second mirror group 78 has a half wave plate 780 and a polarizing plate 781, and the third mirror group 79 and the second mirror group 78 are driven by the second laser beam 701. The path, the polarizer 781 adjusts the power of the second laser beam 701 to form a first detection beam 705.

The first detection beam 705 and the processing beam 703 are collected at a junction 704 to form an integrated beam 706, and the first mirror 75 is disposed at the junction 704.

The shutter 73 and the interceptor 74 are disposed on the traveling path of the processing beam 703, wherein the first mirror group 72, the shutter 73 and the interceptor 74 are disposed in the splitting light. The mirror 71 is between the first mirror 75 and the first mirror 75. The shutter 73 is electrically connected to the control unit 88.

The second mirror group 76 has at least one mirror 761 and an optional mirror 760, or the second mirror group 76 can have only at least one mirror 761, the second mirror group 76, and the first multi-function reflection The mirror 80 and the second multi-function mirror 81 are disposed on the traveling path of the integrated beam 706. The integrated beam 706 gathers a focus point and is reflected along the traveling path of the integrated beam 706 to form a reflected beam 707. The second multi-function mirror 81 reflects to form a second detection beam 708.

The fourth mirror 77 is disposed on the traveling path of the first detecting beam 705, wherein the second mirror group 78 is located between the fourth mirror 77 and the third mirror group 79.

The lens 82, the optical filter group 83 and the photodetector 85 are disposed on the traveling path of the second detecting beam 708. The optical filter group 83 has an aperture 830 and a polarizing plate 831, wherein the lens 82 and the optical filter group 83 are located. The second multi-function mirror 81 is between the photodetector 85 and the photodetector 85.

The visual imaging device 84 generates a third detection beam 709 that is reflected by the first multi-function mirror 80 to be reflected to the object to be processed 89 (the position of the three-axis moving device 86) or reflected back to the visual image. Device 84, visual imaging device 84 is electrically coupled to control unit 88. .

The three-axis moving device 86 is disposed on the path of the integrated beam 706 and is located at the focus point. The three-axis moving device 86 is electrically connected to the control unit 88, wherein the first multi-function mirror 80 and the second multi-function mirror The 81 series is disposed between the second mirror group 76 and the three-axis moving device 86.

The lock-in amplifier 87 is electrically connected to the chopper 74 and the control unit respectively 88 and photodetector 86.

Referring to FIG. 8 again, the present disclosure is a fourth embodiment of a method for real-time monitoring of depth applied to laser processing, the steps of which are: finding a focus point A1: placing a non-transparent object to be processed 89 on The three-axis moving device 86, the laser generator 70 emits a laser beam 700, and the laser beam 700 is split into a first laser beam 701 and a second laser beam 702 via a beam splitter 71. The first laser beam 701 passes through a first laser beam 701. The polarizer 721 of a mirror group 72 adjusts its power to form a lower power laser beam (e.g., symbol 703 of FIG. 6), and the control unit 88 opens the shutter 73 for the laser beam to pass through; The beam 705 is adjusted by the polarizer 781 of the second mirror group 78 to form a low-power laser beam, which is combined with the laser beam passing through the shutter 73 to a junction point (such as the component of FIG. Symbol 704) to form a laser beam (e.g., symbol 706 of FIG. 6), the laser beam being reflected by the first mirror 75 to the surface of the object to be processed 89 to form a focus point; wherein the laser beam is formed When the light beam is reflected to the surface of the object to be processed 89, the laser beam system Passing through the first multi-function mirror 80 and the second multi-function mirror 81, and then the laser beam is reflected along its traveling path to the second multi-function mirror 81 and reflected by the second multi-function mirror 81 to As measured by the light detector 85, the laser beam is still reflected along its travel path to the first multi-function mirror 80 and reflected by the first multi-function mirror 80 for measurement by the visual image device 84. It is known that the surface of the workpiece 89 has a focus point.

Adjusting the position A2 of the workpiece to be processed: If the surface of the workpiece 89 does not have a focus point, the three-axis moving device 86 adjusts the position of the workpiece 89 to The surface of the workpiece 89 has a focus point. If the surface of the workpiece 89 has a focus point, the polarizer 721 of the first mirror group 72 adjusts the power of the first laser beam 701 to form a processing beam 703, and second. The polarizing plate 781 of the mirror group 78 adjusts the power of the second laser beam 702 to form a first detecting beam 705; the first detecting beam 705 and the processing beam 703 are collected at a junction 704 to form an integrated beam 706, which is integrated. The light beam 706 is reflected by the first mirror 75 and the second mirror group 76 to the surface of the object to be processed 89 to form a focus point; the integrated beam 706 is reflected to form a reflected beam 707, and the reflected beam 707 is integrated along the line. The traveling path of the beam 706 is reflected and reflected by the second multi-function mirror 81 to form a second detecting beam 708, the second detecting beam 708 is measured by the photodetector 85; the third detecting beam 709 is first The multi-function mirror 80 is reflected to be read by the visual imaging device 84, and it is known that the surface of the object to be processed 89 has a focus point. If the focus point has been read, the control unit 88 closes the shutter 73.

The traveling path of the second laser beam 702 is controlled by the third mirror group 79. The traveling path of the integrated beam 706 is controlled by the first mirror 75 and the second mirror group 76. The first detecting beam 707 The path of travel is controlled by a fourth mirror 77.

Adjusting the etching depth A3: Taking the above-mentioned focus point as the origin, the three-axis moving device 38 moves the object to be processed 89 toward the focus point to the depth of the desired etching.

Processing and measurement A4: The control unit 88 opens the shutter 73 to control the processing beam 703 and performs etching processing. The lock-in amplifier 47 synchronously measures the processing beam 703, and the photodetector 85 simultaneously measures the second detecting beam. 708.

The etch depth A5 has been reached: the photodetector 85 measures the second detection beam 708, and informs the lock-in amplifier 87 of the measured result to change the power of the processing beam 703, and the image vision device 84 reads the third detection beam. 709, to detect the etch depth synchronously, and inform the control unit 88 that if the etch depth has been reached, the control unit 88 closes the shutter 73.

The second detection beam 708 is filtered by the optical filter group 83, reduces noise, selects the beam, and adjusts the power of the laser beam for the photodetector to measure 85, the color difference, focal length or focus of the second detection beam 708. The action of being controlled by the lens 82 to filter, reduce noise, select the beam, and adjust the power of the laser beam can also be seen in the steps of processing and measuring A4 and adjusting the position A2 of the object to be processed.

Referring to FIG. 7 , the disclosure is a fifth embodiment of a depth real-time monitoring system applied to laser processing. The components and arrangements in this embodiment are similar to the first embodiment of the disclosure, so that the components are The symbol follows the first embodiment of the present disclosure.

In the first embodiment, the first mirror group 13 has a mirror 130 and a prism 131. As shown in FIG. 7, in the embodiment, the first mirror group 13 has only at least one mirror 130 for reflection. The beam 103 is processed. In various embodiments as described above, the mirror assembly can be comprised of at least one mirror or consist of at least one mirror and a prism, as determined by the state of implementation.

In combination with the above embodiments, the first embodiment of the present invention relates to a depth real-time monitoring system for laser processing and a method thereof, as shown in FIG. 1, which is applied to a transparent workpiece 26, a first detecting beam. 104 and processing beam 103 each have their own travel path, the travel of first detection beam 104 The path is larger than the processing beam 103, and the first detecting beam 104 and the processing beam 103 are collected in the object to be processed 26. Therefore, the lock-in amplifier 23 and the photodetector 22 can determine the first detection under a difference of the traveling path. The beam 104 and the processing beam 103 are spatially and temporally overlapped to perform an instantaneous measurement of the non-common path, and the actual depth of the laser processing is instantaneously monitored by measuring the change of the signal.

A second embodiment of the present invention relates to a depth real-time monitoring system for laser processing and a method thereof. As shown in FIG. 4, a transparent workpiece 49 is applied, and the processing beam 303 and the first detecting beam 304 have a common The path of travel, but the path of travel of the first detection beam 304 is greater than the processing beam 303, by means of the lock-in amplifier 47 and the photodetector 43 for instantaneous measurement of a common path.

A third embodiment of the present invention relates to a depth real-time monitoring system for laser processing and a method thereof, as shown in FIG. 5, which is applied to a non-transparent workpiece 68, and a first detection beam 504 and a processing beam 503 are respectively used. There is an independent travel path, and the travel path of the first detection beam 504 is greater than the travel path of the processing beam 503, and is used by the lock-in amplifier 66 and the photodetector 65 to perform an instantaneous measurement of a non-co-path.

The third embodiment of the present invention relates to a depth real-time monitoring system for laser processing and a method thereof, as shown in FIG. 6, which is applied to a non-transparent workpiece 85, and the processing beam 703 and the first detecting beam 705 are The same travel path, but the path of the added light beam 703 is smaller than the first detection beam 705, and is used by the lock-in amplifier 87 and the photodetector 85 to perform an instantaneous measurement of a common path.

Please refer to Annexes I to III for the application of the present invention to multiple The actual verification map of the workpiece processing, the plurality of objects to be processed are separately subjected to the processing experiment of the depth monitoring of the present invention. It can be known from the attachments 1 to 3 that the micro-holes of 38 um depth are processed through the instant monitoring system when the workpiece is to be processed. The processing depths of the workpieces are 37.35um, 38.03um and 37.87um, respectively, and the error of the machining depth can be controlled between ±0.7um.

The specific embodiments described above are only used to illustrate the features and functions of the present disclosure, and are not intended to limit the scope of the disclosure, and may be used without departing from the spirit and scope of the disclosure. Equivalent changes and modifications made to the disclosure disclosed herein are still covered by the scope of the following claims.

10‧‧‧Laser Generator

100‧‧‧Laser beam

101‧‧‧First laser beam

102‧‧‧second laser beam

103‧‧‧Processing beam

104‧‧‧First detection beam

105‧‧‧ Focus point

106‧‧‧Second detection beam

11‧‧‧beam splitter

12‧‧‧ first mirror

120‧‧‧Half wave plate

121‧‧‧Polarizer

13‧‧‧First Mirror Set

130‧‧‧Mirror

131‧‧‧Ling Mirror

14‧‧‧First lens

15‧‧‧Second mirror group

150‧‧‧Mirror

16‧‧‧Second mirror

160‧‧‧ half wave plate

161‧‧‧Polarizer

17‧‧‧second lens

18‧‧ ‧Shutter

19‧‧‧Chopper

20‧‧‧Three-axis mobile device

21‧‧‧Optical filter group

210‧‧‧ aperture

211‧‧‧Polarizer

22‧‧‧Photodetector

23‧‧‧Lock-in amplifier

24‧‧‧Visual imaging device

25‧‧‧Control unit

26‧‧‧Processing

30‧‧‧Laser Generator

300‧‧‧Laser beam

301‧‧‧First laser beam

302‧‧‧second laser beam

303‧‧‧Processing beam

304‧‧‧First detection beam

305‧‧‧ meeting point

306‧‧‧Integrated beam

307‧‧‧ Third detection beam

308‧‧‧Second detection beam

31‧‧‧beam splitter

32‧‧‧ first mirror

320‧‧‧Half wave plate

321‧‧‧Polarizer

33‧‧‧Shutter

34‧‧‧Chopper

35‧‧‧First mirror

36‧‧‧Second mirror group

360‧‧‧Mirror

361‧‧‧ Mirror

37‧‧‧First lens

38‧‧‧ Third Mirror Set

380‧‧‧Mirror

39‧‧‧Second mirror

390‧‧‧Half-wave plate

391‧‧‧Polarizer

40‧‧‧fourth mirror

41‧‧‧Three-axis mobile device

42‧‧‧Multi-function mirror

43‧‧‧Photodetector

44‧‧‧second lens

45‧‧‧Optical filter group

450‧‧‧ aperture

451‧‧‧Polarizer

46‧‧‧Visual imaging device

47‧‧‧Lock-in amplifier

48‧‧‧Control unit

49‧‧‧Processing

50‧‧‧Laser Generator

500‧‧‧Laser beam

501‧‧‧First laser beam

502‧‧‧second laser beam

503‧‧‧Processing beam

504‧‧‧First detection beam

505‧‧‧ Focus point

506‧‧‧second detection beam

507‧‧‧ Third detection beam

51‧‧‧beam splitter

52‧‧‧ first mirror

520‧‧‧Half wave plate

521‧‧‧Polarizer

53‧‧ ‧Shutter

54‧‧‧Chopper

55‧‧‧First Mirror Set

550‧‧‧Ling Mirror

551‧‧‧Mirror

56‧‧‧Multi-function mirror

57‧‧‧First lens

58‧‧‧Three-axis mobile device

59‧‧‧Second mirror group

591‧‧‧Mirror

60‧‧‧Second mirror

600‧‧‧Half wave plate

601‧‧‧Polarizer

61‧‧‧second lens

62‧‧‧Image vision device

63‧‧‧ third lens

64‧‧‧Optical filter

640‧‧ ‧Shutter

641‧‧‧Polarizer

65‧‧‧Photodetector

66‧‧‧Lock-in amplifier

67‧‧‧Control unit

68‧‧‧Processing

70‧‧‧Laser Generator

700‧‧‧Laser beam

701‧‧‧First laser beam

702‧‧‧second laser beam

703‧‧‧Processing beam

704‧‧ ‧ meeting point

705‧‧‧First detection beam

706‧‧‧Integrated beam

707‧‧·reflected beam

708‧‧‧Second detection beam

709‧‧‧ Third detection beam

71‧‧‧beam splitter

72‧‧‧ first mirror

720‧‧‧ half wave plate

721‧‧‧Polarizer

73‧‧ ‧Shutter

74‧‧‧Chopper

75‧‧‧First mirror

76‧‧‧Second mirror group

760‧‧‧ Mirror

761‧‧‧Mirror

77‧‧‧fourth beam splitter

78‧‧‧Second mirror

780‧‧‧Half-wave plate

781‧‧‧Polarizer

79‧‧‧ Third Mirror Group

790‧‧‧Mirror

80‧‧‧First multi-function mirror

81‧‧‧Second multiplexed mirror

82‧‧‧ lens

83‧‧‧Optical filter group

830‧‧ ‧ aperture

831‧‧‧Polarizer

84‧‧‧Visual imaging device

85‧‧‧Photodetector

86‧‧‧Three-axis mobile device

87‧‧‧Lock-in amplifier

88‧‧‧Control unit

89‧‧‧Processing

A1~A5‧‧‧Steps

Point B ‧ ‧ shutter open

C point ‧ ‧ shutter closed

FIG. 1 is a schematic diagram of a first embodiment of a depth real-time monitoring system applied to laser processing according to the present disclosure.

Figure 2 is a schematic diagram of the action of a workpiece, a detection beam and a processing beam.

Figure 3 is a diagram of the relationship between optical signals and time.

FIG. 4 is a schematic diagram of a second embodiment of the depth real-time monitoring system applied to laser processing according to the present disclosure.

FIG. 5 is a schematic diagram of a third embodiment of the depth real-time monitoring system applied to laser processing according to the present disclosure.

Figure 6 is a schematic diagram of a fourth embodiment of the depth real-time monitoring system applied to laser processing according to the present disclosure.

Figure 7 is a schematic diagram of a fifth embodiment of the depth real-time monitoring system applied to laser processing according to the present disclosure.

FIG. 8 is a schematic flow chart of a depth real-time monitoring method applied to laser processing according to the present disclosure.

The first to third embodiments of the present invention apply the actual verification map for processing a plurality of objects to be processed.

10‧‧‧Laser Generator

100‧‧‧Laser beam

101‧‧‧First laser beam

102‧‧‧second laser beam

103‧‧‧Processing beam

104‧‧‧First detection beam

105‧‧‧ Focus point

106‧‧‧Second detection beam

11‧‧‧beam splitter

12‧‧‧ first mirror

120‧‧‧Half wave plate

121‧‧‧Polarizer

13‧‧‧First Mirror Set

130‧‧‧Mirror

131‧‧‧Ling Mirror

14‧‧‧First lens

15‧‧‧Second mirror group

150‧‧‧Mirror

16‧‧‧Second mirror

160‧‧‧ half wave plate

161‧‧‧Polarizer

17‧‧‧second lens

18‧‧ ‧Shutter

19‧‧‧Chopper

20‧‧‧Three-axis mobile device

21‧‧‧Optical filter group

210‧‧‧ aperture

211‧‧‧Polarizer

22‧‧‧Photodetector

23‧‧‧Lock-in amplifier

24‧‧‧Visual imaging device

25‧‧‧Control unit

26‧‧‧Processing

Claims (37)

A depth real-time monitoring system for laser processing, comprising: a processing beam; a detecting beam, the processing beam is collected at a focusing point; and a shutter is disposed on the traveling path of the processing beam; a three-axis moving device is disposed between the focus point and the traveling path of the detecting beam; a photodetector is disposed on the traveling path of the detecting beam; and a visual image device is disposed on the Adjacent to the three-axis moving device; a lock-in amplifier electrically connected to the photodetector; and a control unit electrically connected to the lock-in amplifier, the visual image device, the shutter and the Three-axis mobile device. The depth real-time monitoring system applied to laser processing according to claim 1, wherein the detecting beam is a first detecting beam, and the processing beam is collected at the focusing point to form a second The beam is detected or formed to form an integrated beam that becomes a second detection beam. The depth real-time monitoring system applied to laser processing according to claim 2, further comprising a laser generator and a beam splitter, the laser generator emitting a laser beam, the laser beam system The beam splitter is divided into a first laser beam and a second laser beam. The first laser beam forms the processing beam, and the second laser beam forms the first detecting beam. The depth real-time monitoring system applied to laser processing according to claim 3, wherein the processing path of the processing beam is provided with a clipping The chopper is electrically connected to the lock-in amplifier. The depth real-time monitoring system applied to laser processing according to claim 4, wherein the path of the first laser beam is provided with a first mirror group having a half wave plate and a polarization sheet. The depth real-time monitoring system applied to the laser processing according to the fifth aspect of the invention, wherein the second laser beam has a second mirror group and a second mirror group, the second mirror The group has at least one mirror having a half wave plate and a polarizing plate, or the path of the second laser beam is provided with a third mirror group and a second mirror group, the third reflecting group The mirror assembly has at least one mirror having a half wave plate and a polarizing plate. The depth monitoring system for laser processing as described in claim 6, wherein the path of the second detecting beam is provided with an optical filter group having an aperture and a polarizer, or The traveling path of the integrated beam is provided with a first lens and a multi-function mirror, and the integrated beam is reflected by the multi-function mirror and becomes the second detecting beam, and a path of the second detecting beam is provided with a second lens And an optical filter set having an aperture and a polarizer, the visual image device generating a third detection beam, the three-axis movement device being located in a path of the third detection beam, and the first The path of the detection beam is provided with a fourth mirror. The depth real-time monitoring system applied to the laser processing according to the first aspect of the invention, wherein the traveling path of the processing beam is provided with a first mirror group and a first lens, and the first mirror group has a a mirror and at least one mirror, or at least one mirror; the line of the first detecting beam The second path is provided with a second lens, or the intersection is provided with a first mirror, a second mirror group and a first lens are disposed on the path of the integrated beam, and the second mirror group has at least one mirror With a mirror, or at least a mirror. A depth real-time monitoring method applied to laser processing, the steps comprising: finding a focus point: a first laser beam and a second laser beam are adjusted in power to form a second power laser a light beam that opens a shutter for a laser beam to pass through, the two laser beams are collected on a surface of a transparent object to be formed to form a focus point; and the position of the object to be processed is adjusted: if the object to be processed is to be processed If the surface of the object cannot form a focus point, the position of the object to be processed is adjusted to find the focus point. If the focus point is found, the power of the first laser beam is adjusted to form a processing beam. And adjusting the power of the second laser beam to form a detection beam, the detection beam and the processing beam forming a focus point on a surface of the object to be processed, and if the focus point is read, closing the shutter; adjusting etching Depth: the distance from the focus point to the focus point to the desired etching depth with the focus point as the origin; processing and measurement: opening the shutter to control the processing beam and performing Etching, and the measurement of the synchronous detection beam machining beams; and etching depth reached: varying the power of the light beam according to the information processing of the measured light beam is detected, if the etching depth reached, the faster is closed door. The depth real-time monitoring method applied to laser processing according to claim 9, wherein in the step of finding a focus point, the two laser beams are collected at a junction to form an integrated beam. The integrated beam is focused on the surface of the transparent object to be formed to form the focus point; in the step of adjusting the position of the object to be processed, the detecting beam is a first detecting beam, and the first detecting beam is The processing beam passes through the object to be processed, and the first detecting beam and the processing beam are integrated into a second detecting beam, or the processing beam and the first detecting beam are collected at a junction to form an integrated beam. The integrated beam system is focused on the surface of the object to be processed to form a focus point, and the integrated beam is a second detection beam, and the focus point is read to know that the surface of the object to be processed has the focus point. The depth real-time monitoring method applied to laser processing according to claim 10, wherein in the step of finding a focus point, a laser generator emits a laser beam, and the laser beam is passed through a beam splitter. Dividing into the first laser beam and the second laser beam; the shutter is opened by a control unit for the laser beam to pass. The depth real-time monitoring method applied to laser processing according to claim 11, wherein in the step of finding a focus point, the object to be processed is placed on a three-axis moving device; In the step of the object position, if the focus point is not formed on the surface of the object to be processed, the three-axis moving device adjusts the position of the object to be processed so that the focus point is formed on the surface of the object to be processed. The depth real-time monitoring method applied to laser processing according to claim 12, wherein in the step of adjusting the position of the object to be processed, the focus point is read by a visual image device; In the step of measuring, the second detecting beam is measured by a photodetector; in the step of reaching the etching depth, the photodetector measures the information to be notified to the lock a phase amplifier for changing the power of the processing beam; if the focus point is found, the control unit closes the shutter, or the step of adjusting the position of the object to be processed, a visual image device reads a third detection beam to obtain Knowing that the surface of the object to be tested has the focus point, if the focus point has been read, the control unit closes the shutter; in the step of processing and measuring, the second detection beam is received by a photodetector Measuring, in the step of reaching the etch depth, the photodetector notifies the lock amplifier to the lock amplifier to change the power of the processing beam, and if the etch depth has reached, the control unit is turned off. The shutter, the Through a multi-function combined light beam reflected by the mirror and into the second detection light beam. The depth real-time monitoring method applied to laser processing according to claim 13 , wherein in the step of processing and measuring, the control unit turns on the shutter; in the step of reaching the etching depth, The lock-in amplifier controls a chopper to change the power of the processing beam; if the etch depth has been reached, the control unit turns off the shutter. The depth real-time monitoring method applied to laser processing according to claim 14, wherein in the step of reaching the etching depth, the second detecting beam is filtered by an optical filter group to reduce noise and select the beam and Adjusting the power of the laser beam for measurement by the photodetector, or in the step of reaching the etch depth, the second detection beam is optically filtered The group filters, reduces noise, selects the beam, and adjusts the power of the laser beam for measurement by the photodetector. The depth real-time monitoring method applied to laser processing according to the fifteenth aspect of the invention, wherein in the step of adjusting the position of the workpiece, the traveling path of the second laser beam is subjected to a second mirror group Controlled, the traveling path of the processing beam is controlled by a first mirror group, and the power of the first detecting beam is controlled by a second mirror group, and the power of the processing beam is received by a first mirror group Controlling, the chromatic aberration, focal length or focus of the processing beam is controlled by a first lens, the chromatic aberration, focal length or focus of the first detecting beam is controlled by a second lens, or the step of adjusting the position of the object to be processed The traveling path of the integrated beam is controlled by a first mirror and a second mirror group. The color difference, focal length or focus of the integrated beam is controlled by a first lens, and the power of the processing beam is subjected to a Controlled by the first lens group, the power of the first detection beam is controlled by a second lens group, and the path of the first laser beam is controlled by a third mirror group The travel path of the detection beam of the first line by a fourth mirror is controlled. A depth real-time monitoring system for laser processing, comprising: a processing beam; a detecting beam, the processing beam is collected at a focusing point; and a shutter is disposed on the traveling path of the processing beam; a three-axis moving device is disposed at the focus point; a photodetector is disposed on the traveling path of the detecting beam; and a visual image device is disposed adjacent to the three-axis moving device; a lock-in amplifier electrically connected to the photodetector; and a control unit electrically connected to the three-axis moving device, the visual image device, the shutter and the lock-in amplifier. The depth real-time monitoring system applied to laser processing according to claim 17, wherein the detecting beam is a first detecting beam, and the processing beam is collected at the focusing point to form a second detecting. The light beam, or the detection beam is a first detection beam, which is combined with the processing beam at an intersection to form an integrated beam, the integrated beam forming a reflected beam, the reflected beam being a second detection beam . The depth real-time monitoring system applied to laser processing according to claim 18, further comprising a laser generator and a beam splitter, the laser generator emitting a laser beam, the laser beam emitting The beam splitter is divided into a first laser beam and a second laser beam, the first laser beam forming the processing beam, and the second laser beam forming the first detecting beam. The depth real-time monitoring system applied to laser processing according to claim 19, wherein the processing path of the processing beam is provided with a chopper, and the chopper is electrically connected to the lock-in amplifier. The depth real-time monitoring system applied to laser processing according to claim 20, wherein the path of the first laser beam is provided with a first mirror group having a half wave plate and a polarization a sheet, or a path of the second laser beam, a third mirror group and a second mirror group, the third mirror group having at least one mirror, the second mirror having a half wave plate and a polarization sheet. The depth real-time monitoring system applied to laser processing according to claim 21, wherein the second detecting beam is reflected at an angle, or the traveling path of the integrated beam is provided with a first multi-function mirror, The reflected beam is reflected by the first multi-function mirror to become the second detection beam. The depth real-time monitoring system for laser processing according to claim 22, wherein the visual image device generates a third detection light, and the third detection beam passes through a multi-function mirror and a first The lens is focused to focus on or reflected back to the visual image device, or the third detection beam is reflected by a first multi-function mirror to be reflected to or reflected back to the three-axis moving device. The depth monitoring system for laser processing according to claim 23, wherein the path of the first detecting beam is provided with a second mirror group, a second mirror group and a second lens. The second mirror group has at least one mirror, the second mirror group has a half wave plate and a polarizing plate, or a traveling path of the first detecting beam is provided with a fourth mirror; a path of the second detecting beam is set. There is a lens and an optical filter set having an aperture and a polarizer. The depth monitoring system for laser processing according to claim 24, wherein the path of the second detecting beam is provided with a third lens and an optical filter group, the optical filter group having an aperture and a Polarizer. The depth real-time monitoring system applied to laser processing according to claim 17, wherein the path of the first laser beam is provided with a first mirror group having a half wave plate and a polarization Film, the plus The travel path of the beam is provided with a first lens. The depth real-time monitoring system applied to laser processing according to claim 26, wherein the traveling path of the processing beam is provided with a first mirror group, the first mirror group having at least one mirror or at least one a mirror and a prism, the traveling path of the processing beam is provided with a first lens, or the intersection is provided with a first mirror, and the path of the first integrated beam is provided with a second mirror group, the second reflector The mirror assembly has at least one mirror and a mirror or at least one mirror. A depth real-time monitoring method applied to laser processing, the steps comprising: finding a focus point: a first laser beam and a second laser beam are adjusted in power to form a second power laser a light beam that opens a shutter for a laser beam to pass through, the two laser beams are collected on a surface of a non-transparent object to be processed, and a focusing point is formed to form two reflected beams; Position: if a focus point is not formed on the surface of the object to be processed, adjust the position of the object to be processed to find the focus point. If the focus point is found, the power of the first laser beam is Adjusting to form a processing beam, the power of the second laser beam is adjusted to form a detection beam, and the detection beam and the processing beam are collected on the surface of the object to be processed to form a focus point. Knowing that the surface of the object to be processed has the focus point, if the focus point has been read, closing the shutter; adjusting the etching depth: using the focus point as an origin, moving the object to be processed toward the focus point to a desired position Etching From the depth of; Performing processing and measuring: opening the shutter to control the processing beam, the detecting beam synchronously measuring the processing beam; reaching the etching depth: measuring the detecting beam, and changing the detection according to the result of the detecting beam The power of the processing beam, if it has reached the etch depth, closes the shutter. The depth real-time monitoring method applied to laser processing according to claim 28, wherein in the step of finding a focus point, a laser generator emits a laser beam, and the laser beam passes through a beam splitter. Divided into the first laser beam and the second laser beam. The depth real-time monitoring method applied to laser processing according to claim 29, wherein in the step of adjusting a position of the workpiece, the power of the second laser beam is adjusted to form a first Detecting a light beam, the first detection beam and the processing beam are collected on a surface of the object to be processed to form a focus point, and become a second detection beam, and the focus point is read, and the object to be processed is known The surface has the focus point, or in the step of finding a focus point, the two laser beams are collected at a junction to form an integrated beam, and in the step of adjusting the position of the object to be processed, the second mine The power of the beam is adjusted to form a first detection beam, and the processing beam and the first detection beam are collected at a junction to form an integrated beam that is focused on the surface of the object to be processed. So that a surface of the object to be processed is formed with a focus point, and the integrated beam is reflected to form a reflected beam, which becomes a second detection beam. The method for applying the depth monitoring method for laser processing as described in claim 30, wherein in the step of finding a focus point, the to-be-added The work item is placed on a three-axis moving device. If the focus point is not formed on the surface of the object to be processed, the three-axis moving device adjusts the position of the object to be processed. The depth monitoring method for laser processing as described in claim 31, wherein in the step of adjusting the position of the object to be processed, the second detecting beam is reflected at an angle, or the adjustment is to be processed. In the step of the object position, a visual image device reads a third detection beam to know that the surface of the object to be processed has the focus point; in the step of processing and measuring, the second detection beam is A photodetector measures. The depth monitoring method for laser processing as described in claim 32, wherein in the step of adjusting the position of the object to be processed, the third detecting beam is reflected by a multi-function mirror for a visual image device measuring; in the step of processing and measuring, the second detecting beam is measured by a photodetector, or in the step of adjusting a position of the object to be processed, the reflected beam Reflected by a second multi-function mirror to become the second detection beam. The depth real-time monitoring method applied to laser processing according to claim 33, wherein in the step of reaching the etching depth, the photodetector notifies the phase-locked amplifier of the measured result, the lock The phase amplifier controls a chopper to vary the power of the processing beam. The depth real-time monitoring method applied to laser processing according to claim 34, wherein in the step of finding a focus point, the shutter is opened by a control unit; in the step of processing and measuring The control unit opens the shutter to control the processing beam; In the step of reaching the etch depth, the control unit closes the shutter if the etch depth has been reached. The method for applying the depth of the laser to the depth monitoring method according to claim 35, wherein in the step of reaching the etching depth, the color difference, the focal length or the focus of the second detecting beam is a third lens Controlling, the second detection beam is filtered by an optical filter group, reducing noise, selecting a beam, and adjusting the power of the laser beam for measurement by the photodetector, or the step of reaching the etch depth The second detection beam is filtered by an optical filter group to reduce noise, select the beam, and adjust the power of the laser beam for measurement by the photodetector. The depth real-time monitoring method applied to laser processing according to claim 36, wherein in the step of adjusting the position of the workpiece, the power of the processing beam is controlled by a first mirror group, and the processing is performed. The traveling path of the light beam is controlled by a first mirror group, and the color difference, focal length or focus of the first processing beam is controlled by a first lens, and the path of the first detecting beam is a second mirror Controlled by the group, the color difference, focal length or focus of the first detecting beam is controlled by a second lens, and the power of the first detecting beam is controlled by a second mirror group, or the position of the object to be processed is adjusted. In the step, the traveling path of the integrated beam is controlled by a first mirror and a second mirror group, and the traveling path of the second laser beam is controlled by a third mirror group, the first detecting The path of the beam is controlled by a fourth mirror, the power of which is controlled by a second lens group whose power is controlled by a first lens group.