AU2001257564A1 - Method and apparatus for agitation of workpiece in high pressure environment - Google Patents
Method and apparatus for agitation of workpiece in high pressure environmentInfo
- Publication number
- AU2001257564A1 AU2001257564A1 AU2001257564A AU5756401A AU2001257564A1 AU 2001257564 A1 AU2001257564 A1 AU 2001257564A1 AU 2001257564 A AU2001257564 A AU 2001257564A AU 5756401 A AU5756401 A AU 5756401A AU 2001257564 A1 AU2001257564 A1 AU 2001257564A1
- Authority
- AU
- Australia
- Prior art keywords
- agitation
- workpiece
- high pressure
- pressure environment
- environment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20283500P | 2000-05-08 | 2000-05-08 | |
US60202835 | 2000-05-08 | ||
PCT/US2001/014814 WO2001085391A2 (en) | 2000-05-08 | 2001-05-07 | Method and apparatus for agitation of workpiece in high pressure environment |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001257564A1 true AU2001257564A1 (en) | 2001-11-20 |
Family
ID=22751454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001257564A Abandoned AU2001257564A1 (en) | 2000-05-08 | 2001-05-07 | Method and apparatus for agitation of workpiece in high pressure environment |
Country Status (4)
Country | Link |
---|---|
US (1) | US6487792B2 (en) |
AU (1) | AU2001257564A1 (en) |
TW (1) | TW522044B (en) |
WO (1) | WO2001085391A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6748960B1 (en) | 1999-11-02 | 2004-06-15 | Tokyo Electron Limited | Apparatus for supercritical processing of multiple workpieces |
US7767145B2 (en) | 2005-03-28 | 2010-08-03 | Toyko Electron Limited | High pressure fourier transform infrared cell |
US7789971B2 (en) | 2005-05-13 | 2010-09-07 | Tokyo Electron Limited | Treatment of substrate using functionalizing agent in supercritical carbon dioxide |
WO2007047163A2 (en) * | 2005-10-04 | 2007-04-26 | Applied Materials, Inc. | Methods and apparatus for drying a substrate |
CN107502893B (en) * | 2017-08-07 | 2024-01-30 | 上海利正卫星应用技术有限公司 | Corrosion machine self-rotating chuck device |
CN111550981A (en) * | 2020-04-23 | 2020-08-18 | 芜湖碧水谣医疗设备科技有限公司 | Drying device for medical instrument and appliance of department of stomatology |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3608783A1 (en) * | 1986-03-15 | 1987-09-17 | Telefunken Electronic Gmbh | Gas-phase epitaxial method and apparatus for carrying it out |
US5288333A (en) | 1989-05-06 | 1994-02-22 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method and apparatus therefore |
JPH06500427A (en) | 1990-02-16 | 1994-01-13 | ボック、エドワード | Improved equipment for wafer transport and processing |
US5370741A (en) * | 1990-05-15 | 1994-12-06 | Semitool, Inc. | Dynamic semiconductor wafer processing using homogeneous chemical vapors |
US5934856A (en) | 1994-05-23 | 1999-08-10 | Tokyo Electron Limited | Multi-chamber treatment system |
JPH10144757A (en) | 1996-11-08 | 1998-05-29 | Dainippon Screen Mfg Co Ltd | Substrate processing device |
JPH10144650A (en) * | 1996-11-11 | 1998-05-29 | Mitsubishi Electric Corp | Semiconductor material cleaner |
US6149828A (en) | 1997-05-05 | 2000-11-21 | Micron Technology, Inc. | Supercritical etching compositions and method of using same |
US6235634B1 (en) | 1997-10-08 | 2001-05-22 | Applied Komatsu Technology, Inc. | Modular substrate processing system |
US6005226A (en) | 1997-11-24 | 1999-12-21 | Steag-Rtp Systems | Rapid thermal processing (RTP) system with gas driven rotating substrate |
US6449428B2 (en) | 1998-12-11 | 2002-09-10 | Mattson Technology Corp. | Gas driven rotating susceptor for rapid thermal processing (RTP) system |
US6251250B1 (en) * | 1999-09-03 | 2001-06-26 | Arthur Keigler | Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the processing of other work piece surfaces as well |
-
2001
- 2001-05-07 US US09/850,888 patent/US6487792B2/en not_active Expired - Fee Related
- 2001-05-07 WO PCT/US2001/014814 patent/WO2001085391A2/en active Application Filing
- 2001-05-07 AU AU2001257564A patent/AU2001257564A1/en not_active Abandoned
- 2001-05-08 TW TW090110971A patent/TW522044B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2001085391A2 (en) | 2001-11-15 |
TW522044B (en) | 2003-03-01 |
US20010037586A1 (en) | 2001-11-08 |
WO2001085391A3 (en) | 2002-05-23 |
US6487792B2 (en) | 2002-12-03 |
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AU2001257564A1 (en) | Method and apparatus for agitation of workpiece in high pressure environment |