AU2001256778A1 - Radiation detector and method of manufacture thereof - Google Patents

Radiation detector and method of manufacture thereof

Info

Publication number
AU2001256778A1
AU2001256778A1 AU2001256778A AU5677801A AU2001256778A1 AU 2001256778 A1 AU2001256778 A1 AU 2001256778A1 AU 2001256778 A AU2001256778 A AU 2001256778A AU 5677801 A AU5677801 A AU 5677801A AU 2001256778 A1 AU2001256778 A1 AU 2001256778A1
Authority
AU
Australia
Prior art keywords
manufacture
radiation detector
detector
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001256778A
Inventor
Takuya Homme
Kazuhisa Miyaguchi
Toshio Takabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of AU2001256778A1 publication Critical patent/AU2001256778A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
    • H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
AU2001256778A 2000-05-19 2001-05-18 Radiation detector and method of manufacture thereof Abandoned AU2001256778A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-148308 2000-05-19
JP2000148308A JP4398065B2 (en) 2000-05-19 2000-05-19 Radiation detector
PCT/JP2001/004174 WO2001088569A1 (en) 2000-05-19 2001-05-18 Radiation detector and method of manufacture thereof

Publications (1)

Publication Number Publication Date
AU2001256778A1 true AU2001256778A1 (en) 2001-11-26

Family

ID=18654360

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001256778A Abandoned AU2001256778A1 (en) 2000-05-19 2001-05-18 Radiation detector and method of manufacture thereof

Country Status (6)

Country Link
US (1) US6919569B2 (en)
EP (1) EP1300692B1 (en)
JP (1) JP4398065B2 (en)
AU (1) AU2001256778A1 (en)
DE (1) DE60129818T2 (en)
WO (1) WO2001088569A1 (en)

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DE60144280D1 (en) * 2000-05-19 2011-05-05 Hamamatsu Photonics Kk Lung
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JP4391078B2 (en) * 2002-11-28 2009-12-24 浜松ホトニクス株式会社 Solid-state imaging device and radiation imaging device
WO2004090928A1 (en) * 2003-04-04 2004-10-21 Matsushita Electric Industrial Co. Ltd. Method for manufacturing plasma display panel
JP4563042B2 (en) * 2004-01-29 2010-10-13 浜松ホトニクス株式会社 Radiation image sensor
ATE553400T1 (en) * 2005-02-10 2012-04-15 Koninkl Philips Electronics Nv PORTABLE X-RAY DETECTOR PLATE WITH SHOCK ABSORPTION
FR2888043B1 (en) * 2005-07-01 2007-11-30 Atmel Grenoble Soc Par Actions FIBER OPTICAL IMAGE SENSOR
US7972659B2 (en) 2008-03-14 2011-07-05 Ecosil Technologies Llc Method of applying silanes to metal in an oil bath containing a controlled amount of water
DE102008033759B4 (en) 2008-07-18 2011-01-20 Siemens Aktiengesellschaft scintillator
US9492129B2 (en) * 2008-10-27 2016-11-15 Dental Imaging Technologies Corporation Triggering of intraoral X-ray sensor using pixel array sub-sampling
US8119990B2 (en) * 2008-10-27 2012-02-21 Imaging Sciences International Llc System and method of X-ray detection with a sensor
US8366318B2 (en) * 2009-07-17 2013-02-05 Dental Imaging Technologies Corporation Intraoral X-ray sensor with embedded standard computer interface
JP5908668B2 (en) * 2010-04-12 2016-04-26 富士フイルム株式会社 Portable radiography system
JP5475574B2 (en) 2010-07-02 2014-04-16 富士フイルム株式会社 Radiation detection element and radiographic imaging device
JP5599681B2 (en) * 2010-08-31 2014-10-01 富士フイルム株式会社 Radiation imaging equipment
US9018725B2 (en) * 2011-09-02 2015-04-28 Optiz, Inc. Stepped package for image sensor and method of making same
DE102011083420A1 (en) 2011-09-26 2013-03-28 Siemens Aktiengesellschaft Radiation detector e.g. digital X-ray detector has protective layer which is arranged on surface of scintillator, by facing an incident radiation portion on surface of scintillator
JP2013246078A (en) * 2012-05-28 2013-12-09 Fujifilm Corp Radiation image detection device
US9496247B2 (en) 2013-08-26 2016-11-15 Optiz, Inc. Integrated camera module and method of making same
JP6259382B2 (en) * 2014-09-22 2018-01-10 富士フイルム株式会社 Electronic cassette
DE102016214482A1 (en) * 2016-08-04 2018-02-08 Berthold Technologies Gmbh & Co. Kg Radiometric measuring device
DE102018115952A1 (en) 2018-07-02 2020-01-02 Ebm-Papst St. Georgen Gmbh & Co. Kg Motor arrangement with a can
KR102666048B1 (en) * 2019-05-29 2024-05-13 엘지디스플레이 주식회사 The digital x-ray detector and the digital x-ray detect apparatus including the same and the manufacturing method thereof

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Also Published As

Publication number Publication date
US20030116714A1 (en) 2003-06-26
EP1300692A4 (en) 2004-11-03
JP2001330675A (en) 2001-11-30
EP1300692B1 (en) 2007-08-08
DE60129818D1 (en) 2007-09-20
JP4398065B2 (en) 2010-01-13
EP1300692A1 (en) 2003-04-09
DE60129818T2 (en) 2008-04-17
US6919569B2 (en) 2005-07-19
WO2001088569A1 (en) 2001-11-22

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