AU2001255845A1 - A process for fabricating hollow electroactive devices - Google Patents

A process for fabricating hollow electroactive devices

Info

Publication number
AU2001255845A1
AU2001255845A1 AU2001255845A AU5584501A AU2001255845A1 AU 2001255845 A1 AU2001255845 A1 AU 2001255845A1 AU 2001255845 A AU2001255845 A AU 2001255845A AU 5584501 A AU5584501 A AU 5584501A AU 2001255845 A1 AU2001255845 A1 AU 2001255845A1
Authority
AU
Australia
Prior art keywords
electroactive devices
fabricating hollow
fabricating
hollow
electroactive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001255845A
Inventor
Robert E. Newnham
Jindong Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Penn State Research Foundation
Original Assignee
Penn State Research Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Penn State Research Foundation filed Critical Penn State Research Foundation
Publication of AU2001255845A1 publication Critical patent/AU2001255845A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
AU2001255845A 2000-07-28 2001-04-17 A process for fabricating hollow electroactive devices Abandoned AU2001255845A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22185900P 2000-07-28 2000-07-28
US60221859 2000-07-28
PCT/US2001/040534 WO2002010264A1 (en) 2000-07-28 2001-04-17 A process for fabricating hollow electroactive devices

Publications (1)

Publication Number Publication Date
AU2001255845A1 true AU2001255845A1 (en) 2002-02-13

Family

ID=22829697

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001255845A Abandoned AU2001255845A1 (en) 2000-07-28 2001-04-17 A process for fabricating hollow electroactive devices

Country Status (3)

Country Link
US (3) US6654993B2 (en)
AU (1) AU2001255845A1 (en)
WO (1) WO2002010264A1 (en)

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AU2001255845A1 (en) * 2000-07-28 2002-02-13 The Penn State Research Foundation A process for fabricating hollow electroactive devices
US7670335B2 (en) * 2003-07-21 2010-03-02 Biosense Webster, Inc. Ablation device with spiral array ultrasound transducer
US7247269B2 (en) * 2003-07-21 2007-07-24 Biosense Webster, Inc. Method for making a spiral array ultrasound transducer
US7302645B1 (en) 2003-12-10 2007-11-27 Google Inc. Methods and systems for identifying manipulated articles
US20060064081A1 (en) * 2004-09-13 2006-03-23 Michael Rosinko Ablation device with phased array ultrasound transducer
US7996208B2 (en) * 2004-09-30 2011-08-09 Google Inc. Methods and systems for selecting a language for text segmentation
US7680648B2 (en) * 2004-09-30 2010-03-16 Google Inc. Methods and systems for improving text segmentation
US8911824B2 (en) * 2008-12-31 2014-12-16 Zircoa, Inc. Method of impregnating crucibles and refractory articles
DE102011009865B4 (en) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Headboard for a medically implantable device
DE102011009858B8 (en) 2011-01-31 2013-11-07 Heraeus Precious Metals Gmbh & Co. Kg Cermet-containing bushing for a medically implantable device with a bonding layer
DE102011009860B4 (en) 2011-01-31 2013-03-07 Heraeus Precious Metals Gmbh & Co. Kg Implantable device with integrated ceramic bushing
DE102011009861B4 (en) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Process for the preparation of a cermet-containing feedthrough
DE102011009859B4 (en) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Ceramic bushing with filter
DE102011009857B8 (en) 2011-01-31 2013-01-17 Heraeus Precious Metals Gmbh & Co. Kg Electrical feedthrough with a cermet-like connector for an active implantable medical device
DE102011009867B4 (en) 2011-01-31 2013-09-05 Heraeus Precious Metals Gmbh & Co. Kg Ceramic bushing for a medically implantable device
DE102011009855B8 (en) 2011-01-31 2013-01-03 Heraeus Precious Metals Gmbh & Co. Kg Ceramic bushing with inductive filter
DE102011009862B4 (en) 2011-01-31 2012-11-08 Heraeus Precious Metals Gmbh & Co. Kg Cermet-containing bushing with holding element for a medically implantable device
DE102011009856B8 (en) * 2011-01-31 2012-12-27 W.C. Heraeus Gmbh An electrical feedthrough and method of making a lead-containing feedthrough for a medically implantable device
DE102011119125B4 (en) 2011-11-23 2014-01-23 Heraeus Precious Metals Gmbh & Co. Kg Contacting arrangement with bushing and filter structure
DE102013200243A1 (en) * 2013-01-10 2014-07-10 Robert Bosch Gmbh Piezoelectric component and method for producing a piezoelectric component
US9478959B2 (en) 2013-03-14 2016-10-25 Heraeus Deutschland GmbH & Co. KG Laser welding a feedthrough
US9431801B2 (en) 2013-05-24 2016-08-30 Heraeus Deutschland GmbH & Co. KG Method of coupling a feedthrough assembly for an implantable medical device
US9403023B2 (en) 2013-08-07 2016-08-02 Heraeus Deutschland GmbH & Co. KG Method of forming feedthrough with integrated brazeless ferrule
US9504841B2 (en) 2013-12-12 2016-11-29 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing with ultrasonic welding
US9610452B2 (en) 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing by sintering
US9610451B2 (en) 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing using a gold alloy
WO2020041403A1 (en) * 2018-08-22 2020-02-27 Georgia Tech Research Corporation Flexible sensing interface systems and methods
DE102018221293A1 (en) * 2018-12-10 2020-06-10 Atlas Elektronik Gmbh Piezoceramic hydrophone with integrated intermediate layer
DE102018222038A1 (en) * 2018-12-18 2020-06-18 Atlas Elektronik Gmbh Underwater antenna with a waterproof layer around an underwater sound receiver
DE102019200754A1 (en) * 2019-01-22 2020-07-23 Atlas Elektronik Gmbh Piezoceramic hydrophone with metallic coating
DE102019202884A1 (en) * 2019-03-04 2020-02-27 Atlas Elektronik Gmbh Process for the production of a piezoceramic hydrophone
DE102019202889A1 (en) * 2019-03-04 2020-09-10 Atlas Elektronik Gmbh Adhesion promoter for piezoceramic hydrophone
DE102019202995A1 (en) * 2019-03-06 2020-09-10 Atlas Elektronik Gmbh Method for testing a spherical shell for the manufacture of a piezoceramic hydrophone
EP4230258A1 (en) 2020-02-21 2023-08-23 Heraeus Medical Components, LLC Ferrule with strain relief spacer for implantable medical device
EP4226968A1 (en) 2020-02-21 2023-08-16 Heraeus Medical Components, LLC Ferrule for non-planar medical device housing
CN112961651A (en) * 2021-02-06 2021-06-15 上海佘山精密轴承有限公司 Oilstone grinding fluid and preparation method thereof

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Also Published As

Publication number Publication date
US7437817B2 (en) 2008-10-21
US20020059708A1 (en) 2002-05-23
US6654993B2 (en) 2003-12-02
WO2002010264A1 (en) 2002-02-07
US20060117552A1 (en) 2006-06-08
US20040074078A1 (en) 2004-04-22
US7019445B2 (en) 2006-03-28

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