AU2001255723A1 - Real-time evaluation of stress fields and properties in line features formed on substrates - Google Patents

Real-time evaluation of stress fields and properties in line features formed on substrates

Info

Publication number
AU2001255723A1
AU2001255723A1 AU2001255723A AU5572301A AU2001255723A1 AU 2001255723 A1 AU2001255723 A1 AU 2001255723A1 AU 2001255723 A AU2001255723 A AU 2001255723A AU 5572301 A AU5572301 A AU 5572301A AU 2001255723 A1 AU2001255723 A1 AU 2001255723A1
Authority
AU
Australia
Prior art keywords
substrates
real
properties
features formed
time evaluation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001255723A
Inventor
Ares J. Rosakis
Subra Suresh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
California Institute of Technology CalTech
Original Assignee
California Institute of Technology CalTech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/560,719 external-priority patent/US6600565B1/en
Application filed by California Institute of Technology CalTech filed Critical California Institute of Technology CalTech
Publication of AU2001255723A1 publication Critical patent/AU2001255723A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
AU2001255723A 2000-04-27 2001-04-27 Real-time evaluation of stress fields and properties in line features formed on substrates Abandoned AU2001255723A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/560,719 2000-04-27
US09/560,719 US6600565B1 (en) 2000-04-25 2000-04-27 Real-time evaluation of stress fields and properties in line features formed on substrates
PCT/US2001/013545 WO2001082335A2 (en) 2000-04-27 2001-04-27 Real-time evaluation of stress fields and properties in line features formed on substrates

Publications (1)

Publication Number Publication Date
AU2001255723A1 true AU2001255723A1 (en) 2001-11-07

Family

ID=24239057

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001255723A Abandoned AU2001255723A1 (en) 2000-04-27 2001-04-27 Real-time evaluation of stress fields and properties in line features formed on substrates

Country Status (5)

Country Link
EP (1) EP1428242A2 (en)
JP (2) JP3863779B2 (en)
KR (1) KR100497278B1 (en)
AU (1) AU2001255723A1 (en)
WO (1) WO2001082335A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004026145A1 (en) 2004-05-28 2006-05-11 Advanced Micro Devices, Inc., Sunnyvale Semiconductor structure with a voltage sensitive element and method for measuring an elastic stress in a semiconductor structure
US7878655B2 (en) * 2008-09-29 2011-02-01 Sifi Diagnostic Spa Systems and methods for implanting and examining intraocular lens
JP5581365B2 (en) * 2011-12-07 2014-08-27 ウルトラテック インク Method for characterizing a semiconductor light emitting device based on the characteristics of a product wafer
US10401279B2 (en) * 2013-10-29 2019-09-03 Kla-Tencor Corporation Process-induced distortion prediction and feedforward and feedback correction of overlay errors
NL2017860B1 (en) * 2015-12-07 2017-07-27 Ultratech Inc Systems and methods of characterizing process-induced wafer shape for process control using cgs interferometry
WO2017173129A1 (en) * 2016-03-30 2017-10-05 Applied Materials, Inc. Metrology system for substrate deformation measurement

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227641A (en) * 1989-05-26 1993-07-13 Frontier Semiconductor Measurements, Inc. System for measuring the curvature of a semiconductor wafer
JPH03228347A (en) * 1990-02-02 1991-10-09 Hitachi Ltd Method of controlling internal stress of semiconductor element
JPH05335217A (en) * 1992-05-29 1993-12-17 Fujitsu Ltd Manufacture of mask for x-ray exposure
JPH06349917A (en) * 1993-06-04 1994-12-22 Hitachi Ltd Stress evaluation method and specimen
US6031611A (en) * 1997-06-03 2000-02-29 California Institute Of Technology Coherent gradient sensing method and system for measuring surface curvature

Also Published As

Publication number Publication date
JP2004501355A (en) 2004-01-15
EP1428242A2 (en) 2004-06-16
KR20020093087A (en) 2002-12-12
WO2001082335A3 (en) 2004-03-25
WO2001082335A2 (en) 2001-11-01
KR100497278B1 (en) 2005-07-01
JP2006189454A (en) 2006-07-20
JP3863779B2 (en) 2006-12-27

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