AU2001251583A1 - Method for improving bonding of rigid, thermosetting compositions to hydrophilicsurfaces, and the articles formed thereby - Google Patents

Method for improving bonding of rigid, thermosetting compositions to hydrophilicsurfaces, and the articles formed thereby

Info

Publication number
AU2001251583A1
AU2001251583A1 AU2001251583A AU5158301A AU2001251583A1 AU 2001251583 A1 AU2001251583 A1 AU 2001251583A1 AU 2001251583 A AU2001251583 A AU 2001251583A AU 5158301 A AU5158301 A AU 5158301A AU 2001251583 A1 AU2001251583 A1 AU 2001251583A1
Authority
AU
Australia
Prior art keywords
hydrophilicsurfaces
rigid
articles formed
thermosetting compositions
improving bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001251583A
Inventor
Ki-Soo Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
World Properties Inc
Original Assignee
World Properties Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by World Properties Inc filed Critical World Properties Inc
Publication of AU2001251583A1 publication Critical patent/AU2001251583A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C08J5/127—Aqueous adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
AU2001251583A 2000-04-12 2001-04-11 Method for improving bonding of rigid, thermosetting compositions to hydrophilicsurfaces, and the articles formed thereby Abandoned AU2001251583A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19631700P 2000-04-12 2000-04-12
US60196317 2000-04-12
PCT/US2001/011985 WO2001079371A2 (en) 2000-04-12 2001-04-11 Method for improving bonding of rigid, thermosetting compositions to hydrophilic surfaces, and the articles formed thereby

Publications (1)

Publication Number Publication Date
AU2001251583A1 true AU2001251583A1 (en) 2001-10-30

Family

ID=22724892

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001251583A Abandoned AU2001251583A1 (en) 2000-04-12 2001-04-11 Method for improving bonding of rigid, thermosetting compositions to hydrophilicsurfaces, and the articles formed thereby

Country Status (2)

Country Link
AU (1) AU2001251583A1 (en)
WO (1) WO2001079371A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7645832B2 (en) 2006-03-08 2010-01-12 Exxonmobil Chemical Patents Inc. Use of metal oxides and salts to enhance adhesion to steels
US8286561B2 (en) 2008-06-27 2012-10-16 Ssw Holding Company, Inc. Spill containing refrigerator shelf assembly
US11786036B2 (en) 2008-06-27 2023-10-17 Ssw Advanced Technologies, Llc Spill containing refrigerator shelf assembly
CA2739920C (en) 2008-10-07 2017-12-12 Ross Technology Corporation Spill-resistant surfaces having hydrophobic and oleophobic borders
US9074778B2 (en) 2009-11-04 2015-07-07 Ssw Holding Company, Inc. Cooking appliance surfaces having spill containment pattern
MX2012010669A (en) 2010-03-15 2013-02-07 Ross Technology Corp Plunger and methods of producing hydrophobic surfaces.
PE20140834A1 (en) 2011-02-21 2014-07-10 Ross Technology Corp SUPERHYDROPHIC AND OLEOPHOBIC COATING WITH BINDERS SYSTEM WITH LOW VOC CONTENT
DE102011085428A1 (en) 2011-10-28 2013-05-02 Schott Ag shelf
EP2791255B1 (en) 2011-12-15 2017-11-01 Ross Technology Corporation Composition and coating for superhydrophobic performance
CN104520392A (en) 2012-06-25 2015-04-15 罗斯科技公司 Elastomeric coatings having hydrophobic and/or oleophobic properties

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523633A (en) * 1975-06-25 1977-01-12 Nippon Shokubai Kagaku Kogyo Co Ltd Improvement of adhesion between vinyl chloride polymer and metal subst rate
JPH03109472A (en) * 1989-08-25 1991-05-09 Mitsui Mining & Smelting Co Ltd Adhesive for copper foil
ES2076922T1 (en) * 1994-03-04 1995-11-16 Sartomer Co Inc HARDENABLE AND HARDENED WATER BASED COMPOSITIONS AND A PROCEDURE FOR ADHERING A COATING OR ADHESIVE TO A SUBSTRATE.
US5904797A (en) * 1996-02-12 1999-05-18 E. I. Du Pont De Nemours And Company Adhesion improvement with methylacrylate-chromium complexes and poly(vinyl alcohol)

Also Published As

Publication number Publication date
WO2001079371A2 (en) 2001-10-25
WO2001079371A3 (en) 2002-02-07

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