AU2001251572A1 - Single supply hfet with temperature compensation - Google Patents

Single supply hfet with temperature compensation

Info

Publication number
AU2001251572A1
AU2001251572A1 AU2001251572A AU5157201A AU2001251572A1 AU 2001251572 A1 AU2001251572 A1 AU 2001251572A1 AU 2001251572 A AU2001251572 A AU 2001251572A AU 5157201 A AU5157201 A AU 5157201A AU 2001251572 A1 AU2001251572 A1 AU 2001251572A1
Authority
AU
Australia
Prior art keywords
temperature compensation
single supply
hfet
supply hfet
compensation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001251572A
Inventor
Julio Costa
Elizabeth C. Glass
Olin Hartin
Jenn-Hwa Huang
Wendy L. Valentine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2001251572A1 publication Critical patent/AU2001251572A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/8252Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • H01L29/737Hetero-junction transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0605Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/30Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
    • H03F1/301Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in MOSFET amplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/14Modifications for compensating variations of physical values, e.g. of temperature
    • H03K17/145Modifications for compensating variations of physical values, e.g. of temperature in field-effect transistor switches
AU2001251572A 2000-04-27 2001-04-11 Single supply hfet with temperature compensation Abandoned AU2001251572A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09559791 2000-04-27
US09/559,791 US6479843B2 (en) 2000-04-27 2000-04-27 Single supply HFET with temperature compensation
PCT/US2001/011921 WO2001084630A1 (en) 2000-04-27 2001-04-11 Single supply hfet with temperature compensation

Publications (1)

Publication Number Publication Date
AU2001251572A1 true AU2001251572A1 (en) 2001-11-12

Family

ID=24235037

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001251572A Abandoned AU2001251572A1 (en) 2000-04-27 2001-04-11 Single supply hfet with temperature compensation

Country Status (7)

Country Link
US (1) US6479843B2 (en)
JP (1) JP5219324B2 (en)
KR (1) KR100708228B1 (en)
CN (1) CN1249813C (en)
AU (1) AU2001251572A1 (en)
TW (1) TW503576B (en)
WO (1) WO2001084630A1 (en)

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US6690042B2 (en) * 2000-09-27 2004-02-10 Sensor Electronic Technology, Inc. Metal oxide semiconductor heterostructure field effect transistor
JP4469139B2 (en) * 2003-04-28 2010-05-26 シャープ株式会社 Compound semiconductor FET
US7253015B2 (en) * 2004-02-17 2007-08-07 Velox Semiconductor Corporation Low doped layer for nitride-based semiconductor device
JP4866007B2 (en) * 2005-01-14 2012-02-01 富士通株式会社 Compound semiconductor device
US7504677B2 (en) * 2005-03-28 2009-03-17 Freescale Semiconductor, Inc. Multi-gate enhancement mode RF switch and bias arrangement
CN101317253B (en) * 2005-11-28 2010-10-27 Nxp股份有限公司 Method of fabricating self aligned schottky junctions for semiconductors devices
CN101461067B (en) * 2006-03-20 2011-01-19 St微电子有限公司 Semiconductor field-effect transistor, memory cell and memory device
US7701031B2 (en) * 2006-04-07 2010-04-20 United Microelectronics Corp. Integrated circuit structure and manufacturing method thereof
DE102006018765A1 (en) 2006-04-20 2007-10-25 Infineon Technologies Ag Power semiconductor component, power semiconductor component and method for its production
US7915704B2 (en) * 2009-01-26 2011-03-29 Freescale Semiconductor, Inc. Schottky diode
JP2011082216A (en) * 2009-10-02 2011-04-21 Fujitsu Ltd Compound semiconductor device and method for manufacturing the same
US8368121B2 (en) 2010-06-21 2013-02-05 Power Integrations, Inc. Enhancement-mode HFET circuit arrangement having high power and high threshold voltage
CN102194819A (en) * 2011-04-26 2011-09-21 电子科技大学 Enhanced GaN heterojunction field effect transistor based on metal oxide semiconductor (MOS) control
TWI508281B (en) * 2011-08-01 2015-11-11 Murata Manufacturing Co Field effect transistor
JP5662367B2 (en) * 2012-03-26 2015-01-28 株式会社東芝 Nitride semiconductor device and manufacturing method thereof
KR102182016B1 (en) 2013-12-02 2020-11-23 엘지이노텍 주식회사 Semiconductor device and semiconductor circuit including the device
KR102127441B1 (en) * 2013-12-02 2020-06-26 엘지이노텍 주식회사 Semiconductor device and semiconductor circuit including the deivce
EP2922093B1 (en) * 2014-03-19 2017-05-10 Nxp B.V. Hemt temperature sensor
KR101559111B1 (en) 2014-04-10 2015-10-13 홍익대학교 산학협력단 Bi-direction switching device and manufacturing method for the same
CN112187237B (en) * 2020-09-29 2021-12-21 西安博瑞集信电子科技有限公司 Enabling circuit

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3682119D1 (en) 1985-06-21 1991-11-28 Honeywell Inc COMPLEMENTARY IC STRUCTURE WITH HIGH SLOPE.
US4760288A (en) * 1986-07-21 1988-07-26 Honeywell Inc. Temperature compensation for semiconductor logic gates
JPH01251819A (en) * 1988-03-30 1989-10-06 Nec Corp Buffered fet logic circuit
JPH03228365A (en) * 1990-02-02 1991-10-09 Sumitomo Electric Ind Ltd Semiconductor resistor circuit
JP2786307B2 (en) * 1990-04-19 1998-08-13 三菱電機株式会社 Field effect transistor and method of manufacturing the same
US5341114A (en) * 1990-11-02 1994-08-23 Ail Systems, Inc. Integrated limiter and amplifying devices
DE4219523A1 (en) * 1992-06-15 1993-12-16 Daimler Benz Ag Monolithically integrated millimeter wave circuit and method for its production
JPH07106525A (en) * 1993-10-01 1995-04-21 Hitachi Ltd Field-effect transistor and compound semiconductor integrated circuit
DE69522075T2 (en) * 1994-11-02 2002-01-03 Trw Inc Method for producing multifunctional, monolithically integrated circuit arrangements
US5532486A (en) * 1995-02-13 1996-07-02 Hughes Aircraft Company Heterojunction diode with low turn-on voltage
JP2669394B2 (en) * 1995-02-16 1997-10-27 日本電気株式会社 Field-effect transistor
JPH08250670A (en) * 1995-03-08 1996-09-27 Oki Electric Ind Co Ltd Semiconductor device
JP3379062B2 (en) 1997-12-02 2003-02-17 富士通カンタムデバイス株式会社 Semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
TW503576B (en) 2002-09-21
US20020127787A1 (en) 2002-09-12
KR100708228B1 (en) 2007-04-17
JP5219324B2 (en) 2013-06-26
CN1452789A (en) 2003-10-29
JP2003533027A (en) 2003-11-05
US6479843B2 (en) 2002-11-12
CN1249813C (en) 2006-04-05
WO2001084630A1 (en) 2001-11-08
KR20020093089A (en) 2002-12-12

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