AU2001250657A1 - Modular substrate measurement system - Google Patents

Modular substrate measurement system

Info

Publication number
AU2001250657A1
AU2001250657A1 AU2001250657A AU5065701A AU2001250657A1 AU 2001250657 A1 AU2001250657 A1 AU 2001250657A1 AU 2001250657 A AU2001250657 A AU 2001250657A AU 5065701 A AU5065701 A AU 5065701A AU 2001250657 A1 AU2001250657 A1 AU 2001250657A1
Authority
AU
Australia
Prior art keywords
measurement system
substrate measurement
modular substrate
modular
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001250657A
Inventor
Michael Abraham
Pierre Astegno
Alain Gaudon
Ivo J. M. M. Raaijmakers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zegema GmbH
Recif SA
Original Assignee
Nanophotonics GmbH
Recif SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanophotonics GmbH, Recif SA filed Critical Nanophotonics GmbH
Publication of AU2001250657A1 publication Critical patent/AU2001250657A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001250657A 2000-04-13 2001-04-12 Modular substrate measurement system Abandoned AU2001250657A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/548,773 US6420864B1 (en) 2000-04-13 2000-04-13 Modular substrate measurement system
NL0000240 2000-04-13
WONL00/00240 2000-04-13
PCT/NL2001/000293 WO2001080289A1 (en) 2000-04-13 2001-04-12 Modular substrate measurement system

Publications (1)

Publication Number Publication Date
AU2001250657A1 true AU2001250657A1 (en) 2001-10-30

Family

ID=26642011

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001250657A Abandoned AU2001250657A1 (en) 2000-04-13 2001-04-12 Modular substrate measurement system

Country Status (3)

Country Link
US (1) US6420864B1 (en)
AU (1) AU2001250657A1 (en)
WO (1) WO2001080289A1 (en)

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US20020152046A1 (en) * 2001-04-13 2002-10-17 Velichko Sergey A. Concurrent control of semiconductor parametric testing
US7337088B2 (en) * 2001-05-23 2008-02-26 Micron Technology, Inc. Intelligent measurement modular semiconductor parametric test system
JP3832295B2 (en) * 2001-08-31 2006-10-11 株式会社ダイフク Load handling equipment
JP2003124284A (en) * 2001-10-11 2003-04-25 Hitachi Kokusai Electric Inc Substrate treatment equipment and method for manufacturing semiconductor device
NL1020054C2 (en) * 2002-02-25 2003-09-05 Asm Int Device for treating wafers, provided with a measuring device box.
US7162386B2 (en) * 2002-04-25 2007-01-09 Micron Technology, Inc. Dynamically adaptable semiconductor parametric testing
US6902647B2 (en) 2002-08-29 2005-06-07 Asm International N.V. Method of processing substrates with integrated weighing steps
US7038441B2 (en) * 2002-10-02 2006-05-02 Suss Microtec Testsystems Gmbh Test apparatus with loading device
US7010451B2 (en) * 2003-04-17 2006-03-07 Micron Technology, Inc. Dynamic creation and modification of wafer test maps during wafer testing
US7002675B2 (en) 2003-07-10 2006-02-21 Synetics Solutions, Inc. Method and apparatus for locating/sizing contaminants on a polished planar surface of a dielectric or semiconductor material
DE10332572A1 (en) * 2003-07-11 2005-02-17 Nanophotonics Ag Fabrication installation for semiconductor wafers and components, includes measurement module for registering wafer surfaces
US7106434B1 (en) 2003-07-28 2006-09-12 Kla-Tencor Technologies, Inc. Inspection tool
DE102004013707B9 (en) * 2003-08-28 2016-06-23 Cascade Microtech, Inc. Device for testing substrates
JP2005101584A (en) * 2003-08-28 2005-04-14 Suss Microtec Test Systems Gmbh Apparatus for inspecting substrate
DE10350517A1 (en) * 2003-10-29 2005-06-09 Sieghard Schiller Gmbh & Co. Kg Holder for semiconductor wafer stack has robotic handling arm and separate stacks rotatable about a vertical axis for free access and transportation
JP2005286102A (en) * 2004-03-30 2005-10-13 Hitachi High-Technologies Corp Vacuum processing equipment and vacuum processing method
DE102004057057A1 (en) * 2004-11-25 2006-06-01 Leica Microsystems Cms Gmbh Substrate workstation and add-on module for a substrate workstation
CN101331144B (en) * 2005-12-15 2013-05-15 宾夕法尼亚州研究基金会 Tetraphosphorus ligands for catalytic hydroformylation and related reactions
US20070297885A1 (en) * 2006-06-27 2007-12-27 Jean Michel Processe Product designed to be used with handling system
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
US7893112B2 (en) * 2006-10-04 2011-02-22 Virobay, Inc. Di-fluoro containing compounds as cysteine protease inhibitors
US7585142B2 (en) 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
US8324417B2 (en) * 2009-08-19 2012-12-04 Virobay, Inc. Process for the preparation of (S)-2-amino-5-cyclopropyl-4,4-difluoropentanoic acid and alkyl esters and acid salts thereof
DE102010040242B4 (en) 2010-09-03 2014-02-13 Cascade Microtech Dresden Gmbh Modular prober and method of operation
US10840121B2 (en) * 2016-10-31 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for unpacking semiconductor wafer container

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US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
US4881863A (en) * 1987-12-17 1989-11-21 Primary Systems Corporation Apparatus for inspecting wafers
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US5310410A (en) * 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
JP2598353B2 (en) * 1991-12-04 1997-04-09 アネルバ株式会社 Substrate processing device, substrate transfer device, and substrate replacement method
US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
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KR100346147B1 (en) * 1995-06-08 2002-11-23 동경 엘렉트론 주식회사 Probe system
KR100310249B1 (en) * 1995-08-05 2001-12-17 엔도 마코토 Substrate Processing Equipment
JP3138201B2 (en) * 1995-12-22 2001-02-26 株式会社しなのエレクトロニクス IC test handler
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
US5779799A (en) * 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
JP3947761B2 (en) * 1996-09-26 2007-07-25 株式会社日立国際電気 Substrate processing apparatus, substrate transfer machine, and substrate processing method
JPH10329069A (en) * 1997-03-31 1998-12-15 Daihen Corp Control method for conveyance system
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US6083321A (en) * 1997-07-11 2000-07-04 Applied Materials, Inc. Fluid delivery system and method
US6235634B1 (en) 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
US6013920A (en) * 1997-11-28 2000-01-11 Fortrend Engineering Coirporation Wafer-mapping load post interface having an effector position sensing device
JP3264879B2 (en) * 1997-11-28 2002-03-11 東京エレクトロン株式会社 Substrate processing system, interface device, and substrate transfer method
US6075358A (en) * 1998-01-09 2000-06-13 Siemens Aktiengesellschaft Device in a semiconductor manufacturing installation in particular for integrated circuits
US6208751B1 (en) 1998-03-24 2001-03-27 Applied Materials, Inc. Cluster tool

Also Published As

Publication number Publication date
US6420864B1 (en) 2002-07-16
WO2001080289A1 (en) 2001-10-25

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