AU2001245500A1 - Method for making a flexible circuit interposer having high-aspect ratio conductors - Google Patents
Method for making a flexible circuit interposer having high-aspect ratio conductorsInfo
- Publication number
- AU2001245500A1 AU2001245500A1 AU2001245500A AU4550001A AU2001245500A1 AU 2001245500 A1 AU2001245500 A1 AU 2001245500A1 AU 2001245500 A AU2001245500 A AU 2001245500A AU 4550001 A AU4550001 A AU 4550001A AU 2001245500 A1 AU2001245500 A1 AU 2001245500A1
- Authority
- AU
- Australia
- Prior art keywords
- making
- aspect ratio
- flexible circuit
- circuit interposer
- ratio conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09524148 | 2000-03-14 | ||
US09/524,148 US6376769B1 (en) | 1999-05-18 | 2000-03-14 | High-density electronic package, and method for making same |
US19060700P | 2000-03-20 | 2000-03-20 | |
US60190607 | 2000-03-20 | ||
US19443400P | 2000-04-04 | 2000-04-04 | |
US60194434 | 2000-04-04 | ||
US09/578,583 US6717819B1 (en) | 1999-06-01 | 2000-05-25 | Solderable flexible adhesive interposer as for an electronic package, and method for making same |
US09578583 | 2000-05-25 | ||
US22090900P | 2000-07-26 | 2000-07-26 | |
US60220909 | 2000-07-26 | ||
US09727307 | 2000-11-30 | ||
US09/727,307 US6580031B2 (en) | 2000-03-14 | 2000-11-30 | Method for making a flexible circuit interposer having high-aspect ratio conductors |
PCT/US2001/007312 WO2001069675A1 (en) | 2000-03-14 | 2001-03-08 | Method for making a flexible circuit interposer having high-aspect ratio conductors |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001245500A1 true AU2001245500A1 (en) | 2001-09-24 |
Family
ID=27558812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001245500A Abandoned AU2001245500A1 (en) | 2000-03-14 | 2001-03-08 | Method for making a flexible circuit interposer having high-aspect ratio conductors |
Country Status (3)
Country | Link |
---|---|
US (1) | US6580031B2 (en) |
AU (1) | AU2001245500A1 (en) |
WO (1) | WO2001069675A1 (en) |
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US6717819B1 (en) * | 1999-06-01 | 2004-04-06 | Amerasia International Technology, Inc. | Solderable flexible adhesive interposer as for an electronic package, and method for making same |
US6615044B2 (en) * | 2001-06-06 | 2003-09-02 | Nokia Mobile Phones, Ltd. | Method of WCDMA coverage based handover triggering |
CN1285098C (en) * | 2001-06-29 | 2006-11-15 | 美莎诺普有限公司 | Opto-electronic device integration |
US6826830B2 (en) * | 2002-02-05 | 2004-12-07 | International Business Machines Corporation | Multi-layered interconnect structure using liquid crystalline polymer dielectric |
US7645262B2 (en) * | 2002-04-11 | 2010-01-12 | Second Sight Medical Products, Inc. | Biocompatible bonding method and electronics package suitable for implantation |
US7114961B2 (en) * | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
US8584353B2 (en) | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
US20060091538A1 (en) * | 2004-11-04 | 2006-05-04 | Kabadi Ashok N | Low profile and tight pad-pitch land-grid-array (LGA) socket |
TWI287805B (en) * | 2005-11-11 | 2007-10-01 | Ind Tech Res Inst | Composite conductive film and semiconductor package using such film |
US7743963B1 (en) | 2005-03-01 | 2010-06-29 | Amerasia International Technology, Inc. | Solderable lid or cover for an electronic circuit |
JP2006294527A (en) * | 2005-04-14 | 2006-10-26 | Nec Corp | Connector and its manufacturing method |
US7300824B2 (en) * | 2005-08-18 | 2007-11-27 | James Sheats | Method of packaging and interconnection of integrated circuits |
US7936060B2 (en) * | 2009-04-29 | 2011-05-03 | International Business Machines Corporation | Reworkable electronic device assembly and method |
US8678771B2 (en) * | 2009-12-14 | 2014-03-25 | Siemens Energy, Inc. | Process for manufacturing a component |
US20110308567A1 (en) | 2010-06-08 | 2011-12-22 | Kevin Kwong-Tai Chung | Solar cell interconnection, module, panel and method |
US8641428B2 (en) | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9680273B2 (en) | 2013-03-15 | 2017-06-13 | Neoconix, Inc | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
EP3866269A4 (en) * | 2018-10-11 | 2022-06-15 | Sekisui Polymatech Co., Ltd. | Electrical connection sheet, and glass sheet structure with terminal |
DE102019206260A1 (en) * | 2019-05-02 | 2020-11-05 | Abb Schweiz Ag | Method for manufacturing a semiconductor module |
TWI755034B (en) * | 2020-08-19 | 2022-02-11 | 友達光電股份有限公司 | Device substrate and manufacturing method thereof |
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US5901041A (en) | 1997-12-02 | 1999-05-04 | Northern Telecom Limited | Flexible integrated circuit package |
US5926369A (en) | 1998-01-22 | 1999-07-20 | International Business Machines Corporation | Vertically integrated multi-chip circuit package with heat-sink support |
US6376769B1 (en) * | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
US6247229B1 (en) * | 1999-08-25 | 2001-06-19 | Ankor Technology, Inc. | Method of forming an integrated circuit device package using a plastic tape as a base |
US20020100165A1 (en) * | 2000-02-14 | 2002-08-01 | Amkor Technology, Inc. | Method of forming an integrated circuit device package using a temporary substrate |
-
2000
- 2000-11-30 US US09/727,307 patent/US6580031B2/en not_active Expired - Fee Related
-
2001
- 2001-03-08 AU AU2001245500A patent/AU2001245500A1/en not_active Abandoned
- 2001-03-08 WO PCT/US2001/007312 patent/WO2001069675A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20020046873A1 (en) | 2002-04-25 |
US6580031B2 (en) | 2003-06-17 |
WO2001069675A1 (en) | 2001-09-20 |
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