AU2001243268A1 - Printed wiring board with controlled line impedance - Google Patents
Printed wiring board with controlled line impedanceInfo
- Publication number
- AU2001243268A1 AU2001243268A1 AU2001243268A AU4326801A AU2001243268A1 AU 2001243268 A1 AU2001243268 A1 AU 2001243268A1 AU 2001243268 A AU2001243268 A AU 2001243268A AU 4326801 A AU4326801 A AU 4326801A AU 2001243268 A1 AU2001243268 A1 AU 2001243268A1
- Authority
- AU
- Australia
- Prior art keywords
- wiring board
- printed wiring
- line impedance
- controlled line
- controlled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09511194 | 2000-02-23 | ||
US09/511,194 US6586682B2 (en) | 2000-02-23 | 2000-02-23 | Printed wiring board with controlled line impedance |
PCT/US2001/005961 WO2001063993A1 (en) | 2000-02-23 | 2001-02-22 | Printed wiring board with controlled line impedance |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001243268A1 true AU2001243268A1 (en) | 2001-09-03 |
Family
ID=24033846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001243268A Abandoned AU2001243268A1 (en) | 2000-02-23 | 2001-02-22 | Printed wiring board with controlled line impedance |
Country Status (4)
Country | Link |
---|---|
US (1) | US6586682B2 (en) |
AU (1) | AU2001243268A1 (en) |
TW (1) | TWI277372B (en) |
WO (1) | WO2001063993A1 (en) |
Families Citing this family (61)
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JP2002111222A (en) * | 2000-10-02 | 2002-04-12 | Matsushita Electric Ind Co Ltd | Multilayer substrate |
US6730857B2 (en) * | 2001-03-13 | 2004-05-04 | International Business Machines Corporation | Structure having laser ablated features and method of fabricating |
US7334326B1 (en) | 2001-06-19 | 2008-02-26 | Amkor Technology, Inc. | Method for making an integrated circuit substrate having embedded passive components |
US6930256B1 (en) * | 2002-05-01 | 2005-08-16 | Amkor Technology, Inc. | Integrated circuit substrate having laser-embedded conductive patterns and method therefor |
US7399661B2 (en) * | 2002-05-01 | 2008-07-15 | Amkor Technology, Inc. | Method for making an integrated circuit substrate having embedded back-side access conductors and vias |
US9691635B1 (en) | 2002-05-01 | 2017-06-27 | Amkor Technology, Inc. | Buildup dielectric layer having metallization pattern semiconductor package fabrication method |
US7670962B2 (en) | 2002-05-01 | 2010-03-02 | Amkor Technology, Inc. | Substrate having stiffener fabrication method |
US6930257B1 (en) * | 2002-05-01 | 2005-08-16 | Amkor Technology, Inc. | Integrated circuit substrate having laminated laser-embedded circuit layers |
US7633765B1 (en) | 2004-03-23 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package including a top-surface metal layer for implementing circuit features |
US20080043447A1 (en) * | 2002-05-01 | 2008-02-21 | Amkor Technology, Inc. | Semiconductor package having laser-embedded terminals |
US7548430B1 (en) | 2002-05-01 | 2009-06-16 | Amkor Technology, Inc. | Buildup dielectric and metallization process and semiconductor package |
US6936773B2 (en) * | 2002-10-10 | 2005-08-30 | Intel Corporation | Board impedance management |
US6864586B2 (en) * | 2003-02-28 | 2005-03-08 | Silicon Integrated Systems Corp. | Padless high density circuit board |
US7336502B1 (en) * | 2003-06-03 | 2008-02-26 | Force10 Networks, Inc. | High-speed router with backplane using tuned-impedance thru-holes and vias |
US7223924B2 (en) * | 2003-09-23 | 2007-05-29 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Via placement for layer transitions in flexible circuits with high density ball grid arrays |
US8569142B2 (en) * | 2003-11-28 | 2013-10-29 | Blackberry Limited | Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same |
US10811277B2 (en) | 2004-03-23 | 2020-10-20 | Amkor Technology, Inc. | Encapsulated semiconductor package |
US11081370B2 (en) | 2004-03-23 | 2021-08-03 | Amkor Technology Singapore Holding Pte. Ltd. | Methods of manufacturing an encapsulated semiconductor device |
US7353480B1 (en) | 2004-12-07 | 2008-04-01 | Nvidia Corporation | Apparatus, system, and method for designing via pads having extended contours |
JP4432973B2 (en) * | 2004-12-20 | 2010-03-17 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
US8826531B1 (en) | 2005-04-05 | 2014-09-09 | Amkor Technology, Inc. | Method for making an integrated circuit substrate having laminated laser-embedded circuit layers |
US7589398B1 (en) | 2006-10-04 | 2009-09-15 | Amkor Technology, Inc. | Embedded metal features structure |
US7550857B1 (en) | 2006-11-16 | 2009-06-23 | Amkor Technology, Inc. | Stacked redistribution layer (RDL) die assembly package |
US7750250B1 (en) | 2006-12-22 | 2010-07-06 | Amkor Technology, Inc. | Blind via capture pad structure |
US7752752B1 (en) | 2007-01-09 | 2010-07-13 | Amkor Technology, Inc. | Method of fabricating an embedded circuit pattern |
US20090016036A1 (en) * | 2007-07-13 | 2009-01-15 | Wong Shaw Fong | Conductor reinforcement for circuit boards |
US8323771B1 (en) | 2007-08-15 | 2012-12-04 | Amkor Technology, Inc. | Straight conductor blind via capture pad structure and fabrication method |
US8872329B1 (en) | 2009-01-09 | 2014-10-28 | Amkor Technology, Inc. | Extended landing pad substrate package structure and method |
US7960827B1 (en) | 2009-04-09 | 2011-06-14 | Amkor Technology, Inc. | Thermal via heat spreader package and method |
US8623753B1 (en) | 2009-05-28 | 2014-01-07 | Amkor Technology, Inc. | Stackable protruding via package and method |
US8222538B1 (en) | 2009-06-12 | 2012-07-17 | Amkor Technology, Inc. | Stackable via package and method |
US8471154B1 (en) | 2009-08-06 | 2013-06-25 | Amkor Technology, Inc. | Stackable variable height via package and method |
US8796561B1 (en) | 2009-10-05 | 2014-08-05 | Amkor Technology, Inc. | Fan out build up substrate stackable package and method |
US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
US9691734B1 (en) | 2009-12-07 | 2017-06-27 | Amkor Technology, Inc. | Method of forming a plurality of electronic component packages |
US8536462B1 (en) | 2010-01-22 | 2013-09-17 | Amkor Technology, Inc. | Flex circuit package and method |
US8300423B1 (en) | 2010-05-25 | 2012-10-30 | Amkor Technology, Inc. | Stackable treated via package and method |
US8294276B1 (en) | 2010-05-27 | 2012-10-23 | Amkor Technology, Inc. | Semiconductor device and fabricating method thereof |
US8338229B1 (en) | 2010-07-30 | 2012-12-25 | Amkor Technology, Inc. | Stackable plasma cleaned via package and method |
US8717775B1 (en) | 2010-08-02 | 2014-05-06 | Amkor Technology, Inc. | Fingerprint sensor package and method |
US8337657B1 (en) | 2010-10-27 | 2012-12-25 | Amkor Technology, Inc. | Mechanical tape separation package and method |
US8482134B1 (en) | 2010-11-01 | 2013-07-09 | Amkor Technology, Inc. | Stackable package and method |
US9748154B1 (en) | 2010-11-04 | 2017-08-29 | Amkor Technology, Inc. | Wafer level fan out semiconductor device and manufacturing method thereof |
US8525318B1 (en) | 2010-11-10 | 2013-09-03 | Amkor Technology, Inc. | Semiconductor device and fabricating method thereof |
US8557629B1 (en) | 2010-12-03 | 2013-10-15 | Amkor Technology, Inc. | Semiconductor device having overlapped via apertures |
US8535961B1 (en) | 2010-12-09 | 2013-09-17 | Amkor Technology, Inc. | Light emitting diode (LED) package and method |
US9721872B1 (en) | 2011-02-18 | 2017-08-01 | Amkor Technology, Inc. | Methods and structures for increasing the allowable die size in TMV packages |
US9013011B1 (en) | 2011-03-11 | 2015-04-21 | Amkor Technology, Inc. | Stacked and staggered die MEMS package and method |
KR101140113B1 (en) | 2011-04-26 | 2012-04-30 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor device |
US8653674B1 (en) | 2011-09-15 | 2014-02-18 | Amkor Technology, Inc. | Electronic component package fabrication method and structure |
US8633598B1 (en) | 2011-09-20 | 2014-01-21 | Amkor Technology, Inc. | Underfill contacting stacking balls package fabrication method and structure |
US9029962B1 (en) | 2011-10-12 | 2015-05-12 | Amkor Technology, Inc. | Molded cavity substrate MEMS package fabrication method and structure |
US9799592B2 (en) | 2013-11-19 | 2017-10-24 | Amkor Technology, Inc. | Semicondutor device with through-silicon via-less deep wells |
KR101366461B1 (en) | 2012-11-20 | 2014-02-26 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor device and manufacturing method thereof |
KR101488590B1 (en) | 2013-03-29 | 2015-01-30 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor device and manufacturing method thereof |
JP6244138B2 (en) * | 2013-08-20 | 2017-12-06 | 新光電気工業株式会社 | Wiring board and method of manufacturing wiring board |
KR101607981B1 (en) | 2013-11-04 | 2016-03-31 | 앰코 테크놀로지 코리아 주식회사 | Interposer and method for manufacturing the same, and semiconductor package using the same |
US9466554B2 (en) | 2014-02-13 | 2016-10-11 | Qualcomm Incorporated | Integrated device comprising via with side barrier layer traversing encapsulation layer |
DE102014220650A1 (en) * | 2014-10-13 | 2016-04-14 | Heraeus Deutschland GmbH & Co. KG | Optimized trace design of metallic materials on ceramic substances |
US9960328B2 (en) | 2016-09-06 | 2018-05-01 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
CN115551239B (en) * | 2022-11-25 | 2023-03-14 | 四川斯艾普电子科技有限公司 | Thick-film circuit substrate grounding method and thick-film circuit |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2940593A1 (en) | 1979-10-06 | 1981-04-16 | Ibm Deutschland Gmbh, 7000 Stuttgart | MULTI-LAYER MODULE WITH CONSTANT WAVE RESISTANCE |
US4544989A (en) | 1980-06-30 | 1985-10-01 | Sharp Kabushiki Kaisha | Thin assembly for wiring substrate |
FR2567684B1 (en) * | 1984-07-10 | 1988-11-04 | Nec Corp | MODULE HAVING A MULTILAYER CERAMIC SUBSTRATE AND A MULTILAYER CIRCUIT ON THE SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF |
JPS61236192A (en) * | 1985-04-12 | 1986-10-21 | 株式会社日立製作所 | Electrode formation for ceramic substrate |
FR2593346B1 (en) * | 1986-01-17 | 1990-05-25 | Nec Corp | WIRING SUBSTRATE USING CERAMIC AS INSULATION |
JPS6366993A (en) * | 1986-09-08 | 1988-03-25 | 日本電気株式会社 | Multilayer interconnection board |
US4783695A (en) | 1986-09-26 | 1988-11-08 | General Electric Company | Multichip integrated circuit packaging configuration and method |
US4798918A (en) * | 1987-09-21 | 1989-01-17 | Intel Corporation | High density flexible circuit |
US4963697A (en) | 1988-02-12 | 1990-10-16 | Texas Instruments Incorporated | Advanced polymers on metal printed wiring board |
US5354695A (en) | 1992-04-08 | 1994-10-11 | Leedy Glenn J | Membrane dielectric isolation IC fabrication |
US5106461A (en) | 1989-04-04 | 1992-04-21 | Massachusetts Institute Of Technology | High-density, multi-level interconnects, flex circuits, and tape for tab |
US5172472A (en) | 1991-08-15 | 1992-12-22 | Direct Imaging Inc. | Multi-layer rigid prototype printed circuit board fabrication method |
US5262590A (en) | 1992-04-27 | 1993-11-16 | Sheldahl, Inc. | Impedance controlled flexible circuits with fold-over shields |
JP2558082B2 (en) | 1994-11-25 | 1996-11-27 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Resin layer forming method |
KR960028736A (en) * | 1994-12-07 | 1996-07-22 | 오오가 노리오 | Printed board |
US6384344B1 (en) * | 1995-06-19 | 2002-05-07 | Ibiden Co., Ltd | Circuit board for mounting electronic parts |
JP2000022328A (en) | 1998-06-26 | 2000-01-21 | Sumitomo Metal Electronics Devices Inc | Manufacture of printed board for multilayer interconnection |
US6165892A (en) | 1998-07-31 | 2000-12-26 | Kulicke & Soffa Holdings, Inc. | Method of planarizing thin film layers deposited over a common circuit base |
US6203967B1 (en) | 1998-07-31 | 2001-03-20 | Kulicke & Soffa Holdings, Inc. | Method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
US6036809A (en) * | 1999-02-16 | 2000-03-14 | International Business Machines Corporation | Process for releasing a thin-film structure from a substrate |
-
2000
- 2000-02-23 US US09/511,194 patent/US6586682B2/en not_active Expired - Fee Related
-
2001
- 2001-02-22 AU AU2001243268A patent/AU2001243268A1/en not_active Abandoned
- 2001-02-22 WO PCT/US2001/005961 patent/WO2001063993A1/en active Application Filing
- 2001-02-23 TW TW090104189A patent/TWI277372B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI277372B (en) | 2007-03-21 |
WO2001063993A1 (en) | 2001-08-30 |
US20020139566A1 (en) | 2002-10-03 |
US6586682B2 (en) | 2003-07-01 |
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