AU2001238248A1 - Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance - Google Patents

Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance

Info

Publication number
AU2001238248A1
AU2001238248A1 AU2001238248A AU3824801A AU2001238248A1 AU 2001238248 A1 AU2001238248 A1 AU 2001238248A1 AU 2001238248 A AU2001238248 A AU 2001238248A AU 3824801 A AU3824801 A AU 3824801A AU 2001238248 A1 AU2001238248 A1 AU 2001238248A1
Authority
AU
Australia
Prior art keywords
thermal interface
forming
thermal
layer
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001238248A
Inventor
Forest Hampton Iii
Richard F. Hill
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Thermagon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermagon Inc filed Critical Thermagon Inc
Publication of AU2001238248A1 publication Critical patent/AU2001238248A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/907—Porous

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2001238248A 2000-02-25 2001-02-15 Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance Abandoned AU2001238248A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09513483 2000-02-25
US09/513,483 US6372997B1 (en) 2000-02-25 2000-02-25 Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
PCT/US2001/004714 WO2001063998A1 (en) 2000-02-25 2001-02-15 Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance

Publications (1)

Publication Number Publication Date
AU2001238248A1 true AU2001238248A1 (en) 2001-09-03

Family

ID=24043472

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001238248A Abandoned AU2001238248A1 (en) 2000-02-25 2001-02-15 Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance

Country Status (5)

Country Link
US (3) US6372997B1 (en)
CN (1) CN1314305C (en)
AU (1) AU2001238248A1 (en)
TW (1) TW595304B (en)
WO (1) WO2001063998A1 (en)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6713088B2 (en) * 1999-08-31 2004-03-30 General Electric Company Low viscosity filler composition of boron nitride particles of spherical geometry and process
US7976941B2 (en) 1999-08-31 2011-07-12 Momentive Performance Materials Inc. Boron nitride particles of spherical geometry and process for making thereof
US20070241303A1 (en) * 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
US7369411B2 (en) * 2000-02-25 2008-05-06 Thermagon, Inc. Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
US6940721B2 (en) * 2000-02-25 2005-09-06 Richard F. Hill Thermal interface structure for placement between a microelectronic component package and heat sink
US7078109B2 (en) * 2000-02-25 2006-07-18 Thermagon Inc. Heat spreading thermal interface structure
FR2818665B1 (en) * 2000-12-27 2003-09-12 Usinor MANUFACTURE OF A METAL TAPE FOR PACKAGING CONTAINING A COATING CONSISTING OF A METAL LAYER AND A POLYMER FILM, AND TAPE OBTAINED
JP2004518294A (en) 2001-01-22 2004-06-17 パーカー−ハニフイン・コーポレーシヨン Clean release, phase change terminal interface
JP4459470B2 (en) * 2001-04-06 2010-04-28 信越化学工業株式会社 Electronic component heat dissipation structure and heat dissipation sheet used therefor
DE10157671A1 (en) * 2001-11-24 2003-06-05 Merck Patent Gmbh Optimized use of PCM in cooling devices
TWI224384B (en) * 2002-01-22 2004-11-21 Shinetsu Chemical Co Heat-dissipating member, manufacturing method and installation method
CA2474740C (en) * 2002-02-06 2011-10-11 Parker-Hannifin Corporation Thermal management materials having a phase change dispersion
US6946190B2 (en) * 2002-02-06 2005-09-20 Parker-Hannifin Corporation Thermal management materials
US7436058B2 (en) * 2002-05-09 2008-10-14 Intel Corporation Reactive solder material
US6956739B2 (en) 2002-10-29 2005-10-18 Parker-Hannifin Corporation High temperature stable thermal interface material
KR20060040580A (en) * 2003-04-02 2006-05-10 허니웰 인터내셔날 인코포레이티드 Thermal interconnect and interface systems, methods of production and uses thereof
US7527090B2 (en) * 2003-06-30 2009-05-05 Intel Corporation Heat dissipating device with preselected designed interface for thermal interface materials
US6898084B2 (en) * 2003-07-17 2005-05-24 The Bergquist Company Thermal diffusion apparatus
US20050155752A1 (en) * 2003-11-19 2005-07-21 Larson Ralph I. Thermal interface and method of making the same
EP1731002A4 (en) * 2004-03-30 2010-05-26 Honeywell Int Inc Heat spreader constructions, integrated circuitry, methods of forming heat speader contruictions, and methods of forming integrated circuitry
US20050280987A1 (en) * 2004-06-07 2005-12-22 Kwitek Benjamin J Phase change materials as a heat sink for computers
US20060120051A1 (en) * 2004-12-03 2006-06-08 Chris Macris Liquid metal thermal interface material system
US7554190B2 (en) * 2004-12-03 2009-06-30 Chris Macris Liquid metal thermal interface material system
US7269015B2 (en) * 2005-02-01 2007-09-11 Tyco Electronics Corporation Heat sink interface insert
US20070031684A1 (en) * 2005-08-03 2007-02-08 Anderson Jeffrey T Thermally conductive grease
US20070166554A1 (en) * 2006-01-18 2007-07-19 Ruchert Brian D Thermal interconnect and interface systems, methods of production and uses thereof
CN100464410C (en) * 2006-02-15 2009-02-25 富准精密工业(深圳)有限公司 Thermal interfacial material and radiating device association using the same thermal interfacial material
JP4589269B2 (en) * 2006-06-16 2010-12-01 ソニー株式会社 Semiconductor device and manufacturing method thereof
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
TWI344196B (en) * 2006-11-15 2011-06-21 Ind Tech Res Inst Melting temperature adjustable metal thermal interface materials and use thereof
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8445102B2 (en) * 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
TWI354529B (en) * 2007-11-23 2011-12-11 Ind Tech Res Inst Metal thermal interface material and thermal modul
US7760507B2 (en) * 2007-12-26 2010-07-20 The Bergquist Company Thermally and electrically conductive interconnect structures
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US8143631B2 (en) 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US8410720B2 (en) 2008-04-07 2013-04-02 Metrospec Technology, LLC. Solid state lighting circuit and controls
US7826222B2 (en) * 2008-07-03 2010-11-02 Juniper Networks, Inc. Front-to-back cooling system for modular systems with orthogonal midplane configuration
US8081468B2 (en) 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
US20100321897A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies
US8535787B1 (en) 2009-06-29 2013-09-17 Juniper Networks, Inc. Heat sinks having a thermal interface for cooling electronic devices
US8223498B2 (en) * 2009-11-11 2012-07-17 Juniper Networks, Inc. Thermal interface members for removable electronic devices
DE102010003330A1 (en) * 2010-03-26 2011-09-29 Robert Bosch Gmbh Thermally conductive arrangement between two components and method for producing a heat-conducting arrangement
CN102051157B (en) * 2010-12-12 2013-04-03 西北有色金属研究院 High-thermal-conductivity low-thermal-resistance interface material
US9059130B2 (en) 2012-12-31 2015-06-16 International Business Machines Corporation Phase changing on-chip thermal heat sink
CN103722804B (en) * 2013-12-04 2015-11-04 曹帅 A kind of Quaternary liquid metal heat interface material with two melting point character
CN103725261B (en) * 2013-12-04 2015-09-30 曹帅 A kind of Ternary liquid metal heat interface material with two melting point character
WO2015084778A1 (en) 2013-12-05 2015-06-11 Honeywell International Inc. Stannous methansulfonate solution with adjusted ph
US9826662B2 (en) 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
WO2015120773A1 (en) 2014-02-13 2015-08-20 Honeywell International Inc. Compressible thermal interface materials
US10155894B2 (en) 2014-07-07 2018-12-18 Honeywell International Inc. Thermal interface material with ion scavenger
CN104218010B (en) * 2014-09-10 2017-09-08 北京态金科技有限公司 A kind of metal heat interface material
JP6542891B2 (en) 2014-12-05 2019-07-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． High performance thermal interface material with low thermal impedance
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
JP6842469B2 (en) 2016-03-08 2021-03-17 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． Phase change material
US10182514B2 (en) 2016-06-27 2019-01-15 International Business Machines Corporation Thermal interface material structures
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
US11037860B2 (en) 2019-06-27 2021-06-15 International Business Machines Corporation Multi layer thermal interface material
TWI726546B (en) * 2019-12-20 2021-05-01 遠東科技大學 Method for coating metal layer to reduce surface tension of indium bismuth alloy and substrate and complex made by the method
US11774190B2 (en) 2020-04-14 2023-10-03 International Business Machines Corporation Pierced thermal interface constructions
CN112666207B (en) * 2020-12-03 2023-06-16 航天特种材料及工艺技术研究所 Thermal conductivity testing method for porous high-thermal-conductivity material

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU72235A1 (en) * 1975-04-07 1977-03-18
US4254431A (en) * 1979-06-20 1981-03-03 International Business Machines Corporation Restorable backbond for LSI chips using liquid metal coated dendrites
US4278479A (en) * 1980-06-18 1981-07-14 Hughes Aircraft Company Organic acid activated liquid solder flux
JPH0770650B2 (en) 1986-10-20 1995-07-31 富士通株式会社 Semiconductor device cooling method
CA2002213C (en) 1988-11-10 1999-03-30 Iwona Turlik High performance integrated circuit chip package and method of making same
US5097387A (en) 1990-06-27 1992-03-17 Digital Equipment Corporation Circuit chip package employing low melting point solder for heat transfer
JP3201868B2 (en) 1992-03-20 2001-08-27 アジレント・テクノロジーズ・インク Conductive thermal interface and method
US5323294A (en) 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same
US5455458A (en) 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
EP0708846A4 (en) * 1994-04-08 1996-08-21 Norsk Hydro As Process for continuous hot dip zinc coating of aluminum profiles
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
US5572404A (en) 1995-09-21 1996-11-05 Unisys Corporation Heat transfer module incorporating liquid metal squeezed from a compliant body
US5561590A (en) 1995-09-21 1996-10-01 Unisys Corporation Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring
AU723258B2 (en) * 1996-04-29 2000-08-24 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5930893A (en) 1996-05-29 1999-08-03 Eaton; Manford L. Thermally conductive material and method of using the same
US5923086A (en) 1997-05-14 1999-07-13 Intel Corporation Apparatus for cooling a semiconductor die
US5909056A (en) 1997-06-03 1999-06-01 Lsi Logic Corporation High performance heat spreader for flip chip packages
US5945217A (en) 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
DE19752329A1 (en) * 1997-11-26 1999-05-27 Stolberger Metallwerke Gmbh Process for the production of a metallic composite tape
US6183886B1 (en) * 1998-04-03 2001-02-06 Olin Corporation Tin coatings incorporating selected elemental additions to reduce discoloration
US6097602A (en) * 1998-06-23 2000-08-01 Marian, Inc. Integrated circuit package heat sink attachment
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface

Also Published As

Publication number Publication date
CN1314305C (en) 2007-05-02
US6761928B2 (en) 2004-07-13
WO2001063998A1 (en) 2001-08-30
US6617517B2 (en) 2003-09-09
US20020154485A1 (en) 2002-10-24
US20020148635A1 (en) 2002-10-17
TW595304B (en) 2004-06-21
US6372997B1 (en) 2002-04-16
CN1606901A (en) 2005-04-13

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