AU2001234941A1 - Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessor - Google Patents

Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessor

Info

Publication number
AU2001234941A1
AU2001234941A1 AU2001234941A AU3494101A AU2001234941A1 AU 2001234941 A1 AU2001234941 A1 AU 2001234941A1 AU 2001234941 A AU2001234941 A AU 2001234941A AU 3494101 A AU3494101 A AU 3494101A AU 2001234941 A1 AU2001234941 A1 AU 2001234941A1
Authority
AU
Australia
Prior art keywords
pin
parallel
plate
heat sink
copper heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001234941A
Other languages
English (en)
Inventor
Ashok N. Kabadi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2001234941A1 publication Critical patent/AU2001234941A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU2001234941A 2000-02-18 2001-02-07 Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessor Abandoned AU2001234941A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09504019 2000-02-18
US09/504,019 US6269864B1 (en) 2000-02-18 2000-02-18 Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
PCT/US2001/004087 WO2001061751A2 (en) 2000-02-18 2001-02-07 Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessor

Publications (1)

Publication Number Publication Date
AU2001234941A1 true AU2001234941A1 (en) 2001-08-27

Family

ID=24004533

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001234941A Abandoned AU2001234941A1 (en) 2000-02-18 2001-02-07 Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessor

Country Status (7)

Country Link
US (1) US6269864B1 (de)
EP (1) EP1256130A2 (de)
KR (1) KR100523498B1 (de)
CN (1) CN1423838A (de)
AU (1) AU2001234941A1 (de)
HK (1) HK1047820A1 (de)
WO (1) WO2001061751A2 (de)

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US6561267B2 (en) 2001-09-28 2003-05-13 Intel Corporation Heat sink and electronic circuit module including the same
US6817405B2 (en) * 2002-06-03 2004-11-16 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US20040200609A1 (en) * 2003-04-08 2004-10-14 Vincent Chen Heat sink with multiple micro bosses
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7096678B2 (en) * 2004-09-01 2006-08-29 Gelcore Llc Method and apparatus for increasing natural convection efficiency in long heat sinks
US6963488B1 (en) * 2004-11-22 2005-11-08 Chin-Ping Chen Device to convey the cool air from an air-conditioner into a computer
ITMI20050405U1 (it) * 2005-11-24 2007-05-25 Peltech Srl Dissipatore di calore alettato in particolare per un modulo termoelettrico
JP4011600B2 (ja) * 2006-01-30 2007-11-21 シャープ株式会社 ヒートシンク、電子機器、およびチューナ装置
CN101201676B (zh) * 2006-12-15 2010-05-19 富准精密工业(深圳)有限公司 散热装置
US7760506B1 (en) * 2007-06-06 2010-07-20 Hewlett-Packard Development Company, L.P. Electronic components, systems and apparatus with air flow devices
US8033325B2 (en) * 2007-07-24 2011-10-11 Asia Vital Components Co., Ltd. Heat dissipation apparatus with coarse surface capable of intensifying heat transfer
TWM337229U (en) * 2008-02-01 2008-07-21 Neng Tyi Prec Ind Co Ltd Heat dissipating element and heat radiator containing the same
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US20090321046A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Flow diverters to enhance heat sink performance
US20100009174A1 (en) * 2008-07-10 2010-01-14 Reis Bradley E Heat Dissipation For Low Profile Devices
KR101418025B1 (ko) * 2008-07-10 2014-07-09 그라프텍 인터내셔널 홀딩스 인코포레이티드 로우 프로파일 장치를 위한 향상된 열 방산
US8248809B2 (en) * 2008-08-26 2012-08-21 GM Global Technology Operations LLC Inverter power module with distributed support for direct substrate cooling
US20100314081A1 (en) * 2009-06-12 2010-12-16 Reis Bradley E High Temperature Graphite Heat Exchanger
US20110073292A1 (en) * 2009-09-30 2011-03-31 Madhav Datta Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems
US8405600B2 (en) * 2009-12-04 2013-03-26 Graftech International Holdings Inc. Method for reducing temperature-caused degradation in the performance of a digital reader
US8169779B2 (en) * 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
WO2011076219A1 (en) 2009-12-21 2011-06-30 Martin Professional A/S Cooling module for multiple light source projecting device
CN103548134B (zh) * 2011-05-17 2017-04-12 开利公司 用于冷却电力电子设备的散热器
CN102290382A (zh) * 2011-08-31 2011-12-21 昆山锦泰电子器材有限公司 热交换面积大的散热片
JPWO2013121691A1 (ja) * 2012-02-14 2015-05-11 パナソニックＩｐマネジメント株式会社 半導体装置
US9538693B2 (en) * 2013-03-15 2017-01-03 A.K. Stamping Company, Inc. Aluminum EMI / RF shield
EP2808941A1 (de) * 2013-05-31 2014-12-03 BAE Systems PLC Verbesserungen an oder im Zusammenhang mit Antennensystemen
AU2014272887B2 (en) * 2013-05-31 2017-12-14 Bae Systems Plc Improvements in and relating to antenna systems
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
CN103699196B (zh) * 2013-12-26 2018-05-25 中国船舶重工集团公司第七0九研究所 一种面向刀片服务器的套箱式保温/散热装置
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
US10082345B1 (en) 2014-08-15 2018-09-25 Dometic Sweden Ab Fin pack cooling assembly
USD805019S1 (en) 2015-05-15 2017-12-12 Dometic Sweden Ab Accessory base
USD805458S1 (en) 2015-05-15 2017-12-19 Dometic Sweden Ab Accessory base
CN106382610A (zh) * 2016-10-31 2017-02-08 华南理工大学 一种表面微齿结构的led散热翅片及其制备方法
CN108010893A (zh) * 2018-01-04 2018-05-08 钦州学院 基于荷叶微观表面的微型散热器及其制造方法
US11581237B2 (en) 2018-06-19 2023-02-14 Intel Corporation Cooling apparatuses for microelectronic assemblies
US11039550B1 (en) * 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures
US11933483B2 (en) * 2021-10-29 2024-03-19 Libra Design LLC Systems and methods for a heat sink

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US3327779A (en) * 1965-12-16 1967-06-27 Jacoby John Hull Heat dissipating device and method
GB2204181B (en) 1987-04-27 1990-03-21 Thermalloy Inc Heat sink apparatus and method of manufacture
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
US5224538A (en) * 1991-11-01 1993-07-06 Jacoby John H Dimpled heat transfer surface and method of making same
US5677829A (en) 1995-06-07 1997-10-14 Thermalloy, Inc. Fan attachment clip for heat sink
EP0956590A1 (de) * 1996-04-29 1999-11-17 Parker-Hannifin Corporation Anpassungsfähiges thermisches zwischenlagematerial für elektronischen komponenten
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
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US5912805A (en) * 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive

Also Published As

Publication number Publication date
CN1423838A (zh) 2003-06-11
KR100523498B1 (ko) 2005-10-25
HK1047820A1 (zh) 2003-03-07
EP1256130A2 (de) 2002-11-13
US6269864B1 (en) 2001-08-07
KR20020075919A (ko) 2002-10-07
WO2001061751A2 (en) 2001-08-23
WO2001061751A3 (en) 2002-03-07

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