TW542520U - Heat dissipating substrate - Google Patents

Heat dissipating substrate

Info

Publication number
TW542520U
TW542520U TW91217336U TW91217336U TW542520U TW 542520 U TW542520 U TW 542520U TW 91217336 U TW91217336 U TW 91217336U TW 91217336 U TW91217336 U TW 91217336U TW 542520 U TW542520 U TW 542520U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating substrate
substrate
heat
dissipating
Prior art date
Application number
TW91217336U
Other languages
Chinese (zh)
Inventor
Frank Wang
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW91217336U priority Critical patent/TW542520U/en
Publication of TW542520U publication Critical patent/TW542520U/en

Links

TW91217336U 2002-10-29 2002-10-29 Heat dissipating substrate TW542520U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91217336U TW542520U (en) 2002-10-29 2002-10-29 Heat dissipating substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91217336U TW542520U (en) 2002-10-29 2002-10-29 Heat dissipating substrate

Publications (1)

Publication Number Publication Date
TW542520U true TW542520U (en) 2003-07-11

Family

ID=29581533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91217336U TW542520U (en) 2002-10-29 2002-10-29 Heat dissipating substrate

Country Status (1)

Country Link
TW (1) TW542520U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113286423A (en) * 2021-05-28 2021-08-20 深圳市睿杰鑫电子有限公司 Multilayer PCB and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113286423A (en) * 2021-05-28 2021-08-20 深圳市睿杰鑫电子有限公司 Multilayer PCB and manufacturing method thereof

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees