AU2001229075A1 - Self-alignment hybridization process and component - Google Patents

Self-alignment hybridization process and component

Info

Publication number
AU2001229075A1
AU2001229075A1 AU2001229075A AU2907501A AU2001229075A1 AU 2001229075 A1 AU2001229075 A1 AU 2001229075A1 AU 2001229075 A AU2001229075 A AU 2001229075A AU 2907501 A AU2907501 A AU 2907501A AU 2001229075 A1 AU2001229075 A1 AU 2001229075A1
Authority
AU
Australia
Prior art keywords
alignment
self
component
hybridization process
hybridization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001229075A
Inventor
Jean-Marie G. Alibert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of AU2001229075A1 publication Critical patent/AU2001229075A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
AU2001229075A 2000-01-25 2000-12-13 Self-alignment hybridization process and component Abandoned AU2001229075A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00400201A EP1120672A1 (en) 2000-01-25 2000-01-25 Self-alignment hybridization process and component
EP00400201 2000-01-25
PCT/US2000/033702 WO2001055791A1 (en) 2000-01-25 2000-12-13 Self-alignment hybridization process and component

Publications (1)

Publication Number Publication Date
AU2001229075A1 true AU2001229075A1 (en) 2001-08-07

Family

ID=8173518

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001229075A Abandoned AU2001229075A1 (en) 2000-01-25 2000-12-13 Self-alignment hybridization process and component

Country Status (8)

Country Link
US (1) US6621961B2 (en)
EP (1) EP1120672A1 (en)
JP (1) JP2003521008A (en)
CN (1) CN1425147A (en)
AU (1) AU2001229075A1 (en)
CA (1) CA2395635A1 (en)
TW (1) TW502125B (en)
WO (1) WO2001055791A1 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6345139B1 (en) * 2000-04-04 2002-02-05 Kabushiki Kaisha Toshiba Semiconductor light emitting element coupled with optical fiber
US6744953B2 (en) * 2001-09-07 2004-06-01 Agilent Technologies, Inc. Planar optical waveguide with alignment structure
GB0128616D0 (en) * 2001-11-29 2002-01-23 Denselight Semiconductors Pte Standoffs for passive alignment of semiconductor chip and coupling bench
US6800212B2 (en) * 2002-05-15 2004-10-05 The Regents Of The University Of California Fabrication of optical components using Si, SiGe, SiGeC, and chemical endpoint detection
US6959134B2 (en) * 2003-06-30 2005-10-25 Intel Corporation Measuring the position of passively aligned optical components
JP4678155B2 (en) * 2004-07-28 2011-04-27 富士ゼロックス株式会社 Optical waveguide, ferrule for optical waveguide, and optical connector
WO2007010184A1 (en) * 2005-07-15 2007-01-25 Xyratex Technology Limited Optical printed circuit board and manufacturing method
JP2007298770A (en) * 2006-04-28 2007-11-15 Nec Corp Optical waveguide device and its manufacturing method
JP2008281780A (en) * 2007-05-10 2008-11-20 Nitto Denko Corp Lens-equipped optical waveguide device for touch panel and optical waveguide to be used for the same
US20100183266A1 (en) * 2007-06-14 2010-07-22 Kazuya Shimoda Optical module and method for manufacturing the same
JP5156502B2 (en) * 2007-06-26 2013-03-06 パナソニック株式会社 Optical module
JP2009036924A (en) * 2007-07-31 2009-02-19 Nitto Denko Corp Optical waveguide film, optical substrate and methods for manufacturing the same
JP4892457B2 (en) 2007-11-06 2012-03-07 日東電工株式会社 Manufacturing method of optical waveguide device and optical waveguide device obtained thereby
CH700471B1 (en) 2009-02-17 2013-07-31 Vario Optics Ag A process for producing an electro-optical printed circuit board with optical waveguide structures.
WO2010116291A2 (en) * 2009-04-08 2010-10-14 International Business Machines Corporation Optical waveguide with embedded light-reflecting feature and method for fabricating the same
KR101199302B1 (en) 2009-10-13 2012-11-09 한국전자통신연구원 Optical Device and Method of Fabricating the Same
EP2802914A4 (en) * 2012-01-09 2016-01-13 Hewlett Packard Development Co Optical connections
JP2015079061A (en) * 2013-10-15 2015-04-23 富士通株式会社 Optical module, electronic instrument using the same, and assembly method of optical module
WO2018225820A1 (en) 2017-06-07 2018-12-13 日本電信電話株式会社 Connection structure for optical waveguide chip
US10490971B2 (en) * 2017-06-09 2019-11-26 International Business Machines Corporation Self-alignment features for III-V ridge process and angled facet die
US10156688B1 (en) * 2017-08-17 2018-12-18 Avago Technologies International Sales Pte. Limited Passive alignment system and an optical communications module that incorporates the passive alignment system
WO2019234589A2 (en) * 2018-06-03 2019-12-12 Dust Photonics Method and device for aligning a laser and a waveguide
CN111323878B (en) * 2020-04-01 2021-10-15 联合微电子中心有限责任公司 Coupling alignment device and method for laser chip and silicon-based optoelectronic chip
JPWO2024100782A1 (en) * 2022-11-09 2024-05-16

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136346A (en) * 1989-10-23 1991-06-11 Fujitsu Ltd Manufacture of soi substrate
US5182782A (en) * 1990-07-11 1993-01-26 Gte Laboratories Incorporated Waferboard structure and method of fabricating
US6017681A (en) * 1992-11-09 2000-01-25 Fujitsu Limited Method of coupling optical parts and method of forming a mirror
JP3117107B2 (en) * 1993-08-03 2000-12-11 シャープ株式会社 Assembly structure of optical integrated circuit device

Also Published As

Publication number Publication date
CA2395635A1 (en) 2001-08-02
WO2001055791A1 (en) 2001-08-02
JP2003521008A (en) 2003-07-08
US20010009597A1 (en) 2001-07-26
TW502125B (en) 2002-09-11
CN1425147A (en) 2003-06-18
US6621961B2 (en) 2003-09-16
EP1120672A1 (en) 2001-08-01

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