ATE55655T1 - Vergossene elektronische bauteile. - Google Patents

Vergossene elektronische bauteile.

Info

Publication number
ATE55655T1
ATE55655T1 AT86303049T AT86303049T ATE55655T1 AT E55655 T1 ATE55655 T1 AT E55655T1 AT 86303049 T AT86303049 T AT 86303049T AT 86303049 T AT86303049 T AT 86303049T AT E55655 T1 ATE55655 T1 AT E55655T1
Authority
AT
Austria
Prior art keywords
casing
lead frame
reed relay
completed
produce
Prior art date
Application number
AT86303049T
Other languages
English (en)
Inventor
Graham Spencer Dale
Original Assignee
Pickering Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pickering Electronics Ltd filed Critical Pickering Electronics Ltd
Application granted granted Critical
Publication of ATE55655T1 publication Critical patent/ATE55655T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/28—Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
    • H01H51/281—Mounting of the relay; Encapsulating; Details of connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49915—Overedge assembling of seated part
    • Y10T29/49922—Overedge assembling of seated part by bending over projecting prongs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Casings For Electric Apparatus (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Glass Compositions (AREA)
  • Ceramic Capacitors (AREA)
  • Telephone Function (AREA)
AT86303049T 1985-04-26 1986-04-23 Vergossene elektronische bauteile. ATE55655T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB858510621A GB8510621D0 (en) 1985-04-26 1985-04-26 Potted electronic components
EP86303049A EP0203707B1 (de) 1985-04-26 1986-04-23 Vergossene elektronische Bauteile

Publications (1)

Publication Number Publication Date
ATE55655T1 true ATE55655T1 (de) 1990-09-15

Family

ID=10578228

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86303049T ATE55655T1 (de) 1985-04-26 1986-04-23 Vergossene elektronische bauteile.

Country Status (5)

Country Link
US (1) US4724613A (de)
EP (1) EP0203707B1 (de)
AT (1) ATE55655T1 (de)
DE (1) DE3673458D1 (de)
GB (1) GB8510621D0 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235742A (en) * 1989-11-20 1993-08-17 Siemens Pacesetter, Inc. Method of making an implantable device
GB9022996D0 (en) * 1990-10-23 1990-12-05 Leonard Ian Prosthesis and methods and apparatus for making same
DE4216038C2 (de) * 1992-05-15 1994-04-28 Berthold Rothe Reedrelaisgehäuse
US6551863B2 (en) 2001-08-30 2003-04-22 Micron Technology, Inc. Flip chip dip coating encapsulant
US8399972B2 (en) 2004-03-04 2013-03-19 Skyworks Solutions, Inc. Overmolded semiconductor package with a wirebond cage for EMI shielding
US20080112151A1 (en) * 2004-03-04 2008-05-15 Skyworks Solutions, Inc. Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
NL1033804C2 (nl) 2007-05-04 2008-11-06 Friesland Brands Bv Caloriearme melkproducten.
US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
US20120057313A1 (en) * 2010-09-03 2012-03-08 National Semiconductor Corporation Package for system level electronic products
US9679869B2 (en) 2011-09-02 2017-06-13 Skyworks Solutions, Inc. Transmission line for high performance radio frequency applications
US8948712B2 (en) 2012-05-31 2015-02-03 Skyworks Solutions, Inc. Via density and placement in radio frequency shielding applications
CN103597742A (zh) 2012-06-14 2014-02-19 西凯渥资讯处理科技公司 包含相关系统、装置及方法的功率放大器模块
WO2014011808A1 (en) 2012-07-13 2014-01-16 Skyworks Solutions, Inc. Racetrack design in radio frequency shielding applications
GB201305260D0 (en) * 2013-03-22 2013-05-01 Pickering Electronics Ltd Encapsulated Reed Display

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1185665A (en) * 1966-04-04 1970-03-25 Matsushita Electric Works Ltd Ballast Composition for Electric Devices
US3484536A (en) * 1967-11-29 1969-12-16 Sprague Electric Co Encapsulated component
US3806766A (en) * 1972-12-27 1974-04-23 Western Electric Co Packaged electrical component assembly and method of fabrication
US3831265A (en) * 1973-01-23 1974-08-27 Bell Telephone Labor Inc Method of packaging an electrical device
DE2545322A1 (de) * 1975-10-09 1977-04-28 Bunker Ramo Miniaturschutzrohrkontaktrelais
US4064472A (en) * 1976-04-08 1977-12-20 Vanguard Electronics Company, Inc. Compact inductor
US4260850A (en) * 1980-02-22 1981-04-07 Western Electric Company, Inc. Box for encasing an electrical device
US4594644A (en) * 1984-10-22 1986-06-10 Electronic Instrument & Specialty Corp. Electrical component encapsulation package

Also Published As

Publication number Publication date
DE3673458D1 (de) 1990-09-20
EP0203707B1 (de) 1990-08-16
EP0203707A1 (de) 1986-12-03
GB8510621D0 (en) 1985-06-05
US4724613A (en) 1988-02-16

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Legal Events

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