ATE55655T1 - Vergossene elektronische bauteile. - Google Patents

Vergossene elektronische bauteile.

Info

Publication number
ATE55655T1
ATE55655T1 AT86303049T AT86303049T ATE55655T1 AT E55655 T1 ATE55655 T1 AT E55655T1 AT 86303049 T AT86303049 T AT 86303049T AT 86303049 T AT86303049 T AT 86303049T AT E55655 T1 ATE55655 T1 AT E55655T1
Authority
AT
Austria
Prior art keywords
casing
lead frame
reed relay
completed
produce
Prior art date
Application number
AT86303049T
Other languages
English (en)
Inventor
Graham Spencer Dale
Original Assignee
Pickering Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pickering Electronics Ltd filed Critical Pickering Electronics Ltd
Application granted granted Critical
Publication of ATE55655T1 publication Critical patent/ATE55655T1/de

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0091Housing specially adapted for small components
    • H05K5/0095Housing specially adapted for small components hermetically-sealed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00Electromagnetic relays
    • H01H51/28Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
    • H01H51/281Mounting of the relay; Encapsulating; Details of connections
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining
    • Y10T29/49908Joining by deforming
    • Y10T29/49915Overedge assembling of seated part
    • Y10T29/49922Overedge assembling of seated part by bending over projecting prongs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Casings For Electric Apparatus (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Telephone Function (AREA)
  • Glass Compositions (AREA)
  • Ceramic Capacitors (AREA)
AT86303049T 1985-04-26 1986-04-23 Vergossene elektronische bauteile. ATE55655T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB858510621A GB8510621D0 (en) 1985-04-26 1985-04-26 Potted electronic components
EP86303049A EP0203707B1 (de) 1985-04-26 1986-04-23 Vergossene elektronische Bauteile

Publications (1)

Publication Number Publication Date
ATE55655T1 true ATE55655T1 (de) 1990-09-15

Family

ID=10578228

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86303049T ATE55655T1 (de) 1985-04-26 1986-04-23 Vergossene elektronische bauteile.

Country Status (5)

Country Link
US (1) US4724613A (de)
EP (1) EP0203707B1 (de)
AT (1) ATE55655T1 (de)
DE (1) DE3673458D1 (de)
GB (1) GB8510621D0 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235742A (en) * 1989-11-20 1993-08-17 Siemens Pacesetter, Inc. Method of making an implantable device
GB9022996D0 (en) * 1990-10-23 1990-12-05 Leonard Ian Prosthesis and methods and apparatus for making same
DE4216038C2 (de) * 1992-05-15 1994-04-28 Berthold Rothe Reedrelaisgehäuse
US6551863B2 (en) 2001-08-30 2003-04-22 Micron Technology, Inc. Flip chip dip coating encapsulant
US20080112151A1 (en) * 2004-03-04 2008-05-15 Skyworks Solutions, Inc. Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
US8399972B2 (en) * 2004-03-04 2013-03-19 Skyworks Solutions, Inc. Overmolded semiconductor package with a wirebond cage for EMI shielding
NL1033804C2 (nl) 2007-05-04 2008-11-06 Friesland Brands Bv Caloriearme melkproducten.
US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
US20120057313A1 (en) * 2010-09-03 2012-03-08 National Semiconductor Corporation Package for system level electronic products
US9679869B2 (en) 2011-09-02 2017-06-13 Skyworks Solutions, Inc. Transmission line for high performance radio frequency applications
US8948712B2 (en) 2012-05-31 2015-02-03 Skyworks Solutions, Inc. Via density and placement in radio frequency shielding applications
KR101921686B1 (ko) 2012-06-14 2018-11-26 스카이워크스 솔루션즈, 인코포레이티드 와이어 본드 패드 및 관련된 시스템, 장치, 및 방법을 포함하는 전력 증폭기 모듈
WO2014011808A1 (en) 2012-07-13 2014-01-16 Skyworks Solutions, Inc. Racetrack design in radio frequency shielding applications
GB201305260D0 (en) * 2013-03-22 2013-05-01 Pickering Electronics Ltd Encapsulated Reed Display

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1185665A (en) * 1966-04-04 1970-03-25 Matsushita Electric Works Ltd Ballast Composition for Electric Devices
US3484536A (en) * 1967-11-29 1969-12-16 Sprague Electric Co Encapsulated component
US3806766A (en) * 1972-12-27 1974-04-23 Western Electric Co Packaged electrical component assembly and method of fabrication
US3831265A (en) * 1973-01-23 1974-08-27 Bell Telephone Labor Inc Method of packaging an electrical device
DE2545322A1 (de) * 1975-10-09 1977-04-28 Bunker Ramo Miniaturschutzrohrkontaktrelais
US4064472A (en) * 1976-04-08 1977-12-20 Vanguard Electronics Company, Inc. Compact inductor
US4260850A (en) * 1980-02-22 1981-04-07 Western Electric Company, Inc. Box for encasing an electrical device
US4594644A (en) * 1984-10-22 1986-06-10 Electronic Instrument & Specialty Corp. Electrical component encapsulation package

Also Published As

Publication number Publication date
GB8510621D0 (en) 1985-06-05
US4724613A (en) 1988-02-16
EP0203707B1 (de) 1990-08-16
DE3673458D1 (de) 1990-09-20
EP0203707A1 (de) 1986-12-03

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties