ATE542227T1 - Implantierbare zusammen ausgelöste elektrische durchspeisungen - Google Patents

Implantierbare zusammen ausgelöste elektrische durchspeisungen

Info

Publication number
ATE542227T1
ATE542227T1 AT06814689T AT06814689T ATE542227T1 AT E542227 T1 ATE542227 T1 AT E542227T1 AT 06814689 T AT06814689 T AT 06814689T AT 06814689 T AT06814689 T AT 06814689T AT E542227 T1 ATE542227 T1 AT E542227T1
Authority
AT
Austria
Prior art keywords
electrical
implantable
power supply
electrical power
electrical feedthrough
Prior art date
Application number
AT06814689T
Other languages
English (en)
Inventor
Jeremy W Burdon
Joyce K Yamamoto
Lea A Nygren
William D Wolf
Original Assignee
Medtronic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Medtronic Inc filed Critical Medtronic Inc
Application granted granted Critical
Publication of ATE542227T1 publication Critical patent/ATE542227T1/de

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A61N1/3754—Feedthroughs
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/37512—Pacemakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Power Engineering (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Veterinary Medicine (AREA)
  • Radiology & Medical Imaging (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Biophysics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Electrotherapy Devices (AREA)
  • Materials For Medical Uses (AREA)
AT06814689T 2005-09-15 2006-09-15 Implantierbare zusammen ausgelöste elektrische durchspeisungen ATE542227T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/227,342 US20070060969A1 (en) 2005-09-15 2005-09-15 Implantable co-fired electrical feedthroughs
PCT/US2006/035928 WO2007035445A1 (en) 2005-09-15 2006-09-15 Implantable co-fired electrical feedthroughs

Publications (1)

Publication Number Publication Date
ATE542227T1 true ATE542227T1 (de) 2012-02-15

Family

ID=37555704

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06814689T ATE542227T1 (de) 2005-09-15 2006-09-15 Implantierbare zusammen ausgelöste elektrische durchspeisungen

Country Status (4)

Country Link
US (1) US20070060969A1 (de)
EP (1) EP1934994B1 (de)
AT (1) ATE542227T1 (de)
WO (1) WO2007035445A1 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9616223B2 (en) * 2005-12-30 2017-04-11 Medtronic, Inc. Media-exposed interconnects for transducers
US20070291901A1 (en) * 2006-06-15 2007-12-20 Varian Medical Systems Technologies, Inc. X-ray tube window bonding with smooth bonding surface
US8461681B2 (en) * 2007-04-27 2013-06-11 Medtronic, Inc. Layered structure for corrosion resistant interconnect contacts
US20090088618A1 (en) 2007-10-01 2009-04-02 Arneson Michael R System and Method for Manufacturing a Swallowable Sensor Device
US8983618B2 (en) * 2008-10-31 2015-03-17 Medtronic, Inc. Co-fired multi-layer antenna for implantable medical devices and method for forming the same
JP2010171157A (ja) * 2009-01-22 2010-08-05 Sanyo Electric Co Ltd 電子素子用パッケージ及び電子部品
EP2437850B1 (de) 2009-06-04 2014-11-19 Morgan Advanced Ceramics, Inc. Durchführungen aus einbrand-metall- und keramikverbund, zumindest für die verwendung für implantierbare medizinische vorrichtungen, und herstellungsverfahren dafür
US20110048770A1 (en) * 2009-08-31 2011-03-03 Medtronic Inc. Injection molded ferrule for cofired feedthroughs
US8373075B2 (en) * 2009-10-29 2013-02-12 Medtronic, Inc. Implantable co-fired electrical feedthroughs
US20110125210A1 (en) * 2009-11-24 2011-05-26 Medtronic, Inc. Ltcc/htcc hybrid feedthrough
FR2957749A1 (fr) 2010-03-22 2011-09-23 Sorin Crm Sas Procede de realisation d'une traversee electrique dans la paroi metallique d'un boitier, notamment de dispositif medical actif, et dispositif pourvu d'une telle traversee
US8386047B2 (en) 2010-07-15 2013-02-26 Advanced Bionics Implantable hermetic feedthrough
US8552311B2 (en) 2010-07-15 2013-10-08 Advanced Bionics Electrical feedthrough assembly
US11198014B2 (en) 2011-03-01 2021-12-14 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing
US10596369B2 (en) 2011-03-01 2020-03-24 Greatbatch Ltd. Low equivalent series resistance RF filter for an active implantable medical device
US8588916B2 (en) * 2011-08-02 2013-11-19 Medtronic, Inc. Feedthrough configured for interconnect
US8841558B2 (en) 2011-08-02 2014-09-23 Medtronic Inc. Hermetic feedthrough
US9627833B2 (en) * 2011-08-02 2017-04-18 Medtronic, Inc. Electrical leads for a feedthrough
US9008779B2 (en) * 2011-08-02 2015-04-14 Medtronic, Inc. Insulator for a feedthrough
US8670829B2 (en) 2011-08-02 2014-03-11 Medtronic, Inc. Insulator for a feedthrough
US8872035B2 (en) 2011-08-02 2014-10-28 Medtronic, Inc. Hermetic feedthrough
US9724524B2 (en) 2011-08-02 2017-08-08 Medtronic, Inc. Interconnection of conductor to feedthrough
US10046166B2 (en) 2012-01-16 2018-08-14 Greatbatch Ltd. EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
US8938309B2 (en) 2012-01-16 2015-01-20 Greatbatch Ltd. Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device
US9889306B2 (en) 2012-01-16 2018-02-13 Greatbatch Ltd. Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device
US10881867B2 (en) 2012-01-16 2021-01-05 Greatbatch Ltd. Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device
US10420949B2 (en) 2012-01-16 2019-09-24 Greatbatch Ltd. Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step
US20150250386A1 (en) * 2012-09-28 2015-09-10 Csem Centre Suisse D'electronique Et De Microtechnique Sa -Recherche Et Developpement Implantable devices
CN103871835A (zh) * 2012-12-11 2014-06-18 深圳市振华微电子有限公司 一种用于厚膜混合集成电路的成膜工艺
USRE46699E1 (en) 2013-01-16 2018-02-06 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US9591770B2 (en) 2013-04-26 2017-03-07 Kla-Tencor Corporation Multi-layer ceramic vacuum to atmosphere electric feed through
US9387331B2 (en) 2013-10-08 2016-07-12 Medtronic, Inc. Implantable medical devices having hollow cap cofire ceramic structures and methods of fabricating the same
US9502754B2 (en) 2014-01-24 2016-11-22 Medtronic, Inc. Implantable medical devices having cofire ceramic modules and methods of fabricating the same
DE102016100865A1 (de) * 2016-01-20 2017-07-20 Biotronik Se & Co. Kg Durchführung eines medizinelektronischen Gerätes, Verfahren zur Herstellung einer solchen und medizinelektronisches Gerät
US10283275B2 (en) 2016-05-20 2019-05-07 Greatbatch Ltd. Feedthrough seal apparatus, system, and method
EP3560553A1 (de) * 2017-01-06 2019-10-30 Greatbatch Ltd. Verfahren zur herstellung einer durchführung für eine aktive implantierbare medizinische vorrichtung
US10249415B2 (en) 2017-01-06 2019-04-02 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
EP3449973B1 (de) 2017-08-30 2022-12-21 Greatbatch Ltd. Durchführungsanordnung für aktive implantierbare medizinische vorrichtung
EP3466485B1 (de) * 2017-10-05 2022-11-30 Heraeus Deutschland GmbH & Co. KG Interne cermet-verbindung für komplexe durchführungen
EP3505216B1 (de) * 2018-01-02 2020-07-22 Heraeus Deutschland GmbH & Co. KG Elektrische kontaktierungsvorrichtungsvorrichtung für eine implantierbare medizinische vorrichtung und verfahren zur herstellung

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3943915A (en) * 1974-11-29 1976-03-16 Motorola, Inc. Intracranial pressure sensing device
JPS5852900A (ja) * 1981-09-24 1983-03-29 株式会社日立製作所 セラミツク多層配線板の製造方法
FR2556503B1 (fr) * 1983-12-08 1986-12-12 Eurofarad Substrat d'interconnexion en alumine pour composant electronique
US4910643A (en) * 1988-06-06 1990-03-20 General Electric Company Thick film, multi-layer, ceramic interconnected circuit board
US5000000A (en) * 1988-08-31 1991-03-19 University Of Florida Ethanol production by Escherichia coli strains co-expressing Zymomonas PDC and ADH genes
JP2642253B2 (ja) * 1991-02-27 1997-08-20 日本特殊陶業株式会社 ガラス−セラミックス複合体
US5277724A (en) * 1991-12-18 1994-01-11 General Electric Co. Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board
US5434358A (en) * 1993-12-13 1995-07-18 E-Systems, Inc. High density hermetic electrical feedthroughs
US5782891A (en) * 1994-06-16 1998-07-21 Medtronic, Inc. Implantable ceramic enclosure for pacing, neurological, and other medical applications in the human body
US5750926A (en) * 1995-08-16 1998-05-12 Alfred E. Mann Foundation For Scientific Research Hermetically sealed electrical feedthrough for use with implantable electronic devices
US5620476A (en) * 1995-11-13 1997-04-15 Pacesetter, Inc. Implantable medical device having shielded and filtered feedthrough assembly and methods for making such assembly
US5831810A (en) * 1996-08-21 1998-11-03 International Business Machines Corporation Electronic component package with decoupling capacitors completely within die receiving cavity of substrate
US5855995A (en) * 1997-02-21 1999-01-05 Medtronic, Inc. Ceramic substrate for implantable medical devices
US6146743A (en) * 1997-02-21 2000-11-14 Medtronic, Inc. Barrier metallization in ceramic substrate for implantable medical devices
JP3601679B2 (ja) * 1999-07-27 2004-12-15 株式会社村田製作所 複合積層体の製造方法
JP3646587B2 (ja) * 1999-10-27 2005-05-11 株式会社村田製作所 多層セラミック基板およびその製造方法
US6414835B1 (en) * 2000-03-01 2002-07-02 Medtronic, Inc. Capacitive filtered feedthrough array for an implantable medical device
JP3818030B2 (ja) * 2000-07-21 2006-09-06 株式会社村田製作所 多層基板の製造方法
JP2002084065A (ja) * 2000-09-07 2002-03-22 Murata Mfg Co Ltd 多層セラミック基板およびその製造方法ならびに電子装置
US6759740B2 (en) * 2001-03-30 2004-07-06 Kyocera Corporation Composite ceramic board, method of producing the same, optical/electronic-mounted circuit substrate using said board, and mounted board equipped with said circuit substrate
US20040188124A1 (en) * 2002-03-22 2004-09-30 Stark David H. Hermetic window assemblies and frames
US6711029B2 (en) * 2002-05-21 2004-03-23 Cts Corporation Low temperature co-fired ceramic with improved shrinkage control
US7348097B2 (en) * 2003-06-17 2008-03-25 Medtronic, Inc. Insulative feed through assembly for electrochemical devices

Also Published As

Publication number Publication date
EP1934994A1 (de) 2008-06-25
US20070060969A1 (en) 2007-03-15
EP1934994B1 (de) 2012-01-18
WO2007035445A1 (en) 2007-03-29

Similar Documents

Publication Publication Date Title
ATE542227T1 (de) Implantierbare zusammen ausgelöste elektrische durchspeisungen
CN102614588B (zh) 用于可植入医疗设备的具有连接层的含有金属陶瓷的套管
US8364267B2 (en) Fixation of implantable pulse generators
CN102614585A (zh) 具有含有金属陶瓷的连接元件的电气套管
US7818876B2 (en) Method for fabrication of hermetic electrical conductor feedthroughs
US8660645B2 (en) Electronic network components utilizing biocompatible conductive adhesives for direct body fluid exposure
WO2006110798A3 (en) Electromagnetically coupled hermetic chamber
CN102614587A (zh) 具有集成陶瓷套管的可植入设备
US20140343648A1 (en) Contacting arrangement comprising a feedthrough and a filter structure and method of making
US11344735B2 (en) Implantable medical devices with electrically isolated batteries in a separate enclosure
US20060221543A1 (en) Hybrid spring contact system for emi filtered hermetic seals for active implantable medical devices
CN102671299A (zh) 可直接施加的电气套管
US8569633B2 (en) Feedthrough for microelectromechanical system
CN102614582A (zh) 用于可植入医疗设备的陶瓷套管
ATE513505T1 (de) Sensor mit schichtelektroden
EP1977786A3 (de) Eine Filteranordnung und eine Durchführungsanordnung
AU2017202387B2 (en) Implantable medical device and assembly thereof
WO2006041785A3 (en) Ecg/pacing electrodes
US9937339B2 (en) Multielectrode lead with multiplexed control and associated connection method
JP6968880B2 (ja) 植込み可能な電気接触構成
US9884197B2 (en) Encapsulated electronic circuit
EP2296753B1 (de) Zuführungsanordnungen durch glas für implantierbare medizinische produkte
US20110125210A1 (en) Ltcc/htcc hybrid feedthrough
WO2007089977A1 (en) Implantable medical device with lead-carried proximal electrode
US7281955B2 (en) System of connection of a probe terminal to a connector head in an implantable medical device