ATE537512T1 - Herstellungsverfahren von chipkarten - Google Patents
Herstellungsverfahren von chipkartenInfo
- Publication number
- ATE537512T1 ATE537512T1 AT06831013T AT06831013T ATE537512T1 AT E537512 T1 ATE537512 T1 AT E537512T1 AT 06831013 T AT06831013 T AT 06831013T AT 06831013 T AT06831013 T AT 06831013T AT E537512 T1 ATE537512 T1 AT E537512T1
- Authority
- AT
- Austria
- Prior art keywords
- chip cards
- tool
- film
- production process
- locations
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0511078A FR2892842B1 (fr) | 2005-10-28 | 2005-10-28 | Procede de fabrication d'une pluralite de cartes a microcircuit |
PCT/FR2006/002399 WO2007048927A1 (fr) | 2005-10-28 | 2006-10-25 | Procede de fabrication d'une pluralite de cartes à microcircuit |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE537512T1 true ATE537512T1 (de) | 2011-12-15 |
Family
ID=36760149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06831013T ATE537512T1 (de) | 2005-10-28 | 2006-10-25 | Herstellungsverfahren von chipkarten |
Country Status (7)
Country | Link |
---|---|
US (1) | US8561291B2 (de) |
EP (1) | EP1989664B1 (de) |
AT (1) | ATE537512T1 (de) |
ES (1) | ES2379193T3 (de) |
FR (1) | FR2892842B1 (de) |
PL (1) | PL1989664T3 (de) |
WO (1) | WO2007048927A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004100135A1 (en) * | 2003-05-12 | 2004-11-18 | Sae Magnetics (H.K.) Ltd. | Method and mechanism of pzt micro-actuator attachment for the hard disk driver arm |
FR2923631A1 (fr) * | 2007-11-12 | 2009-05-15 | Datacard Corp | Procede et systeme de personnalisation d'objets a puce |
CN101409240B (zh) * | 2008-03-21 | 2010-09-08 | 北京德鑫泉科技发展有限公司 | 可使用芯片的智能标签及倒装芯片模块生产设备 |
US8086269B2 (en) * | 2008-09-12 | 2011-12-27 | A-Men Technology Corporation | Modular structure to expand and enhance subscriber identity module card functionality |
CN102941739B (zh) * | 2012-10-15 | 2015-02-18 | 北京航星机器制造公司 | 一种实现USB Key芯片写入与激光打标同步的系统和方法 |
CN106564299B (zh) * | 2015-10-12 | 2018-01-09 | 沈阳派尔泰科科技有限公司 | 一种智能卡激光打标方法及实施该方法的激光打标装置 |
ITUB20155233A1 (it) * | 2015-10-30 | 2017-04-30 | Automation 4 Industiral Solutions S R L | Metodo di impianto per la realizzazione di dispositivi rfid |
CN110978809B (zh) * | 2019-12-26 | 2021-07-06 | 东莞市图创智能制造有限公司 | 油墨的固化方法、装置、设备及存储介质 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
FR2616995A1 (fr) * | 1987-06-22 | 1988-12-23 | Ebauchesfabrik Eta Ag | Procede de fabrication de modules electroniques |
DE4421607A1 (de) * | 1994-06-21 | 1996-01-04 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Datenträgern |
ES2146989T3 (es) * | 1996-02-12 | 2000-08-16 | David Finn | Procedimiento y dispositivo para el contacto de un conductor de hilo. |
US7264992B2 (en) * | 2004-08-06 | 2007-09-04 | Paul Hsueh | Removable flash integrated memory module card and method of manufacture |
US6586078B2 (en) * | 2001-07-05 | 2003-07-01 | Soundcraft, Inc. | High pressure lamination of electronic cards |
AT414077B (de) * | 2001-08-14 | 2006-08-15 | Datacon Semiconductor Equip | Verfahren und einrichtung zur positionsveränderung von elektronischen bauteilen |
DE10248392B4 (de) * | 2002-10-17 | 2016-02-04 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines kartenförmigen Datenträgers |
-
2005
- 2005-10-28 FR FR0511078A patent/FR2892842B1/fr not_active Expired - Fee Related
-
2006
- 2006-10-25 EP EP06831013A patent/EP1989664B1/de not_active Not-in-force
- 2006-10-25 US US12/091,904 patent/US8561291B2/en active Active
- 2006-10-25 ES ES06831013T patent/ES2379193T3/es active Active
- 2006-10-25 WO PCT/FR2006/002399 patent/WO2007048927A1/fr active Application Filing
- 2006-10-25 PL PL06831013T patent/PL1989664T3/pl unknown
- 2006-10-25 AT AT06831013T patent/ATE537512T1/de active
Also Published As
Publication number | Publication date |
---|---|
PL1989664T3 (pl) | 2012-05-31 |
US20080276456A1 (en) | 2008-11-13 |
FR2892842B1 (fr) | 2008-02-15 |
ES2379193T3 (es) | 2012-04-23 |
EP1989664A1 (de) | 2008-11-12 |
US8561291B2 (en) | 2013-10-22 |
WO2007048927A1 (fr) | 2007-05-03 |
EP1989664B1 (de) | 2011-12-14 |
FR2892842A1 (fr) | 2007-05-04 |
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