ATE524530T1 - Verwendung von glasartigen siliconbasierten hartbeschichtungen als trennbeschichtungen für druckbare elektronik - Google Patents

Verwendung von glasartigen siliconbasierten hartbeschichtungen als trennbeschichtungen für druckbare elektronik

Info

Publication number
ATE524530T1
ATE524530T1 AT08872163T AT08872163T ATE524530T1 AT E524530 T1 ATE524530 T1 AT E524530T1 AT 08872163 T AT08872163 T AT 08872163T AT 08872163 T AT08872163 T AT 08872163T AT E524530 T1 ATE524530 T1 AT E524530T1
Authority
AT
Austria
Prior art keywords
silicone
coatings
based hard
glass
printable electronics
Prior art date
Application number
AT08872163T
Other languages
English (en)
Inventor
Michael Brasseur
Karen Hueston
James Tonge
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of ATE524530T1 publication Critical patent/ATE524530T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Electroluminescent Light Sources (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT08872163T 2008-01-30 2008-12-18 Verwendung von glasartigen siliconbasierten hartbeschichtungen als trennbeschichtungen für druckbare elektronik ATE524530T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2457208P 2008-01-30 2008-01-30
PCT/US2008/087304 WO2009099484A1 (en) 2008-01-30 2008-12-18 The use of glassy silicone-based hard coating as release coatings for printable electronics

Publications (1)

Publication Number Publication Date
ATE524530T1 true ATE524530T1 (de) 2011-09-15

Family

ID=40602637

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08872163T ATE524530T1 (de) 2008-01-30 2008-12-18 Verwendung von glasartigen siliconbasierten hartbeschichtungen als trennbeschichtungen für druckbare elektronik

Country Status (8)

Country Link
US (1) US8318244B2 (de)
EP (1) EP2242811B1 (de)
JP (1) JP5389052B2 (de)
KR (1) KR20100127767A (de)
CN (1) CN101932666A (de)
AT (1) ATE524530T1 (de)
TW (1) TWI434631B (de)
WO (1) WO2009099484A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1940989B1 (de) 2005-09-29 2010-12-15 Dow Corning Corporation Verfahren zum abtrennen von hochtemperaturfilmen und/oder vorrichtungen von metallsubstraten
TWI509631B (zh) * 2011-02-25 2015-11-21 Henkel IP & Holding GmbH 用於電子裝置之可燒結銀薄片黏著劑
KR101570398B1 (ko) * 2012-04-26 2015-11-19 오사카 유니버시티 투명 도전성 잉크 및 투명 도전 패턴형성방법
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
WO2014113617A1 (en) 2013-01-21 2014-07-24 Innovative Finishes LLC Refurbished component, electronic device including the same, and method of refurbishing a component of an electronic device
KR20150014857A (ko) * 2013-07-30 2015-02-09 주식회사 엘지화학 열 융착 전사를 이용한 유연 매립형 전극 필름의 제조 방법
CN104363323B (zh) * 2014-11-29 2018-01-12 兴科电子(东莞)有限公司 一种手机按键的制作方法及根据该方法制作的手机按键
EP3294799A4 (de) 2015-05-08 2018-11-21 Henkel IP & Holding GmbH Sinterbare folien und pasten und verfahren zur verwendung davon
CN106398518A (zh) * 2016-08-31 2017-02-15 南方电网科学研究院有限责任公司 一种干式空心电抗器防护涂料及其制备方法和使用方法
WO2019023178A1 (en) 2017-07-28 2019-01-31 Avery Dennison Corporation PRESSURE-SENSITIVE ADHESIVES AND HYPERRAMIFIED SILSESQUIOXANE CORE ARTICLES AND METHODS OF MAKING SAME
US20200150564A1 (en) * 2017-10-13 2020-05-14 Hp Indigo B.V. Intermediate transfer member and method of production thereof
CN109812781B (zh) * 2017-11-21 2021-04-20 黄鸣 发光玻璃结构及其形成方法
JP7102267B2 (ja) * 2018-07-10 2022-07-19 リンテック株式会社 セラミックグリーンシート製造工程用剥離フィルム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3986997A (en) * 1974-06-25 1976-10-19 Dow Corning Corporation Pigment-free coating compositions
US4027073A (en) 1974-06-25 1977-05-31 Dow Corning Corporation Pigment-free coating compositions
US4585705A (en) 1983-11-09 1986-04-29 Dow Corning Corporation Hard organopolysiloxane release coating
US5665814A (en) 1995-05-04 1997-09-09 Abchem Manufacturing Low cost, blush-resistant silane/silica sol copolymer hardcoat for optical clear plastics
US5863595A (en) * 1996-10-04 1999-01-26 Dow Corning Corporation Thick ceramic coatings for electronic devices
US5856030A (en) 1996-12-30 1999-01-05 E.L. Specialists, Inc. Elastomeric electroluminescent lamp
JP2001260549A (ja) 2000-01-13 2001-09-25 Tdk Corp 印刷面保護フィルム
GB0208506D0 (en) 2002-04-12 2002-05-22 Dupont Teijin Films Us Ltd Film coating
US7563515B2 (en) * 2003-12-22 2009-07-21 Dow Corning Corporation Silicone compositions and their use in controlling the release or transfer of printed or molded patterns and transferring processes therefore
JP4507761B2 (ja) * 2004-08-20 2010-07-21 パナソニック株式会社 分散型ｅｌ素子およびそれを用いた照光式スイッチユニット
CN101044604B (zh) * 2004-08-31 2011-11-16 西雷克斯有限公司 新聚有机硅氧烷介电材料
JP2006202738A (ja) * 2004-12-21 2006-08-03 Sumitomo Metal Mining Co Ltd 分散型エレクトロルミネッセンス素子及びその製造方法
EP1940989B1 (de) 2005-09-29 2010-12-15 Dow Corning Corporation Verfahren zum abtrennen von hochtemperaturfilmen und/oder vorrichtungen von metallsubstraten

Also Published As

Publication number Publication date
CN101932666A (zh) 2010-12-29
TW200952579A (en) 2009-12-16
KR20100127767A (ko) 2010-12-06
US20100285233A1 (en) 2010-11-11
JP5389052B2 (ja) 2014-01-15
WO2009099484A1 (en) 2009-08-13
EP2242811B1 (de) 2011-09-14
JP2011511457A (ja) 2011-04-07
EP2242811A1 (de) 2010-10-27
TWI434631B (zh) 2014-04-11
US8318244B2 (en) 2012-11-27

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