ATE511212T1 - CIRCUIT ARRANGEMENT - Google Patents
CIRCUIT ARRANGEMENTInfo
- Publication number
- ATE511212T1 ATE511212T1 AT01130144T AT01130144T ATE511212T1 AT E511212 T1 ATE511212 T1 AT E511212T1 AT 01130144 T AT01130144 T AT 01130144T AT 01130144 T AT01130144 T AT 01130144T AT E511212 T1 ATE511212 T1 AT E511212T1
- Authority
- AT
- Austria
- Prior art keywords
- terminals
- circuit arrangement
- negative
- positive
- circuit board
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/14—Integrated circuits
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
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- H01L2924/19041—Component type being a capacitor
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Abstract
The circuit device (10) has a base body (12), incorporating at least one substrate (16) provided with electrical and/or electronic components connected to conductor paths, an intermediate circuit board (24) with at least one capacitor connected between positive and negative DC terminals (46,48), a clamping device and a driver circuit. The positive and negative DC terminals and AC terminals (20) of the intermediate circuit board each have contact elements for connection with the substrate conductor paths.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10127947A DE10127947C1 (en) | 2001-08-22 | 2001-06-08 | Circuit device for power semiconductor module has intermediate circuit board with DC and AC terminals coupled to conductor paths of substrate incorporated in base body |
DE10141114A DE10141114C1 (en) | 2001-06-08 | 2001-08-22 | Circuit device has AC terminal element of circuit substrate cooled via terminal pin of base body thermally connected to heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE511212T1 true ATE511212T1 (en) | 2011-06-15 |
Family
ID=7696231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01130144T ATE511212T1 (en) | 2001-06-08 | 2001-12-19 | CIRCUIT ARRANGEMENT |
Country Status (2)
Country | Link |
---|---|
AT (1) | ATE511212T1 (en) |
DE (1) | DE10127947C1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10134187B4 (en) * | 2001-07-13 | 2006-09-14 | Semikron Elektronik Gmbh & Co. Kg | Cooling device for semiconductor modules |
DE10159119B4 (en) * | 2001-12-01 | 2005-02-17 | Semikron Elektronik Gmbh | Inverter in pressure contact |
DE102005036105B3 (en) | 2005-08-01 | 2006-11-16 | Semikron Elektronik Gmbh & Co. Kg | Electrical component e.g. insulated gate bipolar transistor module, has knob projecting from base surface of bus bar, and fastening unit provided for fixed connection contacting of external bus bar unit to contact surface of knob |
DE102006006424B4 (en) * | 2006-02-13 | 2011-11-17 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with at least one power semiconductor module and a cooling component and associated manufacturing method |
DE102006006425B4 (en) * | 2006-02-13 | 2009-06-10 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module in pressure contact design |
DE102006006423B4 (en) | 2006-02-13 | 2009-06-10 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module and associated manufacturing method |
DE102006027481C5 (en) * | 2006-06-14 | 2012-11-08 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module with mutually electrically insulated connection elements |
DE102007007224B4 (en) | 2007-02-14 | 2009-06-10 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module with a housing |
DE102007026768A1 (en) | 2007-06-09 | 2008-12-11 | Semikron Elektronik Gmbh & Co. Kg | Pressure-contacted three-phase converter module |
DE102007054709B4 (en) | 2007-11-16 | 2014-11-13 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module with a substrate and with a printing device |
DE102008014112A1 (en) | 2008-03-13 | 2009-10-01 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module for use on cooling component, has contact elements with contact section exhibiting deformation turned away from other contact section and forming contact surface for contacting with paths |
DE102008014113B4 (en) | 2008-03-13 | 2014-04-03 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module in pressure contact design |
DE102008018793B3 (en) * | 2008-04-15 | 2009-11-12 | Semikron Elektronik Gmbh & Co. Kg | Arrangement in pressure contact design with a power semiconductor module |
DE102009024369B4 (en) | 2009-06-09 | 2011-12-29 | Semikron Elektronik Gmbh & Co. Kg | Power electronic system |
DE102011076325B4 (en) * | 2011-05-24 | 2016-05-04 | Semikron Elektronik Gmbh & Co. Kg | Cooling arrangement for a power electronic component with subsystems and a cooling device |
DE102011076324B4 (en) * | 2011-05-24 | 2014-04-10 | Semikron Elektronik Gmbh & Co. Kg | Power electronic system with connection means of first and second subsystems |
DE102011076323B4 (en) | 2011-05-24 | 2014-04-10 | Semikron Elektronik Gmbh & Co. Kg | Power electronic system with first and second subsystem |
DE102017129707A1 (en) | 2017-12-13 | 2019-06-13 | Semikron Elektronik Gmbh & Co. Kg | Method for producing a power electronic system |
DE102019115498B4 (en) * | 2019-06-07 | 2022-06-02 | Semikron Elektronik Gmbh & Co. Kg | Power electronic submodule with direct and alternating potential connection areas and arrangement herewith |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19522173C1 (en) * | 1995-06-19 | 1996-10-17 | Eupec Gmbh & Co Kg | Power semiconductor module |
DE10037533C1 (en) * | 2000-08-01 | 2002-01-31 | Semikron Elektronik Gmbh | Low-inductance circuit arrangement |
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2001
- 2001-06-08 DE DE10127947A patent/DE10127947C1/en not_active Expired - Lifetime
- 2001-12-19 AT AT01130144T patent/ATE511212T1/en active
Also Published As
Publication number | Publication date |
---|---|
DE10127947C1 (en) | 2002-10-17 |
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