ATE505284T1 - METHOD FOR OPERATING A WAVE SOLDERING SYSTEM USING PERFLOURED POLYETHER TO REACT WITH LEAD CONTAINED IMPURITIES - Google Patents

METHOD FOR OPERATING A WAVE SOLDERING SYSTEM USING PERFLOURED POLYETHER TO REACT WITH LEAD CONTAINED IMPURITIES

Info

Publication number
ATE505284T1
ATE505284T1 AT08846745T AT08846745T ATE505284T1 AT E505284 T1 ATE505284 T1 AT E505284T1 AT 08846745 T AT08846745 T AT 08846745T AT 08846745 T AT08846745 T AT 08846745T AT E505284 T1 ATE505284 T1 AT E505284T1
Authority
AT
Austria
Prior art keywords
solder
polyether
lead
bath
perfluoric
Prior art date
Application number
AT08846745T
Other languages
German (de)
Inventor
Dietmar Birgel
Franz Glatz
Original Assignee
Endress & Hauser Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress & Hauser Gmbh & Co Kg filed Critical Endress & Hauser Gmbh & Co Kg
Application granted granted Critical
Publication of ATE505284T1 publication Critical patent/ATE505284T1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

A method is described for operation of a wave soldering system which has a solder bath (1) filled with a lead-free solder (3), and during operation generates a solder wave (7) with which assemblies (9) passed in sequence over the solder wave (7) are soldered, with which the operating time of the system between two changes of the bath necessitated due to an enrichment of lead-containing impurities in the solder bath (1), can be increased significantly, in which perfluoric polyether (19) is added to the solder of the solder wave (7) flowing back into the solder bath (1), which has a boiling point above the solder temperature of the lead-free solder (3). The perfluoric polyether (19) binds to the solder at least a portion of the lead-containing impurities potentially produced during the soldering process, and the lead-containing impurities tied up in the perfluoric polyether (19) are removed from the solder bath (1), in that an upper layer of the solder bath containing the perfluoric polyether (19) with the lead-containing impurities tied up therein, is skimmed off.
AT08846745T 2007-11-09 2008-11-07 METHOD FOR OPERATING A WAVE SOLDERING SYSTEM USING PERFLOURED POLYETHER TO REACT WITH LEAD CONTAINED IMPURITIES ATE505284T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007053857A DE102007053857A1 (en) 2007-11-09 2007-11-09 Method for operating a wave soldering system
PCT/EP2008/065136 WO2009060068A1 (en) 2007-11-09 2008-11-07 Method for operation of a wave soldering system which uses perfluoric polyether for reaction with impurities containing lead

Publications (1)

Publication Number Publication Date
ATE505284T1 true ATE505284T1 (en) 2011-04-15

Family

ID=40307714

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08846745T ATE505284T1 (en) 2007-11-09 2008-11-07 METHOD FOR OPERATING A WAVE SOLDERING SYSTEM USING PERFLOURED POLYETHER TO REACT WITH LEAD CONTAINED IMPURITIES

Country Status (4)

Country Link
EP (1) EP2205391B1 (en)
AT (1) ATE505284T1 (en)
DE (2) DE102007053857A1 (en)
WO (1) WO2009060068A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009010159U1 (en) 2009-07-28 2010-12-30 Seho Systemtechnik Gmbh Soldering nozzle for a wave soldering device
DE102010038452A1 (en) 2010-07-27 2012-02-02 Robert Bosch Gmbh Conductor cross-section with tinning
DE112014006184A5 (en) * 2014-01-17 2016-10-06 Schaeffler Technologies AG & Co. KG A method for mutual electrical contacting at least one winding wire and a circuit board and actuator for a motor vehicle
DE102014117617B4 (en) 2014-12-01 2022-11-24 Seho Vermögensverwaltungs Gmbh & Co. Kg soldering device
DE102016124642B4 (en) 2016-12-16 2023-10-05 Seho Vermögensverwaltungs Gmbh & Co. Kg Method and device for soldering assemblies
DE102016124641A1 (en) 2016-12-16 2018-06-21 Seho Systemtechnik Gmbh soldering device
DE102018129201A1 (en) 2018-11-20 2020-05-20 Seho Systemtechnik Gmbh Method and device for measuring the height of a solder wave

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3665041A (en) * 1967-04-04 1972-05-23 Montedison Spa Perfluorinated polyethers and process for their preparation
CH607622A5 (en) 1976-02-20 1978-09-29 Schleuniger K Dr & Co Wave-soldering apparatus
US4360144A (en) * 1981-01-21 1982-11-23 Basf Wyandotte Corporation Printed circuit board soldering
IT1184362B (en) * 1985-03-06 1987-10-28 Montefluos Spa PROCEDURE FOR CARRYING OUT THE WELDING OF ELECTRONIC COMPONENTS ON A SUPPORT
DE19716709A1 (en) * 1997-04-21 1998-10-22 Helmut W Leicht Oxidation protection of molten solder
US6805282B2 (en) * 2000-09-26 2004-10-19 Matsushita Electric Industrial Co., Ltd. Flow soldering process and apparatus
DE102006032051B4 (en) 2006-07-10 2022-11-24 Endress+Hauser SE+Co. KG Wave soldering system for soldering electronic components on a printed circuit board

Also Published As

Publication number Publication date
WO2009060068A1 (en) 2009-05-14
EP2205391B1 (en) 2011-04-13
EP2205391A1 (en) 2010-07-14
DE502008003204D1 (en) 2011-05-26
DE102007053857A1 (en) 2009-05-14

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