ATE449434T1 - MICRO STRIP CONDUCT WAVE CONDUCT JUNCTION FOR MILLIMETER BOARD FORMED IN A MULTILAYER CIRCUIT BOARD - Google Patents
MICRO STRIP CONDUCT WAVE CONDUCT JUNCTION FOR MILLIMETER BOARD FORMED IN A MULTILAYER CIRCUIT BOARDInfo
- Publication number
- ATE449434T1 ATE449434T1 AT04425300T AT04425300T ATE449434T1 AT E449434 T1 ATE449434 T1 AT E449434T1 AT 04425300 T AT04425300 T AT 04425300T AT 04425300 T AT04425300 T AT 04425300T AT E449434 T1 ATE449434 T1 AT E449434T1
- Authority
- AT
- Austria
- Prior art keywords
- waveguide
- multilayer
- dielectric substrate
- conduct
- cavity
- Prior art date
Links
- 239000000523 sample Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 238000003780 insertion Methods 0.000 abstract 2
- 230000037431 insertion Effects 0.000 abstract 2
- 230000007704 transition Effects 0.000 abstract 2
- 230000001464 adherent effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000035515 penetration Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
Landscapes
- Waveguides (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
A microwave to waveguide transition is obtained in a multilayer structure comprising a 100 µm thick dielectric substrate (1) adherent to a rigid copper plate (15) 2 mm thick. The dielectric substrate is one of high-losses type suitable for PCB manufacturing techniques, such as Roger™ 4350. A metallic layout on the dielectric substrate includes a microstrip (2) terminating with a patch (3) acting as a probe inside the cavity of a rectangular waveguide WR15 (1.88 × 3.76 mm) operating in the EHF frequency range of 55-60 GHz (millimetric waves). The introduction of the probe inside the cavity (11) of the waveguide filled with air maintaining the continuity of the microstrip is a problem solved by properly working both the multilayer (1, 15) and the waveguide for a reciprocal penetration. More precisely, the multilayer is removed in correspondence of a window (5, 6) for the insertion of the waveguide (10), with the exception of a narrow central stripe (4) bearing the probe. Two opposite grooves (12, 13) are milled in the edge of the waveguide for the insertion of the stripe with the probe inside the cavity of the waveguide as far as the depth of the grooves allows it. A metallic lid (16) is screwed to the edge of the waveguide for reflecting back to the waveguide (10) the power radiated by the patch (3) in the opposite direction. The multilayer is fixed to the same metallic body which had been worked mechanically to obtain the waveguide. In order to prevent possible detachments of the thin dielectric substrate from the thick copper plate, a crown of metallized through holes is obtained around the edge of the waveguides emerging from the multilayer. The transition is part of a millimetric wave transceiver manufactured on a single multilayer accordingly to PCB, surface mount, and chip-on-board technologies (fig.5).
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04425300A EP1592081B1 (en) | 2004-04-29 | 2004-04-29 | Microstrip to waveguide transition for millimetric waves embodied in a multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE449434T1 true ATE449434T1 (en) | 2009-12-15 |
Family
ID=34932465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04425300T ATE449434T1 (en) | 2004-04-29 | 2004-04-29 | MICRO STRIP CONDUCT WAVE CONDUCT JUNCTION FOR MILLIMETER BOARD FORMED IN A MULTILAYER CIRCUIT BOARD |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1592081B1 (en) |
| AT (1) | ATE449434T1 (en) |
| DE (1) | DE602004024169D1 (en) |
| ES (1) | ES2334566T3 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007054355A1 (en) | 2005-11-14 | 2007-05-18 | Vega Grieshaber Kg | Waveguide junction |
| WO2008060047A1 (en) * | 2006-11-17 | 2008-05-22 | Electronics And Telecommunications Research Institute | Apparatus for transitioning millimeter wave between dielectric waveguide and transmission line |
| KR100846872B1 (en) | 2006-11-17 | 2008-07-16 | 한국전자통신연구원 | Apparatus for the transition of dielectric waveguide and transmission line in millimeter wave band |
| JP4365852B2 (en) | 2006-11-30 | 2009-11-18 | 株式会社日立製作所 | Waveguide structure |
| JP4648292B2 (en) | 2006-11-30 | 2011-03-09 | 日立オートモティブシステムズ株式会社 | Millimeter-wave transceiver and in-vehicle radar using the same |
| JP5115026B2 (en) * | 2007-03-22 | 2013-01-09 | 日立化成工業株式会社 | Triplate line-waveguide converter |
| CN104485500B (en) | 2009-02-27 | 2018-11-06 | 三菱电机株式会社 | Waveguide-microstrip line converter |
| US9270005B2 (en) | 2011-02-21 | 2016-02-23 | Siklu Communication ltd. | Laminate structures having a hole surrounding a probe for propagating millimeter waves |
| US9496593B2 (en) | 2011-02-21 | 2016-11-15 | Siklu Communication ltd. | Enhancing operation of laminate waveguide structures using an electrically conductive fence |
| RU2557472C1 (en) * | 2014-01-21 | 2015-07-20 | Общество с ограниченной ответственностью "КВЧ-Комплекс" | Waveguide adapter from metal waveguide to dielectric waveguide |
| US10135147B2 (en) | 2016-10-18 | 2018-11-20 | At&T Intellectual Property I, L.P. | Apparatus and methods for launching guided waves via an antenna |
| CN111403881A (en) * | 2020-04-29 | 2020-07-10 | 上海矽杰微电子有限公司 | Microstrip line-to-waveguide structure of broadband |
| CN112310587B (en) * | 2020-10-27 | 2022-02-01 | 华东光电集成器件研究所 | Waveguide output bearing device |
| CN112736394B (en) * | 2020-12-22 | 2021-09-24 | 电子科技大学 | H-plane waveguide probe transition structure for terahertz frequency band |
| CN118156757B (en) * | 2024-05-13 | 2024-07-23 | 成都雷电微力科技股份有限公司 | Suspension microstrip line transition structure of partial filling dielectric waveguide |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592402A (en) * | 1982-06-28 | 1984-01-09 | Hitachi Ltd | Converter of waveguide-microstrip line |
| JPH10126114A (en) * | 1996-10-23 | 1998-05-15 | Furukawa Electric Co Ltd:The | Feeder converter |
| EP0874415B1 (en) | 1997-04-25 | 2006-08-23 | Kyocera Corporation | High-frequency package |
| JP2001177312A (en) * | 1999-12-15 | 2001-06-29 | Hitachi Kokusai Electric Inc | High-frequency connection module |
| ATE379958T1 (en) | 2001-07-26 | 2007-12-15 | Siemens Spa Italiana | CIRCUIT BOARD AND CORRESPONDING PRODUCTION PROCESS FOR INSTALLING MICROWAVE CHIPS UP TO 80 GHZ |
| EP1367668A1 (en) | 2002-05-30 | 2003-12-03 | Siemens Information and Communication Networks S.p.A. | Broadband microstrip to waveguide transition on a multilayer printed circuit board |
-
2004
- 2004-04-29 ES ES04425300T patent/ES2334566T3/en not_active Expired - Lifetime
- 2004-04-29 DE DE602004024169T patent/DE602004024169D1/en not_active Expired - Lifetime
- 2004-04-29 EP EP04425300A patent/EP1592081B1/en not_active Expired - Lifetime
- 2004-04-29 AT AT04425300T patent/ATE449434T1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| ES2334566T3 (en) | 2010-03-12 |
| DE602004024169D1 (en) | 2009-12-31 |
| EP1592081A1 (en) | 2005-11-02 |
| EP1592081B1 (en) | 2009-11-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |