ATE440976T1 - Vorrichtung zur verhütung eines lichtbogens beim sputtern - Google Patents
Vorrichtung zur verhütung eines lichtbogens beim sputternInfo
- Publication number
- ATE440976T1 ATE440976T1 AT96915638T AT96915638T ATE440976T1 AT E440976 T1 ATE440976 T1 AT E440976T1 AT 96915638 T AT96915638 T AT 96915638T AT 96915638 T AT96915638 T AT 96915638T AT E440976 T1 ATE440976 T1 AT E440976T1
- Authority
- AT
- Austria
- Prior art keywords
- during sputtering
- arc during
- preventing arc
- sputtering
- target
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0203—Protection arrangements
- H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/437,816 US5616224A (en) | 1995-05-09 | 1995-05-09 | Apparatus for reducing the intensity and frequency of arcs which occur during a sputtering process |
PCT/US1996/006566 WO1996035821A1 (en) | 1995-05-09 | 1996-05-08 | Apparatus for reducing arcing during sputtering |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE440976T1 true ATE440976T1 (de) | 2009-09-15 |
Family
ID=23738016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT96915638T ATE440976T1 (de) | 1995-05-09 | 1996-05-08 | Vorrichtung zur verhütung eines lichtbogens beim sputtern |
Country Status (6)
Country | Link |
---|---|
US (1) | US5616224A (de) |
EP (1) | EP0824604B1 (de) |
JP (1) | JPH11504988A (de) |
AT (1) | ATE440976T1 (de) |
DE (1) | DE69638009D1 (de) |
WO (1) | WO1996035821A1 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6402902B1 (en) * | 1995-02-13 | 2002-06-11 | Deposition Sciences, Inc. | Apparatus and method for a reliable return current path for sputtering processes |
WO1996031899A1 (en) * | 1995-04-07 | 1996-10-10 | Advanced Energy Industries, Inc. | Adjustable energy quantum thin film plasma processing system |
JP4653263B2 (ja) * | 1996-12-23 | 2011-03-16 | オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト | 真空処理装置 |
JP3506949B2 (ja) | 1999-04-09 | 2004-03-15 | 松下電器産業株式会社 | 薄膜の製造方法、薄膜が形成された回転楕円体、及びこれを用いた電球と薄膜形成装置。 |
US6258218B1 (en) | 1999-10-22 | 2001-07-10 | Sola International Holdings, Ltd. | Method and apparatus for vacuum coating plastic parts |
US6440280B1 (en) * | 2000-06-28 | 2002-08-27 | Sola International, Inc. | Multi-anode device and methods for sputter deposition |
US6524455B1 (en) | 2000-10-04 | 2003-02-25 | Eni Technology, Inc. | Sputtering apparatus using passive arc control system and method |
JP2002363733A (ja) * | 2001-06-04 | 2002-12-18 | Nippon Sheet Glass Co Ltd | 被膜の形成方法 |
SE521095C2 (sv) * | 2001-06-08 | 2003-09-30 | Cardinal Cg Co | Förfarande för reaktiv sputtring |
US6500676B1 (en) | 2001-08-20 | 2002-12-31 | Honeywell International Inc. | Methods and apparatus for depositing magnetic films |
AU2003241958A1 (en) | 2002-05-31 | 2003-12-19 | Shibaura Mechatronics Corporation | Discharging power source, sputtering power source, and sputtering device |
US7147759B2 (en) * | 2002-09-30 | 2006-12-12 | Zond, Inc. | High-power pulsed magnetron sputtering |
US20040112735A1 (en) * | 2002-12-17 | 2004-06-17 | Applied Materials, Inc. | Pulsed magnetron for sputter deposition |
US6967305B2 (en) * | 2003-08-18 | 2005-11-22 | Mks Instruments, Inc. | Control of plasma transitions in sputter processing systems |
US6995545B2 (en) * | 2003-08-18 | 2006-02-07 | Mks Instruments, Inc. | Control system for a sputtering system |
EP1680527B1 (de) * | 2003-10-07 | 2012-03-21 | Deposition Sciences, Inc. | Vorrichtung und verfahren zur schnellen abscheidung von rutil-titandioxid |
US9123508B2 (en) * | 2004-02-22 | 2015-09-01 | Zond, Llc | Apparatus and method for sputtering hard coatings |
US7095179B2 (en) * | 2004-02-22 | 2006-08-22 | Zond, Inc. | Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities |
US7663319B2 (en) * | 2004-02-22 | 2010-02-16 | Zond, Inc. | Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities |
US7305311B2 (en) * | 2005-04-22 | 2007-12-04 | Advanced Energy Industries, Inc. | Arc detection and handling in radio frequency power applications |
US8217299B2 (en) * | 2007-02-22 | 2012-07-10 | Advanced Energy Industries, Inc. | Arc recovery without over-voltage for plasma chamber power supplies using a shunt switch |
US8044594B2 (en) * | 2008-07-31 | 2011-10-25 | Advanced Energy Industries, Inc. | Power supply ignition system and method |
US8395078B2 (en) | 2008-12-05 | 2013-03-12 | Advanced Energy Industries, Inc | Arc recovery with over-voltage protection for plasma-chamber power supplies |
EP2648209B1 (de) | 2009-02-17 | 2018-01-03 | Solvix GmbH | Energieversorgungsvorrichtung zur Plasmaverarbeitung |
US8349061B2 (en) | 2009-11-16 | 2013-01-08 | Cummins Filtration Ip Inc. | Combination relief valve and drainage mechanism requiring inserted element to permit drainage in a coalescer system |
US8552665B2 (en) | 2010-08-20 | 2013-10-08 | Advanced Energy Industries, Inc. | Proactive arc management of a plasma load |
DE102011081441B4 (de) | 2011-08-23 | 2018-12-06 | Fhr Anlagenbau Gmbh | Vorrichtung zum Sputtern von Substraten |
CN105576554B (zh) * | 2016-01-15 | 2020-08-28 | 中国电力科学研究院有限公司 | 特高压带电作业电位转移电流和电弧的控制装置及其方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4851095A (en) * | 1988-02-08 | 1989-07-25 | Optical Coating Laboratory, Inc. | Magnetron sputtering apparatus and process |
ATE147890T1 (de) * | 1991-05-31 | 1997-02-15 | Deposition Sciences Inc | Sputteranlage |
JP3269834B2 (ja) * | 1991-11-26 | 2002-04-02 | 旭硝子株式会社 | スパッタリング装置とスパッタリング方法 |
DE4202425C2 (de) * | 1992-01-29 | 1997-07-17 | Leybold Ag | Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten |
DE4230290A1 (de) * | 1992-09-10 | 1994-03-17 | Leybold Ag | Vorrichtung zum Erzeugen eines Plasmas mittels Kathodenzerstäubung und Mikrowelleneinstrahlung |
US5427669A (en) * | 1992-12-30 | 1995-06-27 | Advanced Energy Industries, Inc. | Thin film DC plasma processing system |
SG46607A1 (en) * | 1993-07-28 | 1998-02-20 | Asahi Glass Co Ltd | Method of an apparatus for sputtering |
DE4336830A1 (de) * | 1993-10-28 | 1995-05-04 | Leybold Ag | Plasma-Zerstäubungsanlage mit Mikrowellenunterstützung |
US6402902B1 (en) * | 1995-02-13 | 2002-06-11 | Deposition Sciences, Inc. | Apparatus and method for a reliable return current path for sputtering processes |
-
1995
- 1995-05-09 US US08/437,816 patent/US5616224A/en not_active Expired - Lifetime
-
1996
- 1996-05-08 DE DE69638009T patent/DE69638009D1/de not_active Expired - Lifetime
- 1996-05-08 EP EP96915638A patent/EP0824604B1/de not_active Expired - Lifetime
- 1996-05-08 WO PCT/US1996/006566 patent/WO1996035821A1/en active Search and Examination
- 1996-05-08 JP JP8534243A patent/JPH11504988A/ja active Pending
- 1996-05-08 AT AT96915638T patent/ATE440976T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0824604A4 (de) | 2001-06-13 |
EP0824604A1 (de) | 1998-02-25 |
EP0824604B1 (de) | 2009-08-26 |
WO1996035821A1 (en) | 1996-11-14 |
US5616224A (en) | 1997-04-01 |
DE69638009D1 (de) | 2009-10-08 |
JPH11504988A (ja) | 1999-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |