ATE438689T1 - Carbinolfunktionelle silikonharze oder anhydridfunktionelle silikonharze enthaltende formmassen - Google Patents

Carbinolfunktionelle silikonharze oder anhydridfunktionelle silikonharze enthaltende formmassen

Info

Publication number
ATE438689T1
ATE438689T1 AT05809997T AT05809997T ATE438689T1 AT E438689 T1 ATE438689 T1 AT E438689T1 AT 05809997 T AT05809997 T AT 05809997T AT 05809997 T AT05809997 T AT 05809997T AT E438689 T1 ATE438689 T1 AT E438689T1
Authority
AT
Austria
Prior art keywords
functional silicone
silicone resins
anhydride
silicone resin
compounds containing
Prior art date
Application number
AT05809997T
Other languages
German (de)
English (en)
Inventor
Glenn Gordon
Randall Schmidt
Gary Wieber
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of ATE438689T1 publication Critical patent/ATE438689T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
AT05809997T 2004-10-25 2005-10-20 Carbinolfunktionelle silikonharze oder anhydridfunktionelle silikonharze enthaltende formmassen ATE438689T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62178004P 2004-10-25 2004-10-25
PCT/US2005/037963 WO2006047318A1 (en) 2004-10-25 2005-10-20 Moldable compositions containing carbinol functional silicone reisins or anhydride functional silicone resins

Publications (1)

Publication Number Publication Date
ATE438689T1 true ATE438689T1 (de) 2009-08-15

Family

ID=35690365

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05809997T ATE438689T1 (de) 2004-10-25 2005-10-20 Carbinolfunktionelle silikonharze oder anhydridfunktionelle silikonharze enthaltende formmassen

Country Status (6)

Country Link
EP (1) EP1809701B1 (https=)
JP (1) JP2008518049A (https=)
CN (1) CN101048460B (https=)
AT (1) ATE438689T1 (https=)
DE (1) DE602005015884D1 (https=)
WO (1) WO2006047318A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101048464B (zh) * 2004-10-25 2011-04-20 陶氏康宁公司 含有醇官能的有机硅树脂或者酸酐官能的有机硅树脂的涂料组合物
JP4674112B2 (ja) * 2005-04-28 2011-04-20 出光興産株式会社 エポキシ樹脂組成物及びそれを用いた光学電子部材
CN100441649C (zh) * 2006-08-23 2008-12-10 领胜电子科技（深圳）有限公司 一种热熔粘接工艺
TWI422638B (zh) * 2009-08-25 2014-01-11 臺灣永光化學工業股份有限公司 含矽樹脂封裝組成物
WO2011043179A1 (ja) * 2009-10-07 2011-04-14 ステラケミファ株式会社 表面改質フィルム及びその製造方法、並びに積層フィルム及びその製造方法
CN103265704B (zh) * 2013-05-28 2015-12-23 卢儒 一种有机硅改性丙烯酸紫外光固化水性树脂及其制备方法
CN104371635A (zh) * 2014-10-31 2015-02-25 青岛昌安达药业有限公司 一种改进的热固型胶黏剂
US10738218B2 (en) * 2016-08-31 2020-08-11 Toray Industries, Inc. Polysiloxane, material for semiconductor, and preparation method for semiconductor and solar cell
CN115029100B (zh) * 2022-05-27 2023-07-18 湖北平安电工科技股份公司 一种热固化硬质云母板修补剂及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3927312A1 (de) * 1989-08-18 1991-02-21 Wacker Chemie Gmbh Anhydridfunktionelle organo(poly)siloxane, verfahren zu ihrer herstellung und verwendung dieser organo(poly)siloxane
US5814679A (en) * 1996-10-18 1998-09-29 General Electric Company Premium release photo-curable silicone compositions
US5939491A (en) * 1997-08-01 1999-08-17 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method

Also Published As

Publication number Publication date
EP1809701B1 (en) 2009-08-05
CN101048460A (zh) 2007-10-03
DE602005015884D1 (de) 2009-09-17
EP1809701A1 (en) 2007-07-25
WO2006047318A1 (en) 2006-05-04
JP2008518049A (ja) 2008-05-29
CN101048460B (zh) 2011-04-20

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Legal Events

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