ATE437559T1 - Verbesserte leiterplattenbaugruppe - Google Patents

Verbesserte leiterplattenbaugruppe

Info

Publication number
ATE437559T1
ATE437559T1 AT06727051T AT06727051T ATE437559T1 AT E437559 T1 ATE437559 T1 AT E437559T1 AT 06727051 T AT06727051 T AT 06727051T AT 06727051 T AT06727051 T AT 06727051T AT E437559 T1 ATE437559 T1 AT E437559T1
Authority
AT
Austria
Prior art keywords
pcb assembly
pcb
improved pcb
barbs
tabs
Prior art date
Application number
AT06727051T
Other languages
English (en)
Inventor
Craig Rochford
Original Assignee
Arka Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arka Technologies Ltd filed Critical Arka Technologies Ltd
Application granted granted Critical
Publication of ATE437559T1 publication Critical patent/ATE437559T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
AT06727051T 2005-05-27 2006-05-09 Verbesserte leiterplattenbaugruppe ATE437559T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0510925A GB2426633A (en) 2005-05-27 2005-05-27 Component securing means
PCT/GB2006/001688 WO2006125947A2 (en) 2005-05-27 2006-05-09 Improved printed circuit board assembly

Publications (1)

Publication Number Publication Date
ATE437559T1 true ATE437559T1 (de) 2009-08-15

Family

ID=34834798

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06727051T ATE437559T1 (de) 2005-05-27 2006-05-09 Verbesserte leiterplattenbaugruppe

Country Status (5)

Country Link
EP (1) EP1884150B1 (de)
AT (1) ATE437559T1 (de)
DE (1) DE602006007985D1 (de)
GB (1) GB2426633A (de)
WO (1) WO2006125947A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101052559B1 (ko) * 2011-02-25 2011-07-29 김선기 전자파 차폐 및 보호용 실드케이스
DE102014202359A1 (de) * 2014-02-10 2015-08-13 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Fixieren von Bauteilen
FR3076172B1 (fr) * 2017-12-21 2019-11-22 Continental Automotive France Dispositif electronique pour la determination de la position angulaire d'un arbre d'un vehicule automobile

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3642151A1 (de) * 1986-12-10 1988-06-23 Philips Patentverwaltung Deckelkontaktierung an einem gehaeuse eines hf- oder zf-bausteines
US5579212A (en) * 1993-07-29 1996-11-26 Sun Microsystems, Inc. Protective cover for a silicon chip device and method relating thereto
EP0755177B1 (de) * 1995-07-21 1999-01-20 Molex Incorporated Abschirmdeckel mit zugehörigem Abschirmverfahren
DE29515035U1 (de) * 1995-09-20 1996-01-11 Siegfried Schaal Metallveredel Abdeckkappe für elektronische Bauteile
US6239359B1 (en) * 1999-05-11 2001-05-29 Lucent Technologies, Inc. Circuit board RF shielding
NL1016549C2 (nl) * 2000-10-06 2002-04-10 Stork Screens Bv Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
US6377475B1 (en) * 2001-02-26 2002-04-23 Gore Enterprise Holdings, Inc. Removable electromagnetic interference shield
FR2838914B1 (fr) * 2002-04-18 2004-05-28 Siemens Vdo Automotive Dispositif de protection de composants electroniques
GB2404089B (en) * 2003-07-11 2007-05-02 Craig Rochford Printed circuit board assembly

Also Published As

Publication number Publication date
EP1884150B1 (de) 2009-07-22
WO2006125947A3 (en) 2007-03-22
DE602006007985D1 (de) 2009-09-03
GB2426633A (en) 2006-11-29
WO2006125947A2 (en) 2006-11-30
EP1884150A2 (de) 2008-02-06
GB0510925D0 (en) 2005-07-06

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties