ATE428101T1 - Eine komponentenbestuckungseinheit und ein komponentenbestuckungsgerat welches eine solche komponentenbestuckungseinheit beinhaltet - Google Patents

Eine komponentenbestuckungseinheit und ein komponentenbestuckungsgerat welches eine solche komponentenbestuckungseinheit beinhaltet

Info

Publication number
ATE428101T1
ATE428101T1 AT07075159T AT07075159T ATE428101T1 AT E428101 T1 ATE428101 T1 AT E428101T1 AT 07075159 T AT07075159 T AT 07075159T AT 07075159 T AT07075159 T AT 07075159T AT E428101 T1 ATE428101 T1 AT E428101T1
Authority
AT
Austria
Prior art keywords
component placement
component
placement unit
nozzle
sensor
Prior art date
Application number
AT07075159T
Other languages
English (en)
Inventor
Joseph Louis Horijon
Original Assignee
Assembleon Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL1031471A external-priority patent/NL1031471C2/nl
Application filed by Assembleon Bv filed Critical Assembleon Bv
Application granted granted Critical
Publication of ATE428101T1 publication Critical patent/ATE428101T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
AT07075159T 2006-03-30 2007-02-27 Eine komponentenbestuckungseinheit und ein komponentenbestuckungsgerat welches eine solche komponentenbestuckungseinheit beinhaltet ATE428101T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1031471A NL1031471C2 (nl) 2006-03-30 2006-03-30 Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.
NL1033000A NL1033000C2 (nl) 2006-03-30 2006-12-05 Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.

Publications (1)

Publication Number Publication Date
ATE428101T1 true ATE428101T1 (de) 2009-04-15

Family

ID=38055201

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07075159T ATE428101T1 (de) 2006-03-30 2007-02-27 Eine komponentenbestuckungseinheit und ein komponentenbestuckungsgerat welches eine solche komponentenbestuckungseinheit beinhaltet

Country Status (7)

Country Link
US (1) US7941913B2 (de)
EP (1) EP1840503B1 (de)
KR (1) KR101307768B1 (de)
AT (1) ATE428101T1 (de)
DE (1) DE602007000832D1 (de)
NL (1) NL1033000C2 (de)
TW (1) TW200746943A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1036507C2 (nl) 2009-02-03 2010-08-04 Assembleon Bv Inrichting geschikt voor het met behulp van een sensor vervaardigen van een afbeelding, alsmede componentplaatsingseenheid voorzien van een dergelijke inrichting.
NL1033000C2 (nl) 2006-03-30 2007-08-21 Assembleon Nv Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.
NL1036120C (nl) 2008-10-28 2010-04-29 Assembleon Bv Verplaatsingsinrichting.
EP2343165A1 (de) * 2010-01-07 2011-07-13 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO System und Verfahren zum Aufnehmen und Platzieren von Chips
CH711570B1 (de) 2015-09-28 2019-02-15 Besi Switzerland Ag Vorrichtung für die Montage von Bauelementen auf einem Substrat.
US10517199B2 (en) * 2015-12-17 2019-12-24 Assembléon B.V. Methods of positioning a component in a desired position on a board, pick and place machines, and sensors for such pick and place machines
CN105651179B (zh) * 2016-03-16 2018-07-27 苏州富强科技有限公司 一种补光可调且自动装夹的视觉成像测量系统
CN105806252B (zh) * 2016-03-16 2018-07-27 苏州富强科技有限公司 一种补光可调且可自动上下料的视觉成像测量系统
KR102236269B1 (ko) * 2018-05-09 2021-04-05 한화정밀기계 주식회사 부품 실장 장치
US11428880B2 (en) * 2020-07-31 2022-08-30 Openlight Photonics, Inc. Optical based placement of an optical compontent using a pick and place machine

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114230A (en) * 1979-09-07 1992-05-19 Diffracto Ltd. Electro-optical inspection
JPS60103700A (ja) * 1983-11-11 1985-06-07 株式会社日立製作所 部品の位置決め装置
JPS6150002A (ja) * 1984-08-20 1986-03-12 Matsushita Electric Ind Co Ltd 相対位置検出装置
GB2183820A (en) 1985-11-09 1987-06-10 Dynapert Precima Ltd Electronic component placement
NL9300631A (nl) * 1993-04-14 1994-11-01 Hans Gerard Van Den Brink Optisch systeem voor het onderling positioneren van een sporendrager en component met aansluitpootjes.
JPH0715171A (ja) * 1993-06-28 1995-01-17 Matsushita Electric Ind Co Ltd 部品装着装置
US5559727A (en) * 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
KR100367272B1 (ko) * 1994-08-11 2003-03-15 사이버옵틱스 코포레이션 부품정렬센서및부품검출시스템
KR100287787B1 (ko) * 1998-09-24 2001-04-16 이중구 부품위치정렬장치및이를이용한정렬방법
GB2347499A (en) * 1998-11-03 2000-09-06 Cyberoptics Corp Tomographic reconstruction of electronic components from shadow image sensor data
EP1547780A4 (de) * 2002-09-30 2012-01-25 Sony Corp Verfahren und vorrichtung zur positionierung von elektronischen bauteilen
CN1736135A (zh) * 2003-01-14 2006-02-15 皇家飞利浦电子股份有限公司 适用于将部件放置在基底上的设备及其方法
NL1033000C2 (nl) 2006-03-30 2007-08-21 Assembleon Nv Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.

Also Published As

Publication number Publication date
DE602007000832D1 (de) 2009-05-20
EP1840503B1 (de) 2009-04-08
TW200746943A (en) 2007-12-16
KR101307768B1 (ko) 2013-09-12
KR20070098697A (ko) 2007-10-05
NL1033000C2 (nl) 2007-08-21
US20070229851A1 (en) 2007-10-04
EP1840503A1 (de) 2007-10-03
US7941913B2 (en) 2011-05-17
NL1033000A1 (nl) 2007-03-27

Similar Documents

Publication Publication Date Title
ATE428101T1 (de) Eine komponentenbestuckungseinheit und ein komponentenbestuckungsgerat welches eine solche komponentenbestuckungseinheit beinhaltet
EP1708278A3 (de) Optisches Anordnungsmodul, Linsenhalter und Verfahren zur Herstellung
EP2458844A3 (de) Abbildungsvorrichtung
WO2007097841A3 (en) Portable coordinate measurement machine with integrated line laser scanner
EP2100908A4 (de) Wärmehärtbare harzzusammensetzung für die lichtreflexion, verfahren zur herstellung der harzzusammensetzung und montagesubstrat für optisches halbleiterlelement und optisches halbleiterelement unter verwendung der harzzusammensetzung
FR2887517B1 (fr) Dispositif de direction a encombrement reduit pour atterrisseur d'aeronef
WO2004048881A3 (de) Messeinrichtung zur optischen untersuchung eines testelements
DE602005018881D1 (de) Lichtemittierende Vorrichtung mit optischer Resonanzschicht
DE102005018773A8 (de) Vorrichtung zur Sicht der Umgebung eines Fahrzeugs
ATE410354T1 (de) Einparkvorrichtung
ATE555389T1 (de) Laborroboteranordnung
TW200707133A (en) Lithographic apparatus and positioning apparatus
WO2008083672A3 (de) Gehäuse für optoelektronisches bauelement und anordnung eines optoelektronischen bauelementes in einem gehäuse
EP1688985A3 (de) Integriertes analytisches Gerät
TW200712597A (en) Optical module of a light source module and a sensor module positioned on a frame
TW200727501A (en) Image sensor module and method for manufacturing the same
WO2008102771A1 (ja) サーバ装置
FR2883154B1 (fr) Dispositif de mesure du teint
FR2896871B1 (fr) Dispositif de mesure pour la mesure optique d'un objet.
EP2863190A3 (de) Optisches Sensormodul
DE502006002052D1 (de) Vorrichtung zum Verschrauben zweier Bauteile mit Toleranzausgleich
WO2009127337A3 (de) Mikroskop mit haltefokuseinheit
WO2007027960A3 (en) Substrate alignment using linear array sensor
WO2009041003A1 (ja) 検査装置及び検査方法
FR2885221B1 (fr) Camera d'examen photothermique a dispositif de reglage de l'offset.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties