ATE421128T1 - Modul mit leiterrahmen mit auf beiden seiten bestückte n bauelementen - Google Patents

Modul mit leiterrahmen mit auf beiden seiten bestückte n bauelementen

Info

Publication number
ATE421128T1
ATE421128T1 AT01982364T AT01982364T ATE421128T1 AT E421128 T1 ATE421128 T1 AT E421128T1 AT 01982364 T AT01982364 T AT 01982364T AT 01982364 T AT01982364 T AT 01982364T AT E421128 T1 ATE421128 T1 AT E421128T1
Authority
AT
Austria
Prior art keywords
module
lead frame
sides
ladder frame
electrical components
Prior art date
Application number
AT01982364T
Other languages
English (en)
Inventor
Gunter Aflenzer
Joachim Schober
Marcus Toth
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE421128T1 publication Critical patent/ATE421128T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Lock And Its Accessories (AREA)
  • Near-Field Transmission Systems (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Selective Calling Equipment (AREA)
AT01982364T 2000-10-11 2001-09-26 Modul mit leiterrahmen mit auf beiden seiten bestückte n bauelementen ATE421128T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00890308 2000-10-11

Publications (1)

Publication Number Publication Date
ATE421128T1 true ATE421128T1 (de) 2009-01-15

Family

ID=8175973

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01982364T ATE421128T1 (de) 2000-10-11 2001-09-26 Modul mit leiterrahmen mit auf beiden seiten bestückte n bauelementen

Country Status (6)

Country Link
US (1) US6643142B2 (de)
EP (1) EP1327226B1 (de)
JP (1) JP2004511903A (de)
AT (1) ATE421128T1 (de)
DE (1) DE60137440D1 (de)
WO (1) WO2002031763A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100371A (ja) * 2001-09-19 2003-04-04 Matsushita Electric Ind Co Ltd 端子付き配線基板
DE102006028815B3 (de) * 2006-06-21 2007-08-30 Hansa Tronic Gmbh Verfahren zur Herstellung eines elektrischen Hybridbauteils

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2641102B1 (de) 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
US4928387A (en) * 1989-09-07 1990-05-29 Rockwell International Corp. Temporary soldering aid for manufacture of printed wiring assemblies
JP2850640B2 (ja) * 1992-04-28 1999-01-27 株式会社デンソー 混成集積回路装置
US5583372A (en) * 1994-09-14 1996-12-10 Micron Technology, Inc. Adhesion enhanced semiconductor die for mold compound packaging
US6005778A (en) * 1995-06-15 1999-12-21 Honeywell Inc. Chip stacking and capacitor mounting arrangement including spacers
DE19640260A1 (de) 1996-09-30 1998-04-02 Siemens Ag Kontaktlose Chipkarte
JPH10104101A (ja) * 1996-10-02 1998-04-24 Mitsubishi Electric Corp 半導体圧力センサ
JP3278363B2 (ja) * 1996-11-18 2002-04-30 三菱電機株式会社 半導体加速度センサ
KR100226737B1 (ko) * 1996-12-27 1999-10-15 구본준 반도체소자 적층형 반도체 패키지
SG88741A1 (en) * 1998-09-16 2002-05-21 Texas Instr Singapore Pte Ltd Multichip assembly semiconductor
JP2002533915A (ja) 1998-12-22 2002-10-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ チップと完全に包囲された接続手段と、を有するデータ保持器
US6313998B1 (en) * 1999-04-02 2001-11-06 Legacy Electronics, Inc. Circuit board assembly having a three dimensional array of integrated circuit packages

Also Published As

Publication number Publication date
WO2002031763A1 (en) 2002-04-18
US6643142B2 (en) 2003-11-04
US20020075663A1 (en) 2002-06-20
JP2004511903A (ja) 2004-04-15
EP1327226A1 (de) 2003-07-16
DE60137440D1 (de) 2009-03-05
EP1327226B1 (de) 2009-01-14

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties