ATE39787T1 - Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen. - Google Patents

Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen.

Info

Publication number
ATE39787T1
ATE39787T1 AT83104871T AT83104871T ATE39787T1 AT E39787 T1 ATE39787 T1 AT E39787T1 AT 83104871 T AT83104871 T AT 83104871T AT 83104871 T AT83104871 T AT 83104871T AT E39787 T1 ATE39787 T1 AT E39787T1
Authority
AT
Austria
Prior art keywords
cooling
integrated components
form flat
components combined
flat assemblies
Prior art date
Application number
AT83104871T
Other languages
German (de)
English (en)
Inventor
Herrmann Dipl-Ing Wessely
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of ATE39787T1 publication Critical patent/ATE39787T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT83104871T 1982-09-09 1983-05-17 Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen. ATE39787T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3233522 1982-09-09
EP83104871A EP0103067B1 (de) 1982-09-09 1983-05-17 Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen

Publications (1)

Publication Number Publication Date
ATE39787T1 true ATE39787T1 (de) 1989-01-15

Family

ID=6172841

Family Applications (1)

Application Number Title Priority Date Filing Date
AT83104871T ATE39787T1 (de) 1982-09-09 1983-05-17 Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen.

Country Status (5)

Country Link
US (1) US4517624A (enExample)
EP (1) EP0103067B1 (enExample)
JP (1) JPS5955040A (enExample)
AT (1) ATE39787T1 (enExample)
DE (1) DE3378870D1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2567324B1 (fr) * 1984-07-06 1986-11-28 Telemecanique Electrique Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique
US4709301A (en) * 1985-09-05 1987-11-24 Nec Corporation Package
US4658330A (en) * 1985-09-09 1987-04-14 Tektronix, Inc. Mounting a hybrid circuit to a circuit board
US4658331A (en) * 1985-09-09 1987-04-14 Tektronix, Inc. Mounting an integrated circuit chip to an etched circuit board
US4762677A (en) * 1987-11-03 1988-08-09 Allied-Signal Inc. Method of preparing a bulk amorphous metal article
US4908736A (en) * 1987-12-04 1990-03-13 General Electric Company Self packaging chip mount
US4796156A (en) * 1987-12-04 1989-01-03 General Electric Company Self packaging chip mount
US4851856A (en) * 1988-02-16 1989-07-25 Westinghouse Electric Corp. Flexible diaphragm cooling device for microwave antennas
GB2236213A (en) * 1989-09-09 1991-03-27 Ibm Integral protective enclosure for an assembly mounted on a flexible printed circuit board
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5065280A (en) * 1990-08-30 1991-11-12 Hewlett-Packard Company Flex interconnect module
DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
US8213431B2 (en) * 2008-01-18 2012-07-03 The Boeing Company System and method for enabling wireless real time applications over a wide area network in high signal intermittence environments
EP0608418B1 (en) * 1992-05-20 1998-11-04 Seiko Epson Corporation Cartridge for electronic apparatus
US5267867A (en) * 1992-09-11 1993-12-07 Digital Equipment Corporation Package for multiple removable integrated circuits
US5305185A (en) * 1992-09-30 1994-04-19 Samarov Victor M Coplanar heatsink and electronics assembly
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
US5430611A (en) * 1993-07-06 1995-07-04 Hewlett-Packard Company Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
DE4337866A1 (de) * 1993-11-05 1995-05-11 Siemens Ag Steuergerät, insbesondere für ein Kraftfahrzeug
DE19701731A1 (de) * 1997-01-20 1998-07-23 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
DE19852355A1 (de) * 1998-11-13 1999-12-16 Bosch Gmbh Robert Schaltungsanordnung
US7679917B2 (en) * 2007-02-02 2010-03-16 Deck Joseph F Electronic assembly cooling

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3896544A (en) * 1973-01-15 1975-07-29 Essex International Inc Method of making resilient electrical contact assembly for semiconductor devices
US4104728A (en) * 1973-06-06 1978-08-01 Sharp Kabushiki Kaisha Electronic apparatus equipped on a flexible substratum
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
NL7704773A (nl) * 1977-05-02 1978-11-06 Philips Nv Hybrideschakeling voorzien van een halfgeleider- schakeling.
US4167771A (en) * 1977-06-16 1979-09-11 International Business Machines Corporation Thermal interface adapter for a conduction cooling module
US4153107A (en) * 1977-06-30 1979-05-08 International Business Machines Corporation Temperature equalizing element for a conduction cooling module
JPS55121654A (en) * 1979-03-13 1980-09-18 Toshiba Corp Compression bonded semiconductor device

Also Published As

Publication number Publication date
JPS5955040A (ja) 1984-03-29
EP0103067A2 (de) 1984-03-21
JPS6323660B2 (enExample) 1988-05-17
DE3378870D1 (en) 1989-02-09
EP0103067B1 (de) 1989-01-04
EP0103067A3 (en) 1986-03-12
US4517624A (en) 1985-05-14

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee