ATE375070T1 - Dünnfilm-herstellungstechnik für implantierbare elektroden - Google Patents

Dünnfilm-herstellungstechnik für implantierbare elektroden

Info

Publication number
ATE375070T1
ATE375070T1 AT96900778T AT96900778T ATE375070T1 AT E375070 T1 ATE375070 T1 AT E375070T1 AT 96900778 T AT96900778 T AT 96900778T AT 96900778 T AT96900778 T AT 96900778T AT E375070 T1 ATE375070 T1 AT E375070T1
Authority
AT
Austria
Prior art keywords
thin film
production technology
film production
implantable electrodes
wires
Prior art date
Application number
AT96900778T
Other languages
English (en)
Inventor
John Parker
Claudiu Treaba
Original Assignee
Cochlear Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cochlear Ltd filed Critical Cochlear Ltd
Application granted granted Critical
Publication of ATE375070T1 publication Critical patent/ATE375070T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A61N1/0526—Head electrodes
    • A61N1/0541—Cochlear electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
AT96900778T 1996-01-31 1996-01-31 Dünnfilm-herstellungstechnik für implantierbare elektroden ATE375070T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/AU1996/000043 WO1997028668A1 (en) 1996-01-31 1996-01-31 Thin film fabrication technique for implantable electrodes
CA002246057A CA2246057C (en) 1996-01-31 1996-01-31 Thin film fabrication technique for implantable electrodes
US08/641,537 US5720099A (en) 1996-01-31 1996-05-01 Thin film fabrication technique for implantable electrodes

Publications (1)

Publication Number Publication Date
ATE375070T1 true ATE375070T1 (de) 2007-10-15

Family

ID=27156918

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96900778T ATE375070T1 (de) 1996-01-31 1996-01-31 Dünnfilm-herstellungstechnik für implantierbare elektroden

Country Status (6)

Country Link
US (1) US5720099A (de)
EP (1) EP0888701B1 (de)
AT (1) ATE375070T1 (de)
AU (1) AU714520B2 (de)
CA (1) CA2246057C (de)
WO (1) WO1997028668A1 (de)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312374A (ja) 1996-05-24 1997-12-02 Sony Corp 半導体パッケージ及びその製造方法
US6129753A (en) * 1998-03-27 2000-10-10 Advanced Bionics Corporation Cochlear electrode array with electrode contacts on medial side
JPH1140595A (ja) * 1997-07-16 1999-02-12 Mitsubishi Electric Corp ワイヤ配線方法、このワイヤ配線方法に使用する配線分岐パッド、および、ボンディング装置、並びに、ワイヤ配線方法をコンピュータに実行させるためのプログラムを記録したコンピュータ読み取り可能な記録媒体
US6212434B1 (en) 1998-07-22 2001-04-03 Cardiac Pacemakers, Inc. Single pass lead system
US6501994B1 (en) 1997-12-24 2002-12-31 Cardiac Pacemakers, Inc. High impedance electrode tip
US6463334B1 (en) 1998-11-02 2002-10-08 Cardiac Pacemakers, Inc. Extendable and retractable lead
US6501990B1 (en) 1999-12-23 2002-12-31 Cardiac Pacemakers, Inc. Extendable and retractable lead having a snap-fit terminal connector
AU5489799A (en) * 1998-08-19 2000-03-14 Wisconsin Alumni Research Foundation Sealed capacitive pressure sensors
US6862805B1 (en) * 1998-08-26 2005-03-08 Advanced Bionics Corporation Method of making a cochlear electrode array having current-focusing and tissue-treating features
CN1150596C (zh) * 1999-03-12 2004-05-19 加利福尼亚技术学院 形成聚对二甲苯mems的方法和器件
US6391220B1 (en) 1999-08-18 2002-05-21 Fujitsu Limited, Inc. Methods for fabricating flexible circuit structures
US6782619B2 (en) 2001-08-17 2004-08-31 Advanced Cochlear Systems, Inc. Method of making high contact density electrode array
AU2002325055A1 (en) * 2001-09-28 2003-04-14 Otologics Llc Implantable hearing aid with improved sealing
WO2004009176A1 (en) * 2002-07-19 2004-01-29 Arizona Board Of Regents Acting For And On Behalf Of Arizona State University Implantable electrode with flexible region to accommodate micro-movement
US8380326B2 (en) * 2002-08-09 2013-02-19 Second Sight Medical Products, Inc. Insulated implantable electrical circuit
EP1428551A1 (de) * 2002-12-13 2004-06-16 W.C. Heraeus GmbH & Co. KG Stimulationselektrode, sowie deren Herstellung und Verwendung
ES2211325B1 (es) * 2002-12-18 2005-12-16 Instituto Cientifico Y Tecnologico De Navarra, S.A. Guia portadora de electrodos, especialmente para implantes cocleares, implante coclear provisto de dicha guia, y procedimiento de fabricacion de guias portadoras de electrodos.
AU2003900773A0 (en) * 2003-02-21 2003-03-13 Cochlear Limited Telescopic array for a cochlear implant
US8229574B2 (en) * 2003-02-21 2012-07-24 Cochlear Limited Telescopic electrode array
US20050021117A1 (en) * 2003-07-21 2005-01-27 Jiping He Flexible integrated head-stage for neural interface
DE10360624B4 (de) * 2003-12-19 2007-05-03 W.C. Heraeus Gmbh Elektrodenstruktur, Verfahren zu ihrer Herstellung und ihre Verwendung
US7245973B2 (en) 2003-12-23 2007-07-17 Cardiac Pacemakers, Inc. His bundle mapping, pacing, and injection lead
US20060052856A1 (en) * 2004-09-08 2006-03-09 Kim Daniel H Stimulation components
US8010192B2 (en) 2004-12-20 2011-08-30 Cardiac Pacemakers, Inc. Endocardial pacing relating to conduction abnormalities
US8010191B2 (en) 2004-12-20 2011-08-30 Cardiac Pacemakers, Inc. Systems, devices and methods for monitoring efficiency of pacing
AR047851A1 (es) * 2004-12-20 2006-03-01 Giniger Alberto German Un nuevo marcapasos que restablece o preserva la conduccion electrica fisiologica del corazon y un metodo de aplicacion
US8326423B2 (en) 2004-12-20 2012-12-04 Cardiac Pacemakers, Inc. Devices and methods for steering electrical stimulation in cardiac rhythm management
US8290586B2 (en) 2004-12-20 2012-10-16 Cardiac Pacemakers, Inc. Methods, devices and systems for single-chamber pacing using a dual-chamber pacing device
US8423139B2 (en) 2004-12-20 2013-04-16 Cardiac Pacemakers, Inc. Methods, devices and systems for cardiac rhythm management using an electrode arrangement
US8005544B2 (en) 2004-12-20 2011-08-23 Cardiac Pacemakers, Inc. Endocardial pacing devices and methods useful for resynchronization and defibrillation
EP1944056A4 (de) * 2005-09-26 2010-12-15 Jms Co Ltd Myokardiale elektrode
CN101583309B (zh) * 2005-10-07 2012-07-04 神经连结科技公司 模块化多通道微电极阵列及其制造方法
US20070123963A1 (en) * 2005-11-29 2007-05-31 Peter Krulevitch Method for producing flexible, stretchable, and implantable high-density microelectrode arrays
DE102006017549A1 (de) * 2006-04-13 2007-10-18 Imi Intelligent Medical Implants Ag Verfahren zur Herstellung von Implantatstrukturen zur Kontaktierung oder Elektrostimulation von lebenden Gewebezellen oder Nerven
US20080027524A1 (en) * 2006-07-26 2008-01-31 Maschino Steven E Multi-electrode assembly for an implantable medical device
AU2007329252A1 (en) * 2006-12-06 2008-06-12 Spinal Modulation, Inc. Hard tissue anchors and delivery devices
CA2671575A1 (en) * 2006-12-06 2008-06-12 Spinal Modulation, Inc. Grouped leads for spinal stimulation
WO2008070808A2 (en) 2006-12-06 2008-06-12 Spinal Modulation, Inc. Expandable stimulation leads and methods of use
WO2008070807A2 (en) 2006-12-06 2008-06-12 Spinal Modulation, Inc. Delivery devices, systems and methods for stimulating nerve tissue on multiple spinal levels
US9314618B2 (en) * 2006-12-06 2016-04-19 Spinal Modulation, Inc. Implantable flexible circuit leads and methods of use
US8731673B2 (en) 2007-02-26 2014-05-20 Sapiens Steering Brain Stimulation B.V. Neural interface system
US8958862B2 (en) 2007-10-17 2015-02-17 Neuronexus Technologies, Inc. Implantable device including a resorbable carrier
WO2009052423A1 (en) * 2007-10-17 2009-04-23 Neuronexus Technologies Three-dimensional system of electrode leads
US8224417B2 (en) 2007-10-17 2012-07-17 Neuronexus Technologies, Inc. Guide tube for an implantable device system
US8250745B1 (en) 2008-01-24 2012-08-28 Advanced Bionics, Llc Process for manufacturing a microcircuit cochlear electrode array
WO2009111334A2 (en) * 2008-02-29 2009-09-11 Otologics, Llc Improved bi-modal cochlea stimulation
US8498720B2 (en) * 2008-02-29 2013-07-30 Neuronexus Technologies, Inc. Implantable electrode and method of making the same
US20090287277A1 (en) * 2008-05-19 2009-11-19 Otologics, Llc Implantable neurostimulation electrode interface
WO2010005627A1 (en) * 2008-06-20 2010-01-14 Cochlear Americas Strain relief in an implantable electrode assembly
US20100069997A1 (en) * 2008-09-16 2010-03-18 Otologics, Llc Neurostimulation apparatus
AU2009293507B2 (en) * 2008-09-17 2015-03-12 Saluda Medical Pty Limited Knitted electrode assembly for an active implantable medical device
WO2010071849A2 (en) 2008-12-19 2010-06-24 Action Medical, Inc. Devices, methods, and systems including cardiac pacing
AU2009344195A1 (en) * 2009-04-08 2011-12-01 Saluda Medical Pty Limited Stitched components of an active implantable medical device
US9044588B2 (en) * 2009-04-16 2015-06-02 Cochlear Limited Reference electrode apparatus and method for neurostimulation implants
WO2010121240A2 (en) * 2009-04-17 2010-10-21 Otologics, Llc Neurostimulation electrode array and method of manufacture
WO2010138911A1 (en) 2009-05-29 2010-12-02 Otologics, Llc Implantable auditory stimulation system and method with offset implanted microphones
US8332046B2 (en) * 2009-10-16 2012-12-11 Neuronexus Technologies, Inc. Neural interface system
US8283569B2 (en) 2010-01-22 2012-10-09 The Regents Of The University Of Michigan Electrode array and method of fabrication
FR2957523B1 (fr) * 2010-03-18 2012-04-27 Dixi Microtechniques Procede de fabrication d'une electrode a usage medical et electrode obtenue par la mise en oeuvre de ce procede
US8332052B1 (en) 2010-03-18 2012-12-11 Advanced Bionics Microcircuit cochlear electrode array and method of manufacture
US8565880B2 (en) 2010-04-27 2013-10-22 Cardiac Pacemakers, Inc. His-bundle capture verification and monitoring
US8525340B2 (en) 2010-06-11 2013-09-03 Premitec, Inc. Flexible electronic devices and related methods
CA2802265C (en) * 2010-06-30 2015-10-20 Med-El Elektromedizinische Geraete Gmbh Helical core ear implant electrode
US9155861B2 (en) 2010-09-20 2015-10-13 Neuronexus Technologies, Inc. Neural drug delivery system with fluidic threads
WO2012154256A1 (en) * 2011-02-17 2012-11-15 Advanced Bionics Ag Wire constructs
US9498617B2 (en) * 2012-06-19 2016-11-22 Lawrence Livermore National Security, Llc Conformally encapsulated multi-electrode arrays with seamless insulation
US11071869B2 (en) 2016-02-24 2021-07-27 Cochlear Limited Implantable device having removable portion
WO2018015384A1 (en) 2016-07-18 2018-01-25 Cortec Gmbh Elastic neural electrode and method for fabricating the same
KR102256241B1 (ko) * 2019-07-25 2021-05-27 한국과학기술연구원 전단 및 수직 응력 감지 센서 및 이의 제조 방법
CN111053554A (zh) * 2019-11-28 2020-04-24 开封市学国生物科技有限公司 一种超微柔性线性深部脑电极

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3345990A1 (de) * 1983-12-20 1985-06-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen einer implantierbaren elektrode
US4665468A (en) * 1984-07-10 1987-05-12 Nec Corporation Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same
DE3671535D1 (de) * 1985-09-04 1990-06-28 Yves Lacaille Geraet zur bestimmung einer blutgruppe.
US4837049A (en) * 1986-06-17 1989-06-06 Alfred E. Mann Foundation For Scientific Research Method of making an electrode array
SE469911B (sv) * 1988-12-14 1993-10-04 Wave Energy Dev Braskamin, innefattande två förbränningsrum
GB8913450D0 (en) * 1989-06-12 1989-08-02 Philips Electronic Associated Electrical device manufacture,particularly infrared detector arrays
US5031621A (en) * 1989-12-06 1991-07-16 Grandjean Pierre A Nerve electrode with biological substrate
EP0475027A1 (de) * 1990-08-02 1992-03-18 Siemens Aktiengesellschaft Elektroden für implantierbare Defibrillatoren
EP0612538A3 (de) * 1993-02-22 1995-04-05 Cardiac Pacemakers Inc Metallisierte Herzelektrode.
BE1008384A3 (nl) * 1994-05-24 1996-04-02 Koninkl Philips Electronics Nv Werkwijze voor het vervaardigen van halfgeleiderinrichtingen met halfgeleiderelementen gevormd in een op een dragerplak aangebrachte laag halfgeleidermateriaal.

Also Published As

Publication number Publication date
AU714520B2 (en) 2000-01-06
EP0888701B1 (de) 2007-10-03
EP0888701A1 (de) 1999-01-07
CA2246057C (en) 2005-12-20
AU4476296A (en) 1997-08-22
EP0888701A4 (de) 2004-11-10
CA2246057A1 (en) 1997-08-07
US5720099A (en) 1998-02-24
WO1997028668A1 (en) 1997-08-07

Similar Documents

Publication Publication Date Title
ATE375070T1 (de) Dünnfilm-herstellungstechnik für implantierbare elektroden
DE69603857T2 (de) Herstellungsverfahren und vorrichtung für einen lichtschalter mit ebenen beugungsgitter
TW370695B (en) Semiconductor device and manufacturing method and testing method of the same
EP0883191A3 (de) Elektrolumineszente Vorrichtung, elektrolumineszentes Gerät, und deren Herstellungsverfahren
DE59707974D1 (de) Piezoelektrisches element sowie verfahren zu dessen herstellung
TR200002648T2 (tr) Elektrolüminesan cihaz ve bu cihazı imal etme yöntemi
KR950034858A (ko) 광기전력 소자, 그의 전극 구조 및 그의 제조방법
ATE43028T1 (de) Verfahren zum herstellen einer schichtstruktur.
ES2193740T3 (es) Elemento calefactor con superficie resistiva.
IT8667328A1 (it) Composizione applicabile ad un cristallo di autoveicolo per realizzare una griglia elettroconduttiva, cristallo rivestito con tale composizione e procedimento per la realizzazione di una griglia elettroconduttiva su un cristallo.
TW357418B (en) Column grid array for semiconductor packaging and method
DE69715544D1 (de) Ohmscher Kontakt zu einer n-leitenden GaN-artigen Halbleiterverbindung und dessen Herstellungsmethode
ES2143227T3 (es) Electrodo.
DE3785750T2 (de) Elektrische widerstaende, elektrische widerstandspaste und herstellungsverfahren.
DK1240681T3 (da) Substratunderstöttet elektrode-elektrolyt-enhed
TW327254B (en) An apparatus and method for electrostatic discharge protection with improved current dispersion
TW200514194A (en) Multi-layered complementary wire structure and manufacturing method thereof
JPS54102990A (en) Optical sensor array and its manufacture
TW340969B (en) Evaluation and testing method of semiconductor stripping and the evaluation method of the testing structure
JPS57181161A (en) Transistor
DE69704892D1 (de) Poröses Nickelelektrodesubstrat
TW334570B (en) Method for arranging power lines of semiconductor memory device
DE59708447D1 (de) Diagnoseverfahren für elektrische geräte
DE3575066D1 (de) Elektrolumineszenzlampe.
DE68914266D1 (de) Litzendraht für Gleichstrom unter Hochspannung.

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 0888701

Country of ref document: EP