ATE352855T1 - Mikromechanisches relais mit anorganischer isolierung - Google Patents

Mikromechanisches relais mit anorganischer isolierung

Info

Publication number
ATE352855T1
ATE352855T1 AT03774954T AT03774954T ATE352855T1 AT E352855 T1 ATE352855 T1 AT E352855T1 AT 03774954 T AT03774954 T AT 03774954T AT 03774954 T AT03774954 T AT 03774954T AT E352855 T1 ATE352855 T1 AT E352855T1
Authority
AT
Austria
Prior art keywords
inorganic insulation
micromechanical relay
contact
micromechanical
relay
Prior art date
Application number
AT03774954T
Other languages
English (en)
Inventor
Sumit Majumder
Richard Morrison
Kenneth Skrobis
Original Assignee
Analog Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Analog Devices Inc filed Critical Analog Devices Inc
Application granted granted Critical
Publication of ATE352855T1 publication Critical patent/ATE352855T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
AT03774954T 2002-10-25 2003-10-27 Mikromechanisches relais mit anorganischer isolierung ATE352855T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42116202P 2002-10-25 2002-10-25

Publications (1)

Publication Number Publication Date
ATE352855T1 true ATE352855T1 (de) 2007-02-15

Family

ID=32176676

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03774954T ATE352855T1 (de) 2002-10-25 2003-10-27 Mikromechanisches relais mit anorganischer isolierung

Country Status (8)

Country Link
US (1) US7075393B2 (de)
EP (1) EP1556877B1 (de)
JP (1) JP4109675B2 (de)
CN (1) CN100346438C (de)
AT (1) ATE352855T1 (de)
AU (1) AU2003283022A1 (de)
DE (1) DE60311504T2 (de)
WO (1) WO2004038751A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060232365A1 (en) 2002-10-25 2006-10-19 Sumit Majumder Micro-machined relay
US7504841B2 (en) * 2005-05-17 2009-03-17 Analog Devices, Inc. High-impedance attenuator
US8022554B2 (en) 2006-06-15 2011-09-20 Sitime Corporation Stacked die package for MEMS resonator system
US7642657B2 (en) * 2006-12-21 2010-01-05 Analog Devices, Inc. Stacked MEMS device
JP2008155342A (ja) * 2006-12-26 2008-07-10 Nippon Telegr & Teleph Corp <Ntt> 微細構造体の製造方法
US8217738B2 (en) * 2007-05-17 2012-07-10 Panasonic Corporation Electromechanical element, driving method of the electromechanical element and electronic equipment provided with the same
JP5098770B2 (ja) * 2008-04-10 2012-12-12 富士通株式会社 スイッチング素子製造方法およびスイッチング素子
JP2012086315A (ja) * 2010-10-20 2012-05-10 Nippon Telegr & Teleph Corp <Ntt> 微細可動構造体の製造方法および微細可動構造体
US9505611B1 (en) * 2015-07-30 2016-11-29 Global Foundries Inc. Integration of electromechanical and CMOS devices in front-end-of-line using replacement metal gate process flow
CN108584864B (zh) * 2018-04-16 2019-08-09 大连理工大学 一种基于聚酰亚胺的柔性静电驱动mems继电器的制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5638946A (en) * 1996-01-11 1997-06-17 Northeastern University Micromechanical switch with insulated switch contact
US6094116A (en) * 1996-08-01 2000-07-25 California Institute Of Technology Micro-electromechanical relays
EP0924730A1 (de) * 1997-12-15 1999-06-23 Trw Inc. Beschleunigungsschalter
US6153839A (en) * 1998-10-22 2000-11-28 Northeastern University Micromechanical switching devices
JP3119255B2 (ja) * 1998-12-22 2000-12-18 日本電気株式会社 マイクロマシンスイッチおよびその製造方法
US6307452B1 (en) * 1999-09-16 2001-10-23 Motorola, Inc. Folded spring based micro electromechanical (MEM) RF switch
WO2001043153A1 (en) * 1999-12-10 2001-06-14 Koninklijke Philips Electronics N.V. Electronic devices including micromechanical switches
US7095309B1 (en) * 2000-10-20 2006-08-22 Silverbrook Research Pty Ltd Thermoelastic actuator design
US20020096421A1 (en) * 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
US20020146919A1 (en) 2000-12-29 2002-10-10 Cohn Michael B. Micromachined springs for strain relieved electrical connections to IC chips
US6531668B1 (en) * 2001-08-30 2003-03-11 Intel Corporation High-speed MEMS switch with high-resonance-frequency beam
US20030080839A1 (en) * 2001-10-31 2003-05-01 Wong Marvin Glenn Method for improving the power handling capacity of MEMS switches

Also Published As

Publication number Publication date
EP1556877B1 (de) 2007-01-24
AU2003283022A1 (en) 2004-05-13
DE60311504T2 (de) 2007-10-31
JP2006504243A (ja) 2006-02-02
CN1708821A (zh) 2005-12-14
CN100346438C (zh) 2007-10-31
WO2004038751A1 (en) 2004-05-06
JP4109675B2 (ja) 2008-07-02
EP1556877A1 (de) 2005-07-27
US20040196124A1 (en) 2004-10-07
US7075393B2 (en) 2006-07-11
DE60311504D1 (de) 2007-03-15

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Legal Events

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