ATE318945T1 - Scheibengalvanisiervorrichtung - Google Patents

Scheibengalvanisiervorrichtung

Info

Publication number
ATE318945T1
ATE318945T1 AT04016833T AT04016833T ATE318945T1 AT E318945 T1 ATE318945 T1 AT E318945T1 AT 04016833 T AT04016833 T AT 04016833T AT 04016833 T AT04016833 T AT 04016833T AT E318945 T1 ATE318945 T1 AT E318945T1
Authority
AT
Austria
Prior art keywords
sealing ring
disc
galvanizing device
siphon
metallized
Prior art date
Application number
AT04016833T
Other languages
English (en)
Inventor
Juergen Gutekunst
Vasile-Adrian Bojan
Original Assignee
Rena Sondermaschinen Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena Sondermaschinen Gmbh filed Critical Rena Sondermaschinen Gmbh
Application granted granted Critical
Publication of ATE318945T1 publication Critical patent/ATE318945T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Medicines Containing Plant Substances (AREA)
  • Medicinal Preparation (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
AT04016833T 2003-07-19 2004-07-16 Scheibengalvanisiervorrichtung ATE318945T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10333068A DE10333068A1 (de) 2003-07-19 2003-07-19 Scheibengalvanikvorrichtung

Publications (1)

Publication Number Publication Date
ATE318945T1 true ATE318945T1 (de) 2006-03-15

Family

ID=34042003

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04016833T ATE318945T1 (de) 2003-07-19 2004-07-16 Scheibengalvanisiervorrichtung

Country Status (6)

Country Link
US (1) US20050045473A1 (de)
EP (1) EP1510601B9 (de)
CN (1) CN100339511C (de)
AT (1) ATE318945T1 (de)
CA (1) CA2474830A1 (de)
DE (2) DE10333068A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130306465A1 (en) * 2012-05-17 2013-11-21 Applied Materials, Inc. Seal rings in electrochemical processors
JP6713916B2 (ja) * 2016-12-01 2020-06-24 株式会社荏原製作所 基板ホルダ、めっき装置、及び基板ホルダの製造方法
CN109158713B (zh) * 2018-09-27 2024-05-07 格林美（武汉）城市矿产循环产业园开发有限公司 一种继电器螺纹微镀修复定位装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5405518A (en) * 1994-04-26 1995-04-11 Industrial Technology Research Institute Workpiece holder apparatus
JP3578811B2 (ja) * 1994-10-12 2004-10-20 シチズン時計株式会社 半導体ウエハーのメッキ方法
US5578167A (en) * 1996-01-31 1996-11-26 Motorola, Inc. Substrate holder and method of use
JP3106418B2 (ja) * 1996-07-30 2000-11-06 株式会社東京精密 研磨装置
JP3366193B2 (ja) * 1996-09-10 2003-01-14 ヤマハ発動機株式会社 表面処理装置におけるシール装置
US6080291A (en) * 1998-07-10 2000-06-27 Semitool, Inc. Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6228233B1 (en) * 1998-11-30 2001-05-08 Applied Materials, Inc. Inflatable compliant bladder assembly
DE19923871C2 (de) * 1999-05-25 2003-11-13 Rossendorf Forschzent Einrichtung zur abgedichteten Halterung dünner Scheiben
US6673216B2 (en) * 1999-08-31 2004-01-06 Semitool, Inc. Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
JP2001158993A (ja) * 1999-11-30 2001-06-12 Honda Motor Co Ltd 筒状部材のメッキ装置
JP2001260065A (ja) * 2000-03-17 2001-09-25 Advantest Corp 部品保持装置
US6685815B2 (en) * 2002-01-14 2004-02-03 Applied Materials Inc. Electroplating of semiconductor wafers
US7147232B2 (en) * 2003-06-30 2006-12-12 Hydra-Lock Corporation Workpiece holder

Also Published As

Publication number Publication date
DE502004000318D1 (de) 2006-04-27
EP1510601B9 (de) 2006-11-15
EP1510601A1 (de) 2005-03-02
EP1510601B1 (de) 2006-03-01
CN1614100A (zh) 2005-05-11
US20050045473A1 (en) 2005-03-03
CN100339511C (zh) 2007-09-26
CA2474830A1 (en) 2005-01-19
DE10333068A1 (de) 2005-02-10

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee