ATE311620T1 - Beleuchtungssystem mit einer eine transparente struktur aufweisenden vakuumkammerwand - Google Patents

Beleuchtungssystem mit einer eine transparente struktur aufweisenden vakuumkammerwand

Info

Publication number
ATE311620T1
ATE311620T1 AT01272772T AT01272772T ATE311620T1 AT E311620 T1 ATE311620 T1 AT E311620T1 AT 01272772 T AT01272772 T AT 01272772T AT 01272772 T AT01272772 T AT 01272772T AT E311620 T1 ATE311620 T1 AT E311620T1
Authority
AT
Austria
Prior art keywords
vacuum chamber
radiation
chamber wall
lighting system
radiation source
Prior art date
Application number
AT01272772T
Other languages
English (en)
Inventor
Hugo M Visser
Levinus P Bakker
Jeroen Jonkers
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE311620T1 publication Critical patent/ATE311620T1/de

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70033Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/7015Details of optical elements
    • G03F7/70166Capillary or channel elements, e.g. nested extreme ultraviolet [EUV] mirrors or shells, optical fibers or light guides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Chemical & Material Sciences (AREA)
  • Public Health (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT01272772T 2001-01-03 2001-12-24 Beleuchtungssystem mit einer eine transparente struktur aufweisenden vakuumkammerwand ATE311620T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/752,818 US6576912B2 (en) 2001-01-03 2001-01-03 Lithographic projection apparatus equipped with extreme ultraviolet window serving simultaneously as vacuum window
PCT/IB2001/002710 WO2002054153A1 (en) 2001-01-03 2001-12-24 Illumination system with vacuum chamber wall having transparent structure

Publications (1)

Publication Number Publication Date
ATE311620T1 true ATE311620T1 (de) 2005-12-15

Family

ID=25027984

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01272772T ATE311620T1 (de) 2001-01-03 2001-12-24 Beleuchtungssystem mit einer eine transparente struktur aufweisenden vakuumkammerwand

Country Status (8)

Country Link
US (1) US6576912B2 (de)
EP (1) EP1350141B1 (de)
JP (1) JP2004517485A (de)
KR (1) KR20020077521A (de)
AT (1) ATE311620T1 (de)
DE (1) DE60115495T2 (de)
TW (1) TWI237741B (de)
WO (1) WO2002054153A1 (de)

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US7346093B2 (en) * 2000-11-17 2008-03-18 Cymer, Inc. DUV light source optical element improvements
US6576912B2 (en) * 2001-01-03 2003-06-10 Hugo M. Visser Lithographic projection apparatus equipped with extreme ultraviolet window serving simultaneously as vacuum window
US7439530B2 (en) * 2005-06-29 2008-10-21 Cymer, Inc. LPP EUV light source drive laser system
US7372056B2 (en) * 2005-06-29 2008-05-13 Cymer, Inc. LPP EUV plasma source material target delivery system
US7405416B2 (en) 2005-02-25 2008-07-29 Cymer, Inc. Method and apparatus for EUV plasma source target delivery
US7598509B2 (en) * 2004-11-01 2009-10-06 Cymer, Inc. Laser produced plasma EUV light source
US7465946B2 (en) * 2004-03-10 2008-12-16 Cymer, Inc. Alternative fuels for EUV light source
US7378673B2 (en) * 2005-02-25 2008-05-27 Cymer, Inc. Source material dispenser for EUV light source
US7671349B2 (en) * 2003-04-08 2010-03-02 Cymer, Inc. Laser produced plasma EUV light source
KR100589236B1 (ko) * 2002-08-15 2006-06-14 에이에스엠엘 네델란즈 비.브이. 리소그래피 투영장치 및 상기 장치에 사용하는 반사기조립체
CN1495531B (zh) * 2002-08-23 2010-05-26 Asml荷兰有限公司 光刻投射装置及用于所述装置中的粒子屏障
US6770895B2 (en) * 2002-11-21 2004-08-03 Asml Holding N.V. Method and apparatus for isolating light source gas from main chamber gas in a lithography tool
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EP1434098B1 (de) * 2002-12-23 2006-03-08 ASML Netherlands B.V. Kontaminationsschutz mit ausdehnbaren Lamellen
TWI255394B (en) * 2002-12-23 2006-05-21 Asml Netherlands Bv Lithographic apparatus with debris suppression means and device manufacturing method
CN100476585C (zh) 2002-12-23 2009-04-08 Asml荷兰有限公司 具有可扩展薄片的杂质屏蔽
TWI275325B (en) * 2003-03-08 2007-03-01 Cymer Inc Discharge produced plasma EUV light source
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US7217941B2 (en) * 2003-04-08 2007-05-15 Cymer, Inc. Systems and methods for deflecting plasma-generated ions to prevent the ions from reaching an internal component of an EUV light source
US7217940B2 (en) * 2003-04-08 2007-05-15 Cymer, Inc. Collector for EUV light source
US20060146906A1 (en) * 2004-02-18 2006-07-06 Cymer, Inc. LLP EUV drive laser
US7193228B2 (en) 2004-03-10 2007-03-20 Cymer, Inc. EUV light source optical elements
US7164144B2 (en) * 2004-03-10 2007-01-16 Cymer Inc. EUV light source
US8075732B2 (en) * 2004-11-01 2011-12-13 Cymer, Inc. EUV collector debris management
US7087914B2 (en) * 2004-03-17 2006-08-08 Cymer, Inc High repetition rate laser produced plasma EUV light source
US7196342B2 (en) * 2004-03-10 2007-03-27 Cymer, Inc. Systems and methods for reducing the influence of plasma-generated debris on the internal components of an EUV light source
WO2005096099A2 (en) 2004-03-31 2005-10-13 Philips Intellectual Property & Standards Gmbh Removal of particles generated by a radiation source
US7050237B2 (en) * 2004-06-02 2006-05-23 The Regents Of The University Of California High-efficiency spectral purity filter for EUV lithography
US7307263B2 (en) 2004-07-14 2007-12-11 Asml Netherlands B.V. Lithographic apparatus, radiation system, contaminant trap, device manufacturing method, and method for trapping contaminants in a contaminant trap
US7109503B1 (en) * 2005-02-25 2006-09-19 Cymer, Inc. Systems for protecting internal components of an EUV light source from plasma-generated debris
US7355191B2 (en) * 2004-11-01 2008-04-08 Cymer, Inc. Systems and methods for cleaning a chamber window of an EUV light source
US7361911B2 (en) * 2004-12-09 2008-04-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7211810B2 (en) * 2004-12-29 2007-05-01 Asml Netherlands B.V. Method for the protection of an optical element, lithographic apparatus, and device manufacturing method
US7868304B2 (en) * 2005-02-07 2011-01-11 Asml Netherlands B.V. Method for removal of deposition on an optical element, lithographic apparatus, device manufacturing method, and device manufactured thereby
US7449703B2 (en) * 2005-02-25 2008-11-11 Cymer, Inc. Method and apparatus for EUV plasma source target delivery target material handling
US7482609B2 (en) * 2005-02-28 2009-01-27 Cymer, Inc. LPP EUV light source drive laser system
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US7385673B2 (en) * 2005-06-10 2008-06-10 International Business Machines Corporation Immersion lithography with equalized pressure on at least projection optics component and wafer
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Also Published As

Publication number Publication date
DE60115495D1 (de) 2006-01-05
DE60115495T2 (de) 2006-08-03
EP1350141B1 (de) 2005-11-30
TWI237741B (en) 2005-08-11
JP2004517485A (ja) 2004-06-10
US20020084428A1 (en) 2002-07-04
EP1350141A1 (de) 2003-10-08
KR20020077521A (ko) 2002-10-11
US6576912B2 (en) 2003-06-10
WO2002054153A1 (en) 2002-07-11

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